FR3054803B1 - Tampon de polissage poromerique effile - Google Patents

Tampon de polissage poromerique effile Download PDF

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Publication number
FR3054803B1
FR3054803B1 FR1757488A FR1757488A FR3054803B1 FR 3054803 B1 FR3054803 B1 FR 3054803B1 FR 1757488 A FR1757488 A FR 1757488A FR 1757488 A FR1757488 A FR 1757488A FR 3054803 B1 FR3054803 B1 FR 3054803B1
Authority
FR
France
Prior art keywords
large pores
polishing pad
tapered
polishing surface
degrees
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1757488A
Other languages
English (en)
Other versions
FR3054803A1 (fr
Inventor
Koichi Yoshida
Kazutaka Miyamoto
Katsumasa Kawabata
Henry Sanford-Crane
Hui Bin Huang
George C Jacob
Shuiyuan Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60996750&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=FR3054803(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of FR3054803A1 publication Critical patent/FR3054803A1/fr
Application granted granted Critical
Publication of FR3054803B1 publication Critical patent/FR3054803B1/fr
Active legal-status Critical Current
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Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)

Abstract

Le tampon de polissage en polyuréthane poreux comprend une matrice de polyuréthane poreuse ayant de gros pores s'étendant vers le haut à partir d'une surface de base et ouverts vers une surface de polissage. Une série de structures en oreiller est formée à partir de la matrice poreuse comprenant les gros pores et les petits pores. Les structures en oreiller ont une surface descendante s'étendant depuis la surface de polissage supérieure pour former des parois latérales inclinées vers le bas selon un angle de 30 à 60 degrés depuis la surface de polissage. Les gros pores s'ouvrent vers les parois latérales inclinées vers le bas et sont moins verticaux que les gros pores. Les gros pores sont décalés de 10 à 60 degrés par rapport à la direction verticale dans une direction plus orthogonale par rapport aux les parois latérales inclinées.
FR1757488A 2016-08-04 2017-08-03 Tampon de polissage poromerique effile Active FR3054803B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/228,988 US9925637B2 (en) 2016-08-04 2016-08-04 Tapered poromeric polishing pad
US15228988 2016-08-04

Publications (2)

Publication Number Publication Date
FR3054803A1 FR3054803A1 (fr) 2018-02-09
FR3054803B1 true FR3054803B1 (fr) 2021-08-06

Family

ID=60996750

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1757488A Active FR3054803B1 (fr) 2016-08-04 2017-08-03 Tampon de polissage poromerique effile

Country Status (7)

Country Link
US (1) US9925637B2 (fr)
JP (1) JP7011419B2 (fr)
KR (1) KR102376129B1 (fr)
CN (1) CN107685295B (fr)
DE (1) DE102017007338A1 (fr)
FR (1) FR3054803B1 (fr)
TW (1) TWI763693B (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11813712B2 (en) * 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US20210323115A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Leveraged poromeric polishing pad
US20210323116A1 (en) * 2020-04-18 2021-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Offset pore poromeric polishing pad
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad

Family Cites Families (32)

