FR3081612B1 - Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur - Google Patents

Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur Download PDF

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Publication number
FR3081612B1
FR3081612B1 FR1854230A FR1854230A FR3081612B1 FR 3081612 B1 FR3081612 B1 FR 3081612B1 FR 1854230 A FR1854230 A FR 1854230A FR 1854230 A FR1854230 A FR 1854230A FR 3081612 B1 FR3081612 B1 FR 3081612B1
Authority
FR
France
Prior art keywords
stack
plates
plate
semiconductor material
subsequent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1854230A
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English (en)
Other versions
FR3081612A1 (fr
Inventor
Claude Jacquot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solean
Original Assignee
Solean
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solean filed Critical Solean
Priority to FR1854230A priority Critical patent/FR3081612B1/fr
Priority to PCT/EP2019/063115 priority patent/WO2019224202A1/fr
Publication of FR3081612A1 publication Critical patent/FR3081612A1/fr
Application granted granted Critical
Publication of FR3081612B1 publication Critical patent/FR3081612B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

L'invention concerne un procédé de dépilage d'un empilement (2) de plaques (4) de matériau semi-conducteur, comprenant des faces supérieure (6) et inférieure (8), des bords amont (10) et aval (12), l'empilement (2) comprenant des plaques supérieure (4A) et subséquente (4B). Selon l'invention, pour assurer la séparation d'une seule plaque de l'empilement à vitesse élevée, le procédé comprend les étapes suivantes : étape A) : saisie d'une portion (7) de la face supérieure de la plaque supérieure par un effecteur (30), à proximité du bord aval ; et étape B) : déplacement de l'effecteur pour actionner la portion saisie de façon à simultanément soulever le bord aval, et impartir une flexion élastique à la plaque supérieure pour la bomber en direction de la plaque subséquente, de façon à maintenir en appui le bord amont contre la plaque subséquente.
FR1854230A 2018-05-22 2018-05-22 Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur Expired - Fee Related FR3081612B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
FR1854230A FR3081612B1 (fr) 2018-05-22 2018-05-22 Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur
PCT/EP2019/063115 WO2019224202A1 (fr) 2018-05-22 2019-05-21 Procédé et système de dépilage d'un empilement de plaques de matériau semi-conducteur

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1854230 2018-05-22
FR1854230A FR3081612B1 (fr) 2018-05-22 2018-05-22 Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur

Publications (2)

Publication Number Publication Date
FR3081612A1 FR3081612A1 (fr) 2019-11-29
FR3081612B1 true FR3081612B1 (fr) 2021-09-17

Family

ID=63407356

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1854230A Expired - Fee Related FR3081612B1 (fr) 2018-05-22 2018-05-22 Procede et systeme de depilage d'un empilement de plaques de materiau semi-conducteur

Country Status (2)

Country Link
FR (1) FR3081612B1 (fr)
WO (1) WO2019224202A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3111833B1 (fr) 2020-06-25 2022-07-15 Solean Préhenseur et procédé de saisie d’une plaque

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012223860A (ja) * 2011-04-20 2012-11-15 Murata Machinery Ltd 吸引チャック、及びそれを備えたワークの移載装置
EP2874183A1 (fr) * 2013-11-15 2015-05-20 mechatronic Systemtechnik GmbH Dispositif destiné au moins à vidanger un récipient de transport

Also Published As

Publication number Publication date
WO2019224202A1 (fr) 2019-11-28
FR3081612A1 (fr) 2019-11-29

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