FR3074399B1 - Circuit imprime flexible avec blindage peripherique - Google Patents

Circuit imprime flexible avec blindage peripherique Download PDF

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Publication number
FR3074399B1
FR3074399B1 FR1761422A FR1761422A FR3074399B1 FR 3074399 B1 FR3074399 B1 FR 3074399B1 FR 1761422 A FR1761422 A FR 1761422A FR 1761422 A FR1761422 A FR 1761422A FR 3074399 B1 FR3074399 B1 FR 3074399B1
Authority
FR
France
Prior art keywords
printed circuit
flexible printed
face
peripheral shield
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1761422A
Other languages
English (en)
Other versions
FR3074399A1 (fr
Inventor
Patrice Chetanneau
Thierry Segond
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Safran Electronics and Defense SAS
Original Assignee
Safran Electronics and Defense SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Safran Electronics and Defense SAS filed Critical Safran Electronics and Defense SAS
Priority to FR1761422A priority Critical patent/FR3074399B1/fr
Publication of FR3074399A1 publication Critical patent/FR3074399A1/fr
Application granted granted Critical
Publication of FR3074399B1 publication Critical patent/FR3074399B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un circuit imprimé flexible comprenant au moins une couche de conduction (2) comprenant : - un ensemble de pistes conductrices (4) disposées adjacentes les unes aux autres, et - au moins deux pistes de masse périphériques (8) disposées de part et d'autre de l'ensemble de pistes conductrices, le circuit imprimé flexible comprenant en outre un premier revêtement de blindage (40a) sur la première face (16) et un second revêtement de blindage (40b) sur la seconde face (17), dans lequel une piste de masse périphériques (8) est électriquement en contact avec au moins une couche de colle (41, 41a) électriquement conductrice du premier revêtement de blindage (40a) sur la première face (16) et avec au moins une couche de colle (41, 41b) électriquement conductrice du second revêtement de blindage (40a) sur la seconde face (17).
FR1761422A 2017-11-30 2017-11-30 Circuit imprime flexible avec blindage peripherique Active FR3074399B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1761422A FR3074399B1 (fr) 2017-11-30 2017-11-30 Circuit imprime flexible avec blindage peripherique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1761422A FR3074399B1 (fr) 2017-11-30 2017-11-30 Circuit imprime flexible avec blindage peripherique
FR1761422 2017-11-30

Publications (2)

Publication Number Publication Date
FR3074399A1 FR3074399A1 (fr) 2019-05-31
FR3074399B1 true FR3074399B1 (fr) 2020-09-04

Family

ID=62683238

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1761422A Active FR3074399B1 (fr) 2017-11-30 2017-11-30 Circuit imprime flexible avec blindage peripherique

Country Status (1)

Country Link
FR (1) FR3074399B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465175B (zh) * 2020-04-23 2022-08-12 京东方科技集团股份有限公司 电路板及其制备方法、电子设备
CN114760752A (zh) * 2022-04-07 2022-07-15 麦格威饰件科技（苏州）有限公司 一种模内装饰塑件与电路集成产品及其制备工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3498386B2 (ja) * 1994-10-19 2004-02-16 住友電気工業株式会社 シールド付きフレキシブル配線板及びその製造方法
JP2000269632A (ja) * 1999-03-17 2000-09-29 Tatsuta Electric Wire & Cable Co Ltd シールドフレキシブルプリント配線板の製造方法、シールドフレキシブルプリント配線板用補強シールドフィルム及びシールドフレキシブルプリント配線板
US20030188889A1 (en) * 2002-04-09 2003-10-09 Ppc Electronic Ag Printed circuit board and method for producing it
US8130005B2 (en) * 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference
US9949360B2 (en) * 2011-03-10 2018-04-17 Mediatek Inc. Printed circuit board design for high speed application

Also Published As

Publication number Publication date
FR3074399A1 (fr) 2019-05-31

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