FR3083642B1 - Structure d’encapsulation d’un dispositif d’alimentation - Google Patents

Structure d’encapsulation d’un dispositif d’alimentation Download PDF

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FR3083642B1
FR3083642B1 FR1900551A FR1900551A FR3083642B1 FR 3083642 B1 FR3083642 B1 FR 3083642B1 FR 1900551 A FR1900551 A FR 1900551A FR 1900551 A FR1900551 A FR 1900551A FR 3083642 B1 FR3083642 B1 FR 3083642B1
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substrate
power
power supply
encapsulation structure
supply device
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FR3083642A1 (fr
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Hsin-Chang Tsai
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Actron Technology Corp
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Actron Technology Corp
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    • HELECTRICITY
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    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822Multilayer substrates
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    • H01L23/49541Geometry of the lead-frame
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Abstract

Une structure d’encapsulation d’un dispositif d’alimentation comprend un substrat ayant un premier circuit, un premier dispositif d’alimentation, un second dispositif d’alimentation, un film isolant ayant un second circuit, au moins un composant électronique et un boîtier. Le premier dispositif d’alimentation, le second dispositif d’alimentation et le film isolant sont disposés sur le substrat. Le premier dispositif d’alimentation et le second dispositif d’alimentation sont directement connectés électriquement l’un à l’autre par l’intermédiaire du premier circuit du substrat. Le composant électronique est disposé sur le film isolant. Le boîtier encapsule le substrat, le premier dispositif d’alimentation, le second dispositif d’alimentation et le composant électronique.
FR1900551A 2018-07-04 2019-01-22 Structure d’encapsulation d’un dispositif d’alimentation Active FR3083642B1 (fr)

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FR3083642A1 (fr) 2020-01-10
US20200013705A1 (en) 2020-01-09
US10804189B2 (en) 2020-10-13
DE102018132425A1 (de) 2020-01-09
TWI664701B (zh) 2019-07-01
DE102018132425B4 (de) 2021-12-02
TW202006898A (zh) 2020-02-01

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