FR3103317B1 - Module de puissance - Google Patents

Module de puissance Download PDF

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Publication number
FR3103317B1
FR3103317B1 FR1912955A FR1912955A FR3103317B1 FR 3103317 B1 FR3103317 B1 FR 3103317B1 FR 1912955 A FR1912955 A FR 1912955A FR 1912955 A FR1912955 A FR 1912955A FR 3103317 B1 FR3103317 B1 FR 3103317B1
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FR
France
Prior art keywords
metallic layer
electronic component
power module
enclosure
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1912955A
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English (en)
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FR3103317A1 (fr
Inventor
Rabih Khazaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran SA
Original Assignee
Safran SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Safran SA filed Critical Safran SA
Priority to FR1912955A priority Critical patent/FR3103317B1/fr
Publication of FR3103317A1 publication Critical patent/FR3103317A1/fr
Application granted granted Critical
Publication of FR3103317B1 publication Critical patent/FR3103317B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le présent document concerne un module (10) de puissance comprenant :- un premier substrat (12) recouvert d’une première couche métallique (13) et un second substrat (14) recouvert d’une seconde couche métallique (15) et au moins un composant électronique (18) relié à la première couche métallique (13),- des premiers plots (16a) électriquement et thermiquement conducteurs reliant la première couche métallique (13) audit au moins un composant électronique (18),- une enceinte (24) entourant ledit au moins un composant électronique (18) et étant reliée à étanchéité auxdites première (13) et seconde (15) couche métallique, l’enceinte (24) comprenant au moins une première ouverture (24a) destinée à former une entrée de fluide de refroidissement et une seconde ouverture (24b) destinée à former une sortie de fluide de refroidissement. Figure à publier avec l’abrégé : Figure 1.
FR1912955A 2019-11-20 2019-11-20 Module de puissance Active FR3103317B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1912955A FR3103317B1 (fr) 2019-11-20 2019-11-20 Module de puissance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1912955 2019-11-20
FR1912955A FR3103317B1 (fr) 2019-11-20 2019-11-20 Module de puissance

Publications (2)

Publication Number Publication Date
FR3103317A1 FR3103317A1 (fr) 2021-05-21
FR3103317B1 true FR3103317B1 (fr) 2023-08-04

Family

ID=70295205

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1912955A Active FR3103317B1 (fr) 2019-11-20 2019-11-20 Module de puissance

Country Status (1)

Country Link
FR (1) FR3103317B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113497613A (zh) * 2020-04-03 2021-10-12 台达电子企业管理（上海）有限公司 复合开关电路结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2938096A1 (de) * 1979-09-20 1981-04-02 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleiterbauelement
DE4101205A1 (de) * 1990-02-09 1991-08-14 Asea Brown Boveri Gekuehltes hochleistungshalbleiterbauelement
EP1284503A1 (fr) * 2001-08-13 2003-02-19 Abb Research Ltd. Module semi-conducteur de puissance
JP5678490B2 (ja) * 2010-06-30 2015-03-04 株式会社デンソー 電力変換装置
FR3016266B1 (fr) * 2014-01-07 2018-03-16 Safran Electronics & Defense Dispositif electronique de puissance a refroidissement ameliore
DE102016218679A1 (de) * 2016-09-28 2018-03-29 Siemens Aktiengesellschaft Elektronische Baugruppe mit einer Kühlvorrichtung, die mit einer Kühlflüssigkeit befüllbar ist

Also Published As

Publication number Publication date
FR3103317A1 (fr) 2021-05-21

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