FR3058565B1 - Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance - Google Patents

Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance Download PDF

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Publication number
FR3058565B1
FR3058565B1 FR1660771A FR1660771A FR3058565B1 FR 3058565 B1 FR3058565 B1 FR 3058565B1 FR 1660771 A FR1660771 A FR 1660771A FR 1660771 A FR1660771 A FR 1660771A FR 3058565 B1 FR3058565 B1 FR 3058565B1
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FR
France
Prior art keywords
power module
electronic power
electrical
compressor
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1660771A
Other languages
English (en)
Other versions
FR3058565A1 (fr
Inventor
Gregory Hodebourg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Priority to FR1660771A priority Critical patent/FR3058565B1/fr
Publication of FR3058565A1 publication Critical patent/FR3058565A1/fr
Application granted granted Critical
Publication of FR3058565B1 publication Critical patent/FR3058565B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inverter Devices (AREA)
FR1660771A 2016-11-08 2016-11-08 Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance Active FR3058565B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1660771A FR3058565B1 (fr) 2016-11-08 2016-11-08 Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1660771 2016-11-08
FR1660771A FR3058565B1 (fr) 2016-11-08 2016-11-08 Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance

Publications (2)

Publication Number Publication Date
FR3058565A1 FR3058565A1 (fr) 2018-05-11
FR3058565B1 true FR3058565B1 (fr) 2018-11-02

Family

ID=58645116

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1660771A Active FR3058565B1 (fr) 2016-11-08 2016-11-08 Module electronique de puissance, equipement electrique et compresseur de suralimentation electrique comprenant un tel module electronique de puissance

Country Status (1)

Country Link
FR (1) FR3058565B1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4613077B2 (ja) * 2005-02-28 2011-01-12 株式会社オクテック 半導体装置、電極用部材および電極用部材の製造方法
DE102005016650B4 (de) * 2005-04-12 2009-11-19 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen
WO2008090734A1 (fr) * 2007-01-22 2008-07-31 Mitsubishi Electric Corporation Dispositif semi-conducteur pour énergie
JP4607995B2 (ja) * 2008-11-28 2011-01-05 三菱電機株式会社 電力用半導体装置
JP5500936B2 (ja) * 2009-10-06 2014-05-21 イビデン株式会社 回路基板及び半導体モジュール
US8563364B2 (en) * 2011-09-29 2013-10-22 Infineon Technologies Ag Method for producing a power semiconductor arrangement
JP2014220329A (ja) * 2013-05-07 2014-11-20 住友電気工業株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
FR3058565A1 (fr) 2018-05-11

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