FR3056333B1 - Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges - Google Patents

Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges Download PDF

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Publication number
FR3056333B1
FR3056333B1 FR1658898A FR1658898A FR3056333B1 FR 3056333 B1 FR3056333 B1 FR 3056333B1 FR 1658898 A FR1658898 A FR 1658898A FR 1658898 A FR1658898 A FR 1658898A FR 3056333 B1 FR3056333 B1 FR 3056333B1
Authority
FR
France
Prior art keywords
image sensor
infrared radiation
efficient image
enhanced quantum
quantum efficient
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR1658898A
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English (en)
Other versions
FR3056333A1 (fr
Inventor
Axel Crocherie
Pierre Emmanuel Marie MALINGE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Crolles 2 SAS
Original Assignee
STMicroelectronics Crolles 2 SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Crolles 2 SAS filed Critical STMicroelectronics Crolles 2 SAS
Priority to FR1658898A priority Critical patent/FR3056333B1/fr
Priority to CN201720235765.2U priority patent/CN207320115U/zh
Priority to CN201710142417.5A priority patent/CN107871754B/zh
Priority to US15/460,992 priority patent/US10347677B2/en
Publication of FR3056333A1 publication Critical patent/FR3056333A1/fr
Application granted granted Critical
Publication of FR3056333B1 publication Critical patent/FR3056333B1/fr
Priority to US16/414,409 priority patent/US10475836B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1464Back illuminated imager structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14627Microlenses
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14625Optical elements or arrangements associated with the device
    • H01L27/14629Reflectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/1463Pixel isolation structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14636Interconnect structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14643Photodiode arrays; MOS imagers
    • H01L27/14649Infrared imagers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14683Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685Process for coatings or optical elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
FR1658898A 2016-09-22 2016-09-22 Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges Expired - Fee Related FR3056333B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1658898A FR3056333B1 (fr) 2016-09-22 2016-09-22 Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges
CN201720235765.2U CN207320115U (zh) 2016-09-22 2017-03-10 集成图像传感器和电子系统
CN201710142417.5A CN107871754B (zh) 2016-09-22 2017-03-10 用于红外辐射的具有提高的量子效率的图像传感器
US15/460,992 US10347677B2 (en) 2016-09-22 2017-03-16 Image sensor with improved quantum efficiency for infrared radiation
US16/414,409 US10475836B2 (en) 2016-09-22 2019-05-16 Image sensor with improved quantum efficiency for infrared radiation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR1658898A FR3056333B1 (fr) 2016-09-22 2016-09-22 Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges
FR1658898 2016-09-22

Publications (2)

Publication Number Publication Date
FR3056333A1 FR3056333A1 (fr) 2018-03-23
FR3056333B1 true FR3056333B1 (fr) 2018-10-19

Family

ID=57233743

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1658898A Expired - Fee Related FR3056333B1 (fr) 2016-09-22 2016-09-22 Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges

Country Status (3)

Country Link
US (2) US10347677B2 (fr)
CN (2) CN107871754B (fr)
FR (1) FR3056333B1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3056333B1 (fr) * 2016-09-22 2018-10-19 Stmicroelectronics (Crolles 2) Sas Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges
JP2021168316A (ja) * 2018-07-13 2021-10-21 ソニーセミコンダクタソリューションズ株式会社 センサ素子および電子機器
CN110739322A (zh) * 2018-07-18 2020-01-31 索尼半导体解决方案公司 受光元件以及测距模块
EP3605606B1 (fr) * 2018-08-03 2022-06-15 ams Sensors Belgium BVBA Système d'imagerie comprenant une source de lumière infrarouge et un capteur d'image
US10957727B2 (en) * 2018-09-26 2021-03-23 Semiconductor Components Industries, Llc Phase detection pixels with diffractive lenses
US20200227458A1 (en) * 2019-01-11 2020-07-16 Semiconductor Components Industries, Llc Image sensors with diffractive lenses in a semiconductor substrate
US11309348B2 (en) * 2019-09-11 2022-04-19 Taiwan Semiconductor Manufacturing Company, Ltd. High density image sensor
FR3102633B1 (fr) 2019-10-24 2022-08-05 St Microelectronics Crolles 2 Sas Capteur d'images
CN110767732B (zh) * 2019-10-31 2022-04-05 昆山国显光电有限公司 显示装置
US20220020787A1 (en) * 2020-07-17 2022-01-20 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device, semiconductor image sensor, and method of manufacturing the same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110164156A1 (en) * 2009-07-24 2011-07-07 Masao Hiramoto Image pickup device and solid-state image pickup element
FR2954587B1 (fr) * 2009-11-10 2012-07-20 St Microelectronics Sa Procede de formation d'un capteur d'images eclaire par la face arriere
JP5708025B2 (ja) * 2011-02-24 2015-04-30 ソニー株式会社 固体撮像装置、および、その製造方法、電子機器
US8716823B2 (en) * 2011-11-08 2014-05-06 Aptina Imaging Corporation Backside image sensor pixel with silicon microlenses and metal reflector
JP6303803B2 (ja) * 2013-07-03 2018-04-04 ソニー株式会社 固体撮像装置およびその製造方法
KR102159166B1 (ko) * 2014-05-09 2020-09-23 삼성전자주식회사 색분리 소자 및 상기 색분리 소자를 포함하는 이미지 센서
FR3056333B1 (fr) * 2016-09-22 2018-10-19 Stmicroelectronics (Crolles 2) Sas Capteur d'images a efficacite quantique amelioree pour les rayonnements infrarouges

Also Published As

Publication number Publication date
US20180083057A1 (en) 2018-03-22
FR3056333A1 (fr) 2018-03-23
US10347677B2 (en) 2019-07-09
CN207320115U (zh) 2018-05-04
CN107871754A (zh) 2018-04-03
CN107871754B (zh) 2022-06-03
US20190280032A1 (en) 2019-09-12
US10475836B2 (en) 2019-11-12

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