FR3080971B1 - Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte - Google Patents

Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte Download PDF

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Publication number
FR3080971B1
FR3080971B1 FR1853925A FR1853925A FR3080971B1 FR 3080971 B1 FR3080971 B1 FR 3080971B1 FR 1853925 A FR1853925 A FR 1853925A FR 1853925 A FR1853925 A FR 1853925A FR 3080971 B1 FR3080971 B1 FR 3080971B1
Authority
FR
France
Prior art keywords
power module
cavity
heatsink
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1853925A
Other languages
English (en)
Other versions
FR3080971A1 (fr
Inventor
Stephane Couarraze
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive GmbH
Continental Automotive France SAS
Original Assignee
Continental Automotive GmbH
Continental Automotive France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Automotive GmbH, Continental Automotive France SAS filed Critical Continental Automotive GmbH
Priority to FR1853925A priority Critical patent/FR3080971B1/fr
Publication of FR3080971A1 publication Critical patent/FR3080971A1/fr
Application granted granted Critical
Publication of FR3080971B1 publication Critical patent/FR3080971B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
    • B62D—MOTOR VEHICLES; TRAILERS
    • B62D5/00—Power-assisted or power-driven steering
    • B62D5/04—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear
    • B62D5/0403—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box
    • B62D5/0406—Power-assisted or power-driven steering electrical, e.g. using an electric servo-motor connected to, or forming part of, the steering gear characterised by constructional features, e.g. common housing for motor and gear box including housing for electronic control unit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un ensemble d'au moins un dissipateur thermique (1) et d'une carte (2) de circuit imprimé sur laquelle est solidarisé au moins un module de puissance (3), le procédé comprenant une étape d'insertion au moins partielle du module de puissance (3) dans une cavité (5) du dissipateur (1) avec une couche de pâte thermique (4) intercalée au moins localement entre le module de puissance (3) préalablement solidarisé ou non avec la carte (2) et le dissipateur (1). Préalablement à l'insertion au moins partielle du module de puissance (3) dans la cavité (5), la cavité (5) est remplie d'une couche de pâte thermique (4) suffisante pour qu'une portion du module de puissance (3) insérée dans la cavité (5) soit entièrement enrobée dans la pâte thermique (4), la pâte thermique (4) et la portion enrobée du module de puissance (3) occupant une totalité de la cavité (5).
FR1853925A 2018-05-07 2018-05-07 Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte Active FR3080971B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1853925A FR3080971B1 (fr) 2018-05-07 2018-05-07 Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1853925A FR3080971B1 (fr) 2018-05-07 2018-05-07 Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte
FR1853925 2018-05-07

Publications (2)

Publication Number Publication Date
FR3080971A1 FR3080971A1 (fr) 2019-11-08
FR3080971B1 true FR3080971B1 (fr) 2023-05-12

Family

ID=63407339

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1853925A Active FR3080971B1 (fr) 2018-05-07 2018-05-07 Carte de circuit imprime avec un dissipateur thermique pour un module de puissance solidarise a la carte

Country Status (1)

Country Link
FR (1) FR3080971B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3139510A1 (fr) * 2022-09-09 2024-03-15 Valeo Systemes Thermiques Dispositif électronique de commande d’un radiateur électrique.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524250A1 (fr) * 1982-03-26 1983-09-30 Socapex Carte imprimee electrique et thermique, procede de fabrication d'une telle carte et systeme d'interconnexion thermique et electrique utilisant une telle carte
JP3611548B2 (ja) * 2002-02-20 2005-01-19 Ｔｄｋ株式会社 スイッチング電源とその製造方法

Also Published As

Publication number Publication date
FR3080971A1 (fr) 2019-11-08

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