* Cited by examiner, † Cited by third party
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ATE93437T1 (de) * 1987-08-25 1993-09-15 Rodel Inc Material mit invertierter zellstruktur fuer schleif-, laepp-, form- und poliervorgaenge.
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
TW367551B (en) * 1993-06-17 1999-08-21 Freescale Semiconductor Inc Polishing pad and a process for polishing
US6284114B1 (en) * 1997-09-29 2001-09-04 Rodel Holdings Inc. Method of fabricating a porous polymeric material by electrophoretic deposition
US6422933B1 (en) * 1997-11-04 2002-07-23 Firma Carl Freudenberg Flexible, open-pored cleaning body
JPH11156699A (ja) 1997-11-25 1999-06-15 Speedfam Co Ltd 平面研磨用パッド
US6093651A (en) 1997-12-23 2000-07-25 Intel Corporation Polish pad with non-uniform groove depth to improve wafer polish rate uniformity
US6780095B1 (en) * 1997-12-30 2004-08-24 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
US6139402A (en) * 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
JP2001150332A (ja) 1999-11-22 2001-06-05 Nec Corp 研磨パッドおよび研磨方法
US6241596B1 (en) 2000-01-14 2001-06-05 Applied Materials, Inc. Method and apparatus for chemical mechanical polishing using a patterned pad
US6840843B2 (en) * 2001-03-01 2005-01-11 Cabot Microelectronics Corporation Method for manufacturing a polishing pad having a compressed translucent region
US6523215B2 (en) * 2001-04-04 2003-02-25 Saint-Gobain Abrasives Technology Company Polishing pad and system
WO2003032379A1 (fr) * 2001-10-09 2003-04-17 Hitachi Chemical Co., Ltd. Element de polissage pour procede cmp, procede de polissage de substrat comprenant l'utilisation de cet element, et procede de production d'un element de polissage pour cmp
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
JP4659338B2 (ja) * 2003-02-12 2011-03-30 Ｈｏｙａ株式会社 情報記録媒体用ガラス基板の製造方法並びにそれに使用する研磨パッド
US20050042976A1 (en) * 2003-08-22 2005-02-24 International Business Machines Corporation Low friction planarizing/polishing pads and use thereof
US6942549B2 (en) 2003-10-29 2005-09-13 International Business Machines Corporation Two-sided chemical mechanical polishing pad for semiconductor processing
US7186651B2 (en) 2003-10-30 2007-03-06 Texas Instruments Incorporated Chemical mechanical polishing method and apparatus
US7169029B2 (en) * 2004-12-16 2007-01-30 3M Innovative Properties Company Resilient structured sanding article
TWI411495B (zh) * 2007-08-16 2013-10-11 Cabot Microelectronics Corp 拋光墊
JP5297096B2 (ja) * 2007-10-03 2013-09-25 富士紡ホールディングス株式会社 研磨布
JP5421635B2 (ja) * 2009-03-30 2014-02-19 富士紡ホールディングス株式会社 研磨パッド
US8425278B2 (en) * 2009-08-26 2013-04-23 3M Innovative Properties Company Structured abrasive article and method of using the same
US8162728B2 (en) 2009-09-28 2012-04-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-pore structure polishing pad
JP5753677B2 (ja) * 2010-11-05 2015-07-22 富士紡ホールディングス株式会社 研磨パッドおよび研磨パッドの製造方法
US20130237136A1 (en) * 2010-11-18 2013-09-12 Cabot Microelectronics Corporation Polishing pad comprising transmissive region
WO2013011921A1 (fr) * 2011-07-15 2013-01-24 東レ株式会社 Tampon de polissage
JP5821133B2 (ja) * 2012-03-29 2015-11-24 富士紡ホールディングス株式会社 研磨パッド及び研磨パッドの製造方法
JP5917236B2 (ja) 2012-03-30 2016-05-11 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
US9956669B2 (en) 2013-03-12 2018-05-01 Kyushu University, National University Corporation Polishing pad and polishing method
JP6474191B2 (ja) * 2013-11-21 2019-02-27 富士紡ホールディングス株式会社 研磨パッドの製造方法及び研磨パッド

Also Published As

Publication number Publication date
US9925637B2 (en) 2018-03-27
TWI763693B (zh) 2022-05-11
CN107685295A (zh) 2018-02-13
DE102017007338A1 (de) 2018-02-08
TW201805112A (zh) 2018-02-16
FR3054803A1 (fr) 2018-02-09
US20180036862A1 (en) 2018-02-08
JP2018039104A (ja) 2018-03-15
JP7011419B2 (ja) 2022-01-26
KR20180016287A (ko) 2018-02-14
KR102376129B1 (ko) 2022-03-18
CN107685295B (zh) 2019-06-04

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