SG81250A1 - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof

Info

Publication number
SG81250A1
SG81250A1 SG9804571A SG1998004571A SG81250A1 SG 81250 A1 SG81250 A1 SG 81250A1 SG 9804571 A SG9804571 A SG 9804571A SG 1998004571 A SG1998004571 A SG 1998004571A SG 81250 A1 SG81250 A1 SG 81250A1
Authority
SG
Singapore
Prior art keywords
manufacturing
semiconductor device
semiconductor
Prior art date
Application number
SG9804571A
Inventor
Kobayashi Hirotaka
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of SG81250A1 publication Critical patent/SG81250A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SG9804571A 1997-11-10 1998-11-07 Semiconductor device and manufacturing method thereof SG81250A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9307643A JPH11145188A (en) 1997-11-10 1997-11-10 Semiconductor device and manufacture of the same

Publications (1)

Publication Number Publication Date
SG81250A1 true SG81250A1 (en) 2001-06-19

Family

ID=17971520

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9804571A SG81250A1 (en) 1997-11-10 1998-11-07 Semiconductor device and manufacturing method thereof

Country Status (2)

Country Link
JP (1) JPH11145188A (en)
SG (1) SG81250A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6395994B1 (en) * 2000-01-31 2002-05-28 Visteon Global Technologies, Inc. Etched tri-metal with integrated wire traces for wire bonding
JP2007173363A (en) * 2005-12-20 2007-07-05 Fujitsu Ltd Bonding method of flying lead
JP2007335632A (en) 2006-06-15 2007-12-27 Toyota Industries Corp Semiconductor device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494688A (en) * 1981-03-16 1985-01-22 Matsushita Electric Industrial Co., Ltd. Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
US4786545A (en) * 1986-02-28 1988-11-22 Seiko Epson Corporation Circuit substrate and method for forming bumps on the circuit substrate
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
JPH09129641A (en) * 1995-10-31 1997-05-16 Mitsumi Electric Co Ltd Bondability improving method of silicon nitride film/ aluminum interface

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4494688A (en) * 1981-03-16 1985-01-22 Matsushita Electric Industrial Co., Ltd. Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
US4786545A (en) * 1986-02-28 1988-11-22 Seiko Epson Corporation Circuit substrate and method for forming bumps on the circuit substrate
US5008997A (en) * 1988-09-16 1991-04-23 National Semiconductor Gold/tin eutectic bonding for tape automated bonding process
US4893742A (en) * 1988-12-21 1990-01-16 Hughes Aircraft Company Ultrasonic laser soldering
JPH09129641A (en) * 1995-10-31 1997-05-16 Mitsumi Electric Co Ltd Bondability improving method of silicon nitride film/ aluminum interface

Also Published As

Publication number Publication date
JPH11145188A (en) 1999-05-28

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