FR3073978B1 - Module electronique de puissance et systeme electronique comprenant un tel module electronique - Google Patents

Module electronique de puissance et systeme electronique comprenant un tel module electronique Download PDF

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Publication number
FR3073978B1
FR3073978B1 FR1760846A FR1760846A FR3073978B1 FR 3073978 B1 FR3073978 B1 FR 3073978B1 FR 1760846 A FR1760846 A FR 1760846A FR 1760846 A FR1760846 A FR 1760846A FR 3073978 B1 FR3073978 B1 FR 3073978B1
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FR
France
Prior art keywords
electronic
electronic module
module
power
electronic system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1760846A
Other languages
English (en)
Other versions
FR3073978A1 (fr
Inventor
Menouar Ameziani
Hadi Alawieh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut Vedecom
Original Assignee
Institut Vedecom
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut Vedecom filed Critical Institut Vedecom
Priority to FR1760846A priority Critical patent/FR3073978B1/fr
Priority to US16/764,309 priority patent/US11032951B2/en
Priority to EP18816195.4A priority patent/EP3711088A1/fr
Priority to CN201880074649.4A priority patent/CN111357101A/zh
Priority to PCT/FR2018/052841 priority patent/WO2019097164A1/fr
Publication of FR3073978A1 publication Critical patent/FR3073978A1/fr
Application granted granted Critical
Publication of FR3073978B1 publication Critical patent/FR3073978B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/071—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR1760846A 2017-11-17 2017-11-17 Module electronique de puissance et systeme electronique comprenant un tel module electronique Active FR3073978B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1760846A FR3073978B1 (fr) 2017-11-17 2017-11-17 Module electronique de puissance et systeme electronique comprenant un tel module electronique
US16/764,309 US11032951B2 (en) 2017-11-17 2018-11-15 Electronic system comprising an electronic module
EP18816195.4A EP3711088A1 (fr) 2017-11-17 2018-11-15 Systeme electronique comprenant un module electronique
CN201880074649.4A CN111357101A (zh) 2017-11-17 2018-11-15 包括电子模块的电子系统
PCT/FR2018/052841 WO2019097164A1 (fr) 2017-11-17 2018-11-15 Systeme electronique comprenant un module electronique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1760846A FR3073978B1 (fr) 2017-11-17 2017-11-17 Module electronique de puissance et systeme electronique comprenant un tel module electronique
FR1760846 2017-11-17

Publications (2)

Publication Number Publication Date
FR3073978A1 FR3073978A1 (fr) 2019-05-24
FR3073978B1 true FR3073978B1 (fr) 2022-10-28

Family

ID=61224041

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1760846A Active FR3073978B1 (fr) 2017-11-17 2017-11-17 Module electronique de puissance et systeme electronique comprenant un tel module electronique

Country Status (5)

Country Link
US (1) US11032951B2 (fr)
EP (1) EP3711088A1 (fr)
CN (1) CN111357101A (fr)
FR (1) FR3073978B1 (fr)
WO (1) WO2019097164A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11222832B2 (en) * 2019-02-11 2022-01-11 Semiconductor Components Industries, Llc Power semiconductor device package
US11876034B2 (en) * 2021-03-29 2024-01-16 GM Global Technology Operations LLC 3-D power modules with double sided cooling per semiconductor die

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11500271A (ja) * 1995-02-16 1999-01-06 マイクロモジュール システムズ インコーポレイテッド マルチチップモジュール取付けアセンブリおよびこれを使用するコンピュータ
JPH0955459A (ja) * 1995-06-06 1997-02-25 Seiko Epson Corp 半導体装置
US7554039B2 (en) * 2002-11-21 2009-06-30 Hitachi, Ltd. Electronic device
JP4019989B2 (ja) * 2003-03-26 2007-12-12 株式会社デンソー 半導体装置
JP4438489B2 (ja) * 2004-04-13 2010-03-24 富士電機システムズ株式会社 半導体装置
JP4635564B2 (ja) 2004-11-04 2011-02-23 富士電機システムズ株式会社 半導体装置
JP2007335663A (ja) * 2006-06-15 2007-12-27 Toyota Motor Corp 半導体モジュール
JP5359579B2 (ja) * 2009-06-11 2013-12-04 日産自動車株式会社 半導体装置の製造方法と半導体装置
US20120228757A1 (en) * 2009-11-25 2012-09-13 Toyota Jidosha Kabushiki Kaisha Cooling structure of semiconductor device
JP5568645B2 (ja) * 2010-12-01 2014-08-06 株式会社安川電機 電力変換装置
US9165848B2 (en) * 2011-09-29 2015-10-20 Toyota Jidosha Kabushiki Kaisha Semiconductor device
JP2014072385A (ja) * 2012-09-28 2014-04-21 Toyota Motor Corp 半導体装置
US9275926B2 (en) * 2013-05-03 2016-03-01 Infineon Technologies Ag Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
JP5975180B2 (ja) * 2013-10-03 2016-08-23 富士電機株式会社 半導体モジュール
US20150351218A1 (en) * 2014-05-27 2015-12-03 Fujikura Ltd. Component built-in board and method of manufacturing the same, and mounting body
KR101791241B1 (ko) * 2014-06-17 2017-10-30 한국과학기술원 카테콜 아민 기반의 다기능성 필름 및 이의 제조 방법
US20160005675A1 (en) 2014-07-07 2016-01-07 Infineon Technologies Ag Double sided cooling chip package and method of manufacturing the same
KR101755769B1 (ko) * 2014-10-29 2017-07-07 현대자동차주식회사 양면 냉각 파워 모듈 및 이의 제조 방법
US20160286692A1 (en) * 2015-03-23 2016-09-29 The Boeing Company High thermal conductivity joint utlizing continuous aligned carbon nanotubes
US20160282067A1 (en) * 2015-03-23 2016-09-29 The Boeing Company High thermal conductivity composite base plate
JP6378714B2 (ja) * 2016-04-20 2018-08-22 矢崎総業株式会社 電気接続箱
US10002821B1 (en) * 2017-09-29 2018-06-19 Infineon Technologies Ag Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates

Also Published As

Publication number Publication date
US11032951B2 (en) 2021-06-08
US20200375061A1 (en) 2020-11-26
FR3073978A1 (fr) 2019-05-24
EP3711088A1 (fr) 2020-09-23
CN111357101A (zh) 2020-06-30
WO2019097164A1 (fr) 2019-05-23

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