FR3084202A1 - Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication - Google Patents
Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication Download PDFInfo
- Publication number
- FR3084202A1 FR3084202A1 FR1856761A FR1856761A FR3084202A1 FR 3084202 A1 FR3084202 A1 FR 3084202A1 FR 1856761 A FR1856761 A FR 1856761A FR 1856761 A FR1856761 A FR 1856761A FR 3084202 A1 FR3084202 A1 FR 3084202A1
- Authority
- FR
- France
- Prior art keywords
- electrical insulation
- micrometric
- charge
- composite material
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000203 mixture Substances 0.000 title claims description 58
- 239000012772 electrical insulation material Substances 0.000 title claims description 33
- 239000002131 composite material Substances 0.000 claims abstract description 71
- 239000011159 matrix material Substances 0.000 claims abstract description 30
- 238000010292 electrical insulation Methods 0.000 claims abstract description 28
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 10
- 239000012777 electrically insulating material Substances 0.000 claims abstract description 5
- 239000011256 inorganic filler Substances 0.000 claims description 31
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 20
- 238000004132 cross linking Methods 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000004848 polyfunctional curative Substances 0.000 claims description 14
- 239000012190 activator Substances 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 13
- 238000005266 casting Methods 0.000 claims description 12
- 239000003431 cross linking reagent Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 229910004298 SiO 2 Inorganic materials 0.000 claims 1
- 229910010413 TiO 2 Inorganic materials 0.000 claims 1
- 239000000945 filler Substances 0.000 description 49
- 239000000463 material Substances 0.000 description 22
- 239000002245 particle Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000518 rheometry Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006557 surface reaction Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 210000003934 vacuole Anatomy 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Gas-Insulated Switchgears (AREA)
- Insulating Bodies (AREA)
Abstract
Description
D (hors invention) | DGEBA | 2 CÛ x: | 17% | ||
C (hors invention) | DGEBA | Alumine polydisperse | 37% | ||
B (hors invention) | DGEBA | o | |||
A (invention) | DGEBA | Alumine polydisperse | hBN | 37% | 86,5/13,6 |
matrice | Charge 1 (facteur de forme < 3) | Charge 2 (lamellaire, facteur de forme de 3 à 100) | Teneur totale en charges (% en volume par rapport au volume total) | ratio volumique charge 1 ! charge 2 |
A | B | C | D | |
Viscosité du mélange réticulable (cisaillement 1/s) (mPa.s) | 19905 | 610 | 4529 | 20112 |
Rigidité diélectrique (kV/mm) | 29,5 ±0,8 | 37 | 29-30 | >41 |
Conductivité thermique (W/mK) | 1,1 | 0,2 | 0,88 | 0,88 |
Coefficient d'expansion thermique (pm/m°C) | 36 | 74 | 43 | 63 |
Claims (17)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1856761A FR3084202B1 (fr) | 2018-07-20 | 2018-07-20 | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
PCT/FR2019/051795 WO2020016525A1 (fr) | 2018-07-20 | 2019-07-17 | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
EP19762187.3A EP3824480A1 (fr) | 2018-07-20 | 2019-07-17 | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
CN201980047454.5A CN112424880A (zh) | 2018-07-20 | 2019-07-17 | 包含微米级无机填料混合物的电绝缘材料及制造方法 |
JP2020572816A JP2021530082A (ja) | 2018-07-20 | 2019-07-17 | マイクロメトリック無機フィラーの混合物を備える電気絶縁材料及び製造方法 |
KR1020217001898A KR20210064183A (ko) | 2018-07-20 | 2019-07-17 | 마이크로메트릭 무기 충전제의 혼합물을 포함하는 전기 절연 재료 및 제조 공정 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1856761 | 2018-07-20 | ||
FR1856761A FR3084202B1 (fr) | 2018-07-20 | 2018-07-20 | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3084202A1 true FR3084202A1 (fr) | 2020-01-24 |
