FR92275E - - Google Patents

Description

FRENCH REPUBLIC

1st ADDITION

MINISTRY OF INDUSTRY

THE PATENT OF INVENTION

N ° 1.512.793 P. V. n ° 9.682, Loire N ° 92.275

International classification: \ E 04 f

SERVICE I INDUSTRIAL PROPERTY

Method of laying mosaic wood floors, or other parquet

Mr. Jean BAROU residing in France (Loire).

(Main patent issued on February 24, 1967.)

Requested on March 29, 1967, at 1511 5m, in Saint-Etienne.

Issued by decree of September 9, 1968.

(Official Bulletin of Industrial Property, No. 42 of October 18, 1968.)

The French patent filed on February 24, 1967 under the number P.Y. 9.655 (Loire), it appeared necessary to increase the possibilities for implementing the process and generally to adapt this process for the installation and execution of parquet or floor with a tile or slab covering. obtained from plastic or other material.

According to a feature of the addition, the tiles are glued directly to the support panels made of very hard wood chipboard, which are assembled and arranged diagonally, preferably in opposition to the junction lines of the tiles arranged in parallel.

According to another characteristic, and in order to provide the tiles with a support plane of perfect planimetry without risk of deformation, all the support panels are assembled with respect to each other, in a rigid manner, by means of insert tongue or other junction element partially adjusted in the thickness of two consecutive panels and which extends over the entire length of the junction plane of the panels.

These and other features will match the description which follows.

To fix the purpose of the bill without limiting it in the attached drawing:

FIG. 1 is on a small scale a partial perspective view illustrating the placement of a covering in tiles or slabs according to the addition process;

Figure 2 is a sectional view corresponding to Figure 1.

Following the addition process, the original slab I of the construction remains raw and it is covered with a bed of sand 2 previously dried. This bed of sand of suitable thickness is extended and erected to give good planimetry and so as to compensate for the differences in level and irregularities of the slab 1.

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The sand surface 2 is covered with a sheet of tar paper P which prevents the rising of moisture from the sand 2 or from the slab I.

On the surface of the paper P are placed diagonally panels 3 of suitable thickness obtained preferably very hard wood chipboard. The panels 3 extend over the entire surface to be coated and by their diagonal arrangement the junction lines between the panels are opposite to those of the slabs or covering tiles arranged in parallel.

So that all the panels 3 constitute a surface of perfect planimetry, without risk of deformation, following the addition, provision has been made to ensure the reciprocal assembly of the panels between them and for this purpose a connecting tab 4 is attached. executed in plywood or any other material, which is fitted in a groove formed in the middle part of the thickness of the panels 3 over the entire length of the junction plane of each of said panels. This tongue makes it possible to obtain great rigidity over the entire surface obtained by assembling the panels 3, it also ensures their invariability so as to retain the perfect initial and essential planimetry for the coating to retain its original appearance. It is emphasized that the reciprocal connection between the panels 3 and over the entire length of their junction plane could be achieved in any other way, without going beyond the scope of the present addition.

On the perfectly flat surface obtained by assembling the panels 3, a layer of adhesive 5 of suitable quality is spread and the tiles 6 of the covering are then suitably positioned and fixed by gluing effect directly on the panels 3.

The tiles 6 are obtained for example from plastic or other material, they generally have a small thickness and can

[92.275 / 1.512.793]

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present any suitable form. The process following the addition makes it possible to ensure effective and safe bonding by seeking a perfect planimetry of the bonding surface without risk of subsequent deformation which is guaranteed by the rigid assembly between the panels 3.

The interest and advantages of the arrangements according to the addition are clearly apparent from the description and the drawing.

It is obvious that the panels 3 forming a support can also be arranged in parallel as a result of their assembly by the connecting tabs 4. In the same way for the installation of mosaic parquet floors according to the process covered by the patent. Initially, the panels 3 can also be assembled while being then arranged in parallel or diagonally.

As goes without saying and as already emerges from the foregoing, the addition is in no way limited to that of its modes of application nor to those of the embodiments of its various parts which have been more especially indicated; on the contrary, it embraces all the variants.

ABSTRACT

This addition relates to a process for laying mosaic parquet floors, or other parquet floors, which is characterized by:

1 ° The direct gluing of the slabs or tiles of plastic material or other material, on a perfectly flat surface obtained by the rigid assembly of very hard wood chipboard panels preferably arranged diagonally and resting on a sheet of paper paved spread over a bed of sand erected on the surface of the original slab of the construction;

2 ° According to 1 °, the panels in very hard wood chipboard have an appropriate thickness and their rigid assembly is ensured by means of an added tongue which is fitted in symmetrical and corresponding grooves formed over the entire length of the junction plane and at the middle part of the thickness of two consecutive panels;

3 ° The added tongue for assembling chipboard panels is made of plywood or other material;

4 ° The rigid assembly between the chipboard panels over the entire length of their reciprocal junction planes is obtained from any suitable material;

5 ° As a variant, the parallel arrangement of the panels of very hard wood chipboard, assembled together as above;

6 ° The very hard wood chipboard panels are assembled and arranged in parallel or diagonally, in the case of laying mosaic parquet floors, according to the process covered by the initial patent;

7 ° The combination of the characteristics of the patent and of this addition;

8 ° As new industrial products: coverings in slabs or tiles of plastic or other material, established according to the above characteristics taken together or separately.

Jean BAROU

Far proxy:

Cabinet Chassas

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