GB2415828B - Method for closing perforated membranes - Google Patents

Method for closing perforated membranes

Info

Publication number
GB2415828B
GB2415828B GB0427160A GB0427160A GB2415828B GB 2415828 B GB2415828 B GB 2415828B GB 0427160 A GB0427160 A GB 0427160A GB 0427160 A GB0427160 A GB 0427160A GB 2415828 B GB2415828 B GB 2415828B
Authority
GB
United Kingdom
Prior art keywords
perforated membranes
closing
closing perforated
membranes
perforated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0427160A
Other versions
GB0427160D0 (en
GB2415828A (en
Inventor
Thorsten Pannek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB0427160D0 publication Critical patent/GB0427160D0/en
Publication of GB2415828A publication Critical patent/GB2415828A/en
Application granted granted Critical
Publication of GB2415828B publication Critical patent/GB2415828B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0115—Porous silicon
GB0427160A 2004-03-30 2004-12-10 Method for closing perforated membranes Expired - Fee Related GB2415828B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE200410015442 DE102004015442A1 (en) 2004-03-30 2004-03-30 Method of closing perforated membranes

Publications (3)

Publication Number Publication Date
GB0427160D0 GB0427160D0 (en) 2005-01-12
GB2415828A GB2415828A (en) 2006-01-04
GB2415828B true GB2415828B (en) 2006-06-28

Family

ID=34072186

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0427160A Expired - Fee Related GB2415828B (en) 2004-03-30 2004-12-10 Method for closing perforated membranes

Country Status (4)

Country Link
JP (1) JP2005279928A (en)
DE (1) DE102004015442A1 (en)
FR (1) FR2868412A1 (en)
GB (1) GB2415828B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017210459A1 (en) * 2017-06-22 2018-12-27 Robert Bosch Gmbh Micromechanical device with a first cavity and a second cavity

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838088A (en) * 1986-07-18 1989-06-13 Nissan Motor Co., Ltd. Pressure transducer and method for fabricating same
WO2001046066A2 (en) * 1999-12-21 2001-06-28 Robert Bosch Gmbh Sensor with at least one micromechanical structure and method for the production thereof
WO2002051742A2 (en) * 2000-12-23 2002-07-04 Robert Bosch Gmbh Micromechanical component and corresponding production method
WO2002051741A2 (en) * 2000-12-22 2002-07-04 Robert Bosch Gmbh Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
WO2002081363A2 (en) * 2001-04-07 2002-10-17 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced according to this method
WO2003062134A1 (en) * 2002-01-24 2003-07-31 Ncsr 'demokritos' 'low power silicon thermal sensors and microfluidic devices based on the use of porous silicon sealed air cavity technology or microchannel technology'

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10053326A1 (en) * 2000-10-27 2002-05-08 Bosch Gmbh Robert Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support
FI112644B (en) * 2000-11-10 2003-12-31 Vaisala Oyj Surface micromechanical absolute pressure sensor and method of manufacture thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4838088A (en) * 1986-07-18 1989-06-13 Nissan Motor Co., Ltd. Pressure transducer and method for fabricating same
WO2001046066A2 (en) * 1999-12-21 2001-06-28 Robert Bosch Gmbh Sensor with at least one micromechanical structure and method for the production thereof
WO2002051741A2 (en) * 2000-12-22 2002-07-04 Robert Bosch Gmbh Method for producing a semiconductor component having a movable mass in particular, and semiconductor component produced according to this method
WO2002051742A2 (en) * 2000-12-23 2002-07-04 Robert Bosch Gmbh Micromechanical component and corresponding production method
WO2002081363A2 (en) * 2001-04-07 2002-10-17 Robert Bosch Gmbh Method for producing a semiconductor component and a semiconductor component produced according to this method
WO2003062134A1 (en) * 2002-01-24 2003-07-31 Ncsr 'demokritos' 'low power silicon thermal sensors and microfluidic devices based on the use of porous silicon sealed air cavity technology or microchannel technology'

Also Published As

Publication number Publication date
JP2005279928A (en) 2005-10-13
GB0427160D0 (en) 2005-01-12
DE102004015442A1 (en) 2005-10-20
GB2415828A (en) 2006-01-04
FR2868412A1 (en) 2005-10-07

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20121210