GB0002784D0 - Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device - Google Patents

Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device

Info

Publication number
GB0002784D0
GB0002784D0 GBGB0002784.7A GB0002784A GB0002784D0 GB 0002784 D0 GB0002784 D0 GB 0002784D0 GB 0002784 A GB0002784 A GB 0002784A GB 0002784 D0 GB0002784 D0 GB 0002784D0
Authority
GB
United Kingdom
Prior art keywords
heat
dissipating device
housing
manufacturing
dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0002784.7A
Other versions
GB2358916B (en
GB2358916A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sunonwealth Electric Machine Industry Co Ltd
Original Assignee
Sunonwealth Electric Machine Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP34706399A priority Critical patent/JP2001177020A/en
Application filed by Sunonwealth Electric Machine Industry Co Ltd filed Critical Sunonwealth Electric Machine Industry Co Ltd
Priority to GB0002784A priority patent/GB2358916B/en
Priority to DE10007828A priority patent/DE10007828A1/en
Priority to FR0003035A priority patent/FR2806154B1/en
Publication of GB0002784D0 publication Critical patent/GB0002784D0/en
Publication of GB2358916A publication Critical patent/GB2358916A/en
Application granted granted Critical
Publication of GB2358916B publication Critical patent/GB2358916B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB0002784A 1999-12-07 2000-02-07 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device Expired - Fee Related GB2358916B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP34706399A JP2001177020A (en) 1999-12-07 1999-12-07 Radiator and manufacturing method of heat sink
GB0002784A GB2358916B (en) 1999-12-07 2000-02-07 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
DE10007828A DE10007828A1 (en) 1999-12-07 2000-02-21 Heat dissipating device has housing that includes central area and fins, with slit formed in between each two adjacent fins, and mounting plate with fan that is secured to housing
FR0003035A FR2806154B1 (en) 1999-12-07 2000-03-09 HEAT RADIATION DEVICE AND METHOD FOR MANUFACTURING A HOUSING OF THE HEAT RADIATION DEVICE

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP34706399A JP2001177020A (en) 1999-12-07 1999-12-07 Radiator and manufacturing method of heat sink
GB0002784A GB2358916B (en) 1999-12-07 2000-02-07 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device
DE10007828A DE10007828A1 (en) 1999-12-07 2000-02-21 Heat dissipating device has housing that includes central area and fins, with slit formed in between each two adjacent fins, and mounting plate with fan that is secured to housing
FR0003035A FR2806154B1 (en) 1999-12-07 2000-03-09 HEAT RADIATION DEVICE AND METHOD FOR MANUFACTURING A HOUSING OF THE HEAT RADIATION DEVICE

Publications (3)

Publication Number Publication Date
GB0002784D0 true GB0002784D0 (en) 2000-03-29
GB2358916A GB2358916A (en) 2001-08-08
GB2358916B GB2358916B (en) 2003-07-09

Family

ID=27437777

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0002784A Expired - Fee Related GB2358916B (en) 1999-12-07 2000-02-07 Heat-dissipating device and method for manufacturing a housing of the heat-dissipating device

Country Status (4)

Country Link
JP (1) JP2001177020A (en)
DE (1) DE10007828A1 (en)
FR (1) FR2806154B1 (en)
GB (1) GB2358916B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2379266B (en) * 2001-08-29 2005-10-19 Sunonwealth Electr Mach Ind Co Heat dissipating device
CN106704846A (en) * 2016-12-15 2017-05-24 厦门格绿能光电股份有限公司 Cooling device of LED lamp
JP7380170B2 (en) * 2019-12-16 2023-11-15 ブラザー工業株式会社 Head module with heat sink with fan
JP7490952B2 (en) * 2019-12-16 2024-05-28 ブラザー工業株式会社 Head unit having a buffer chamber
JP7424029B2 (en) * 2019-12-16 2024-01-30 ブラザー工業株式会社 head unit

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL121811C (en) * 1961-06-26
GB8700842D0 (en) * 1987-01-15 1987-02-18 Marston Palmer Ltd Heat sink
JPH0410558A (en) * 1990-04-27 1992-01-14 Hitachi Ltd Semiconductor device provided with heat dissipating body
JPH04343253A (en) * 1991-05-20 1992-11-30 Fujitsu Ltd Heat dissipating fin mounting structure of ic
US5367433A (en) * 1993-09-27 1994-11-22 Blomquist Michael L Package clip on heat sink
US5566749A (en) * 1994-04-12 1996-10-22 Thermalloy, Inc. Stamped and formed heat sink
US5504652A (en) * 1994-09-16 1996-04-02 Apple Computer, Inc. Unitary heat sink for integrated circuits
JP3771311B2 (en) * 1996-02-17 2006-04-26 株式会社アライ Electrical radiator
JPH10173108A (en) * 1996-12-09 1998-06-26 Akuteii:Kk Heat sink for semiconductor element

Also Published As

Publication number Publication date
FR2806154B1 (en) 2002-08-02
GB2358916B (en) 2003-07-09
GB2358916A (en) 2001-08-08
DE10007828A1 (en) 2001-08-23
FR2806154A1 (en) 2001-09-14
JP2001177020A (en) 2001-06-29

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20110207