FR3084202B1 FR3084202B1 (fr) | 2020-10-23 |
Family
ID=63834207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1856761A Active FR3084202B1 (fr) | 2018-07-20 | 2018-07-20 | Materiau d'isolation electrique comprenant un melange de charges inorganiques micrometriques et procede de fabrication |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP3824480A1 (fr) |
JP (1) | JP2021530082A (fr) |
KR (1) | KR20210064183A (fr) |
CN (1) | CN112424880A (fr) |
FR (1) | FR3084202B1 (fr) |
WO (1) | WO2020016525A1 (fr) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1769511B1 (fr) * | 2004-07-13 | 2011-02-02 | Areva T&D Sas | Procede de fabrication d'un isolateur pour une utilisation en haute tension |
EP2316897A1 (fr) * | 2008-08-18 | 2011-05-04 | Sekisui Chemical Co., Ltd. | Feuille isolante et structure laminée |
EP2455420A1 (fr) * | 2009-07-14 | 2012-05-23 | Sakai Chemical Industry Co., Ltd. | Composition de charge à dissipation de chaleur, composition de résine, graisse à dissipation de chaleur, et composition de revêtement à dissipation de chaleur |
US20140178693A1 (en) * | 2012-12-21 | 2014-06-26 | General Electric Company | High thermal conductivity composite for electric insulation, and articles thereof |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6048919A (en) * | 1999-01-29 | 2000-04-11 | Chip Coolers, Inc. | Thermally conductive composite material |
CN101035876A (zh) * | 2004-08-23 | 2007-09-12 | 莫门蒂夫性能材料股份有限公司 | 导热性组合物及其制备方法 |
US20090152491A1 (en) * | 2007-11-16 | 2009-06-18 | E. I. Du Pont De Nemours And Company | Thermally conductive resin compositions |
JP5647945B2 (ja) * | 2011-05-31 | 2015-01-07 | 日本発條株式会社 | 回路基板用絶縁樹脂組成物、回路基板用絶縁シート、回路基板用積層板及び金属ベース回路基板 |
DE112014002796B4 (de) * | 2013-06-14 | 2020-07-02 | Mitsubishi Electric Corporation | Wärmehärtbare Harzzusammensetzung, Verfahren zur Herstellung einer wärmeleitenden Folie und Leistungsmodul |
US9611414B2 (en) * | 2014-07-11 | 2017-04-04 | Henkel IP & Holding GmbH | Thermal interface material with mixed aspect ratio particle dispersions |
JP6547277B2 (ja) * | 2014-10-31 | 2019-07-24 | 住友ベークライト株式会社 | 成形材料および成形品 |
TWI710595B (zh) * | 2014-12-08 | 2020-11-21 | 日商昭和電工材料股份有限公司 | 環氧樹脂組成物、樹脂薄片、預浸體、附有樹脂的金屬箔、金屬基板、及電力半導體裝置 |
TW201704413A (zh) * | 2015-06-08 | 2017-02-01 | 漢高股份有限及兩合公司 | 高熱傳導性低壓模塑之熱熔黏著劑 |
-
2018
- 2018-07-20 FR FR1856761A patent/FR3084202B1/fr active Active
-
2019
- 2019-07-17 EP EP19762187.3A patent/EP3824480A1/fr not_active Withdrawn
- 2019-07-17 JP JP2020572816A patent/JP2021530082A/ja active Pending
- 2019-07-17 WO PCT/FR2019/051795 patent/WO2020016525A1/fr unknown
- 2019-07-17 KR KR1020217001898A patent/KR20210064183A/ko unknown
- 2019-07-17 CN CN201980047454.5A patent/CN112424880A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1769511B1 (fr) * | 2004-07-13 | 2011-02-02 | Areva T&D Sas | Procede de fabrication d'un isolateur pour une utilisation en haute tension |
EP2316897A1 (fr) * | 2008-08-18 | 2011-05-04 | Sekisui Chemical Co., Ltd. | Feuille isolante et structure laminée |
EP2455420A1 (fr) * | 2009-07-14 | 2012-05-23 | Sakai Chemical Industry Co., Ltd. | Composition de charge à dissipation de chaleur, composition de résine, graisse à dissipation de chaleur, et composition de revêtement à dissipation de chaleur |
US20140178693A1 (en) * | 2012-12-21 | 2014-06-26 | General Electric Company | High thermal conductivity composite for electric insulation, and articles thereof |
Also Published As
Publication number | Publication date |
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EP3824480A1 (fr) | 2021-05-26 |
JP2021530082A (ja) | 2021-11-04 |
CN112424880A (zh) | 2021-02-26 |
FR3084202B1 (fr) | 2020-10-23 |
WO2020016525A1 (fr) | 2020-01-23 |
KR20210064183A (ko) | 2021-06-02 |
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