FR3074358B1 - Procede de realisation d'une cavite etanche a couche mince - Google Patents

Procede de realisation d'une cavite etanche a couche mince Download PDF

Info

Publication number
FR3074358B1
FR3074358B1 FR1761274A FR1761274A FR3074358B1 FR 3074358 B1 FR3074358 B1 FR 3074358B1 FR 1761274 A FR1761274 A FR 1761274A FR 1761274 A FR1761274 A FR 1761274A FR 3074358 B1 FR3074358 B1 FR 3074358B1
Authority
FR
France
Prior art keywords
producing
layer cavity
thin
layer
support layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1761274A
Other languages
English (en)
Other versions
FR3074358A1 (fr
Inventor
Philippe Robert
Sophie Giroud
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR1761274A priority Critical patent/FR3074358B1/fr
Publication of FR3074358A1 publication Critical patent/FR3074358A1/fr
Application granted granted Critical
Publication of FR3074358B1 publication Critical patent/FR3074358B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/05—Microfluidics
    • B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
    • B81C2201/0192—Transfer of a layer from a carrier wafer to a device wafer by cleaving the carrier wafer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Micromachines (AREA)

Abstract

Procédé de réalisation d'un système d'encapsulation comportant : - la fabrication d'un premier élément comprenant, à partir d'un premier substrat, les étapes de formation d'une zone fragilisée de sorte définir une couche mince et une couche support, - l'assemblage du premier élément avec un deuxième élément de sorte que la couche mince soit disposée entre le deuxième élément et la couche support, - le retrait de la couche support par séparation de la couche support et de la couche mince au niveau de la zone fragilisée.
FR1761274A 2017-11-28 2017-11-28 Procede de realisation d'une cavite etanche a couche mince Active FR3074358B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1761274A FR3074358B1 (fr) 2017-11-28 2017-11-28 Procede de realisation d'une cavite etanche a couche mince

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1761274A FR3074358B1 (fr) 2017-11-28 2017-11-28 Procede de realisation d'une cavite etanche a couche mince
FR1761274 2017-11-28

Publications (2)

Publication Number Publication Date
FR3074358A1 FR3074358A1 (fr) 2019-05-31
FR3074358B1 true FR3074358B1 (fr) 2022-02-04

Family

ID=61913260

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1761274A Active FR3074358B1 (fr) 2017-11-28 2017-11-28 Procede de realisation d'une cavite etanche a couche mince

Country Status (1)

Country Link
FR (1) FR3074358B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3108204B1 (fr) * 2020-03-10 2023-10-27 Commissariat Energie Atomique Procédé de suspension d’une couche mince sur une cavité avec effet raidisseur obtenu par pressurisation de la cavité par des espèces implantées

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2715502B1 (fr) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Structure présentant des cavités et procédé de réalisation d'une telle structure.
DE10350036B4 (de) * 2003-10-27 2014-01-23 Robert Bosch Gmbh Verfahren zum Vereinzeln von Halbleiterchips und entsprechende Halbleiterchipanordnung
DE102009002485A1 (de) * 2009-04-20 2010-10-21 Robert Bosch Gmbh Verfahren zur Herstellung von verkappten MEMS-Bauelementen
US9184094B1 (en) * 2012-01-26 2015-11-10 Skorpios Technologies, Inc. Method and system for forming a membrane over a cavity
US9511996B2 (en) * 2012-07-31 2016-12-06 Soitec Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices

Also Published As

Publication number Publication date
FR3074358A1 (fr) 2019-05-31

Similar Documents

Publication Publication Date Title
SG10201709401QA (en) SiC WAFER PRODUCING METHOD
WO2008033508A3 (fr) Capteur d'images faisant appel à un film mince de soi
MY180611A (en) Sic substrate separating method
MY187221A (en) Sic wafer producing method
FR3057261B1 (fr) Capteur micromecanique et son procede de fabrication
TW201613820A (en) CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufacture
FR2857982B1 (fr) Procede de fabrication d'une couche epitaxiee
FR2888400B1 (fr) Procede de prelevement de couche
MY177241A (en) Thin plate separating method
EP2505548A3 (fr) Transducteur acoustique micromécanique comprenant un support de membrane à surface conique
ITVA20000042A1 (it) Sensore di pressione monoliticamente integrato e relativo processo direalizzazione.
MY180538A (en) Wafer producing method
WO2009039159A3 (fr) Supports par zones pour pièces produites par fabrication de formes libres solides
EP1376687A3 (fr) Elément semiconducteur et procédé de fabrication
CY1105954T1 (el) Διαδικασια παραγωγης διαταξεων μικροροης απο συνθετη πλακοειδη κατασκευη
EP1712514A3 (fr) Procédé de réalisation d'ergots anti-adhésion pour une micro-sructure électro-méchanique
BR112017011347A2 (pt) método para produzir uma vidraça compósita com um revestimento funcional protegido contra corrosão
WO2008126064A3 (fr) Structure de séparation de fluide et procédé de fabrication d'une structure de séparation de fluide
FR3074358B1 (fr) Procede de realisation d'une cavite etanche a couche mince
WO2010028884A3 (fr) Encapsulage, système micro-électromécanique et procédé d'encapsulage
EP2952472A3 (fr) Procede de realisation ameliore d'elements suspendus d'epaisseurs differentes pour structure mems et nems
WO2011128446A3 (fr) Procédé de fabrication d'une structure à scellement hermétique
DE102014100755B4 (de) Chipanordnung und verfahren zu ihrer herstellung
FR3045678B1 (fr) Procede de fabrication d'une couche piezoelectrique monocristalline et dispositif microelectronique, photonique ou optique comprenant une telle couche
MY183887A (en) Monolithic separation membrane structure, and method for producing monolithic separation membrane structure

Legal Events

Date Code Title Description
PLSC Publication of the preliminary search report

Effective date: 20190531

PLFP Fee payment

Year of fee payment: 3

PLFP Fee payment

Year of fee payment: 4

PLFP Fee payment

Year of fee payment: 5

PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7