FR3130086B1 - Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur - Google Patents

Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur Download PDF

Info

Publication number
FR3130086B1
FR3130086B1 FR2113081A FR2113081A FR3130086B1 FR 3130086 B1 FR3130086 B1 FR 3130086B1 FR 2113081 A FR2113081 A FR 2113081A FR 2113081 A FR2113081 A FR 2113081A FR 3130086 B1 FR3130086 B1 FR 3130086B1
Authority
FR
France
Prior art keywords
photonic device
heat dissipation
laser source
thermal transfer
device provided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR2113081A
Other languages
English (en)
Other versions
FR3130086A1 (fr
Inventor
Sylvie Menezo
Frédéric Mazur
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Scintil Photonics SAS
Original Assignee
Scintil Photonics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Scintil Photonics SAS filed Critical Scintil Photonics SAS
Priority to FR2113081A priority Critical patent/FR3130086B1/fr
Priority to EP22801479.1A priority patent/EP4423864A1/fr
Priority to PCT/EP2022/078525 priority patent/WO2023072610A1/fr
Priority to CN202280069438.8A priority patent/CN118104089A/zh
Publication of FR3130086A1 publication Critical patent/FR3130086A1/fr
Application granted granted Critical
Publication of FR3130086B1 publication Critical patent/FR3130086B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
    • H01S5/021—Silicon based substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0421—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers
    • H01S5/0422—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer
    • H01S5/0424—Electrical excitation ; Circuits therefor characterised by the semiconducting contacting layers with n- and p-contacts on the same side of the active layer lateral current injection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
    • H01S5/042—Electrical excitation ; Circuits therefor
    • H01S5/0425—Electrodes, e.g. characterised by the structure
    • H01S5/04254—Electrodes, e.g. characterised by the structure characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/1028—Coupling to elements in the cavity, e.g. coupling to waveguides adjacent the active region, e.g. forward coupled [DFC] structures
    • H01S5/1032—Coupling to elements comprising an optical axis that is not aligned with the optical axis of the active region

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Lasers (AREA)

Abstract

La présente invention concerne un dispositif photonique et plus particulièrement un dispositif photonique qui comprend une source laser hétérogène et des moyens de dissipation thermique configurés pour dissiper la chaleur susceptible d’être émise par la source laser. Plus particulièrement, les moyens de dissipation thermique mettent en œuvre une couche de transfert thermique et un élément de transfert thermique agencés pour coopérer avec des plots de contact accessibles par la face avant du dispositif photonique. à cet égard, la couche de transfert thermique est faite d’un matériau électriquement isolant et est au contact de l’un et/ou l’autre des plots de contact, tandis que l’élément de transfert thermique se trouve exclusivement au contact de la couche de transfert thermique. Figure 2
FR2113081A 2021-10-29 2021-12-07 Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur Active FR3130086B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR2113081A FR3130086B1 (fr) 2021-12-07 2021-12-07 Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur
EP22801479.1A EP4423864A1 (fr) 2021-10-29 2022-10-13 Dispositif photonique pourvu d'une source laser et de moyens de gestion de la dissipation de chaleur
PCT/EP2022/078525 WO2023072610A1 (fr) 2021-10-29 2022-10-13 Dispositif photonique pourvu d'une source laser et de moyens de gestion de la dissipation de chaleur
CN202280069438.8A CN118104089A (zh) 2021-10-29 2022-10-13 设置有激光源和用于管理热耗散的装置的光子器件

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR2113081A FR3130086B1 (fr) 2021-12-07 2021-12-07 Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur
FR2113081 2021-12-07

Publications (2)

Publication Number Publication Date
FR3130086A1 FR3130086A1 (fr) 2023-06-09
FR3130086B1 true FR3130086B1 (fr) 2023-10-27

Family

ID=81328041

Family Applications (1)

Application Number Title Priority Date Filing Date
FR2113081A Active FR3130086B1 (fr) 2021-10-29 2021-12-07 Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur

Country Status (2)

Country Link
CN (1) CN118104089A (fr)
FR (1) FR3130086B1 (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3007589B1 (fr) * 2013-06-24 2015-07-24 St Microelectronics Crolles 2 Circuit integre photonique et procede de fabrication
FR3023066B1 (fr) * 2014-06-30 2017-10-27 Aledia Dispositif optoelectronique comprenant des diodes electroluminescentes et un circuit de commande
US10042115B2 (en) * 2016-04-19 2018-08-07 Stmicroelectronics (Crolles 2) Sas Electro-optic device with multiple photonic layers and related methods
US10651110B1 (en) * 2018-12-31 2020-05-12 Juniper Networks, Inc. Efficient heat-sinking in PIN diode

Also Published As

Publication number Publication date
FR3130086A1 (fr) 2023-06-09
CN118104089A (zh) 2024-05-28

Similar Documents

Publication Publication Date Title
US7999450B2 (en) Electroluminescent module with thermal-conducting carrier substrate
US11128099B2 (en) Light-emitting device
ATE296062T1 (de) Lichtbehandlungskopf
US20080266885A1 (en) Light source module with high heat-dissipation efficiency
FR2901347B1 (fr) Composant de dissipation thermique et dispositif d'eclairage et/ou de signalisation a diode equipe d'un tel composant
US7703949B2 (en) LED illuminating device with LED chip
FR3061600B1 (fr) Dispositif electronique comprenant une puce rainuree
US6839367B2 (en) Light source comprising laser diode module
TWM309757U (en) Side view LED package structure
WO2003107440A3 (fr) Dispositifs optoelectroniques
JP2009302186A (ja) 発光装置
FR3130086B1 (fr) Dispositif photonique pourvu d’une source laser et de moyens de gestion de la dissipation de chaleur
US20070120138A1 (en) Multi-layer light emitting device with integrated thermoelectric chip
JPS6410686A (en) Semiconductor laser module with electronic cooling element
JP2010073649A (ja) 照明装置
WO2017076064A1 (fr) Coupelle de lampe à dissipation de chaleur
JP4779035B2 (ja) 照明具
KR100999844B1 (ko) 고효율 방열 모듈을 구비한 고출력 ｌｅｄ 조명장치
FR3004238A1 (fr) Dispositif emetteur de lumiere comprenant un dissipateur thermique d'un composant emissif deporte en arriere d'un reflecteur
KR102377673B1 (ko) Led 조명등의 방열구조
TWM542857U (zh) 半導體與具有溝槽的散熱基板的組合
FR3059152B1 (fr) Dispositif de transfert thermique, de connexion electrique et dispositif electronique
KR20110007659A (ko) Led 조명장치
JPH09307018A (ja) 半導体素子およびその製造方法
CN105937731A (zh) 照明装置

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 2

PLSC Publication of the preliminary search report

Effective date: 20230609

PLFP Fee payment

Year of fee payment: 3