GB0508415D0 - A package for beamlead semiconductor devices - Google Patents

A package for beamlead semiconductor devices

Info

Publication number
GB0508415D0
GB0508415D0 GB0508415A GB0508415A GB0508415D0 GB 0508415 D0 GB0508415 D0 GB 0508415D0 GB 0508415 A GB0508415 A GB 0508415A GB 0508415 A GB0508415 A GB 0508415A GB 0508415 D0 GB0508415 D0 GB 0508415D0
Authority
GB
United Kingdom
Prior art keywords
beamlead
package
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0508415A
Other versions
GB2425651A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telent GmbH
Original Assignee
Marconi Communications GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Communications GmbH filed Critical Marconi Communications GmbH
Priority to GB0508415A priority Critical patent/GB2425651A/en
Publication of GB0508415D0 publication Critical patent/GB0508415D0/en
Priority to PCT/EP2006/061788 priority patent/WO2006114406A1/en
Publication of GB2425651A publication Critical patent/GB2425651A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packaging Frangible Articles (AREA)
GB0508415A 2005-04-27 2005-04-27 A package for beamlead semiconductor devices Withdrawn GB2425651A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0508415A GB2425651A (en) 2005-04-27 2005-04-27 A package for beamlead semiconductor devices
PCT/EP2006/061788 WO2006114406A1 (en) 2005-04-27 2006-04-24 A package for beamlead semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0508415A GB2425651A (en) 2005-04-27 2005-04-27 A package for beamlead semiconductor devices

Publications (2)

Publication Number Publication Date
GB0508415D0 true GB0508415D0 (en) 2005-06-01
GB2425651A GB2425651A (en) 2006-11-01

Family

ID=34640143

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0508415A Withdrawn GB2425651A (en) 2005-04-27 2005-04-27 A package for beamlead semiconductor devices

Country Status (2)

Country Link
GB (1) GB2425651A (en)
WO (1) WO2006114406A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5325654A (en) * 1992-06-19 1994-07-05 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
JPH1149276A (en) * 1997-08-07 1999-02-23 Sumitomo Kinzoku Electro Device:Kk Ic package substrate holding body
GB9818474D0 (en) * 1998-08-26 1998-10-21 Hughes John E Multi-layer interconnect package for optical devices & standard semiconductor chips
US6784409B2 (en) * 2000-03-28 2004-08-31 Canon Kabushiki Kaisha Electronic device with encapsulant of photo-set resin and production process of same
JP2002305261A (en) * 2001-01-10 2002-10-18 Canon Inc Electronic component and its manufacturing method
US6443179B1 (en) * 2001-02-21 2002-09-03 Sandia Corporation Packaging of electro-microfluidic devices
JP3424676B2 (en) * 2001-06-25 2003-07-07 セイコーエプソン株式会社 Semiconductor device storage container and method of transporting the same
JP2004284601A (en) * 2003-03-19 2004-10-14 Renesas Technology Corp Method for carrying, mounting and packaging semi-conductor device, and method for reusing stored article

Also Published As

Publication number Publication date
WO2006114406A1 (en) 2006-11-02
GB2425651A (en) 2006-11-01

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)