GB0427160D0 - Method for closing perforated membranes - Google Patents
Method for closing perforated membranesInfo
- Publication number
- GB0427160D0 GB0427160D0 GBGB0427160.7A GB0427160A GB0427160D0 GB 0427160 D0 GB0427160 D0 GB 0427160D0 GB 0427160 A GB0427160 A GB 0427160A GB 0427160 D0 GB0427160 D0 GB 0427160D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- perforated membranes
- closing
- closing perforated
- membranes
- perforated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012528 membrane Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0111—Bulk micromachining
- B81C2201/0115—Porous silicon
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004015442A DE102004015442A1 (en) | 2004-03-30 | 2004-03-30 | Method of closing perforated membranes |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0427160D0 true GB0427160D0 (en) | 2005-01-12 |
GB2415828A GB2415828A (en) | 2006-01-04 |
GB2415828B GB2415828B (en) | 2006-06-28 |
Family
ID=34072186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0427160A Expired - Fee Related GB2415828B (en) | 2004-03-30 | 2004-12-10 | Method for closing perforated membranes |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005279928A (en) |
DE (1) | DE102004015442A1 (en) |
FR (1) | FR2868412A1 (en) |
GB (1) | GB2415828B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017210459A1 (en) * | 2017-06-22 | 2018-12-27 | Robert Bosch Gmbh | Micromechanical device with a first cavity and a second cavity |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0750789B2 (en) * | 1986-07-18 | 1995-05-31 | 日産自動車株式会社 | Method for manufacturing semiconductor pressure converter |
DE19961578A1 (en) * | 1999-12-21 | 2001-06-28 | Bosch Gmbh Robert | Sensor comprises a micromechanical structure based on silicon integrated in the sensor chamber of a base wafer and a cover made of a transparent deposition layer and a sealing layer |
DE10053326A1 (en) * | 2000-10-27 | 2002-05-08 | Bosch Gmbh Robert | Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support |
FI112644B (en) * | 2000-11-10 | 2003-12-31 | Vaisala Oyj | Surface micromechanical absolute pressure sensor and method of manufacture thereof |
DE10064494A1 (en) * | 2000-12-22 | 2002-07-04 | Bosch Gmbh Robert | Method for producing a semiconductor component and a semiconductor component produced by the method, the semiconductor component in particular having a movable mass |
DE10065026A1 (en) * | 2000-12-23 | 2002-07-04 | Bosch Gmbh Robert | Micromechanical component and corresponding manufacturing method |
DE10117486A1 (en) * | 2001-04-07 | 2002-10-17 | Bosch Gmbh Robert | Method for producing a semiconductor component and a semiconductor component produced using the method |
GR1004106B (en) * | 2002-01-24 | 2003-01-13 | Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης | Low power silicon thermal sensors and microfluidic devices based on the use of porous silicon sealed air cavity technology or microchannel technology |
-
2004
- 2004-03-30 DE DE102004015442A patent/DE102004015442A1/en not_active Withdrawn
- 2004-12-10 GB GB0427160A patent/GB2415828B/en not_active Expired - Fee Related
-
2005
- 2005-03-24 FR FR0550765A patent/FR2868412A1/en active Pending
- 2005-03-30 JP JP2005099338A patent/JP2005279928A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
GB2415828A (en) | 2006-01-04 |
FR2868412A1 (en) | 2005-10-07 |
GB2415828B (en) | 2006-06-28 |
JP2005279928A (en) | 2005-10-13 |
DE102004015442A1 (en) | 2005-10-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20121210 |