FR3009667B1 - Procede de fabrication d'une carte de circuit imprime pour retroviseur de vehicule - Google Patents

Procede de fabrication d'une carte de circuit imprime pour retroviseur de vehicule

Info

Publication number
FR3009667B1
FR3009667B1 FR1457611A FR1457611A FR3009667B1 FR 3009667 B1 FR3009667 B1 FR 3009667B1 FR 1457611 A FR1457611 A FR 1457611A FR 1457611 A FR1457611 A FR 1457611A FR 3009667 B1 FR3009667 B1 FR 3009667B1
Authority
FR
France
Prior art keywords
manufacturing
circuit board
printed circuit
vehicle mirror
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1457611A
Other languages
English (en)
Other versions
FR3009667A1 (fr
Inventor
Andreas Herrmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SMR Patents SARL
Original Assignee
SMR Patents SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SMR Patents SARL filed Critical SMR Patents SARL
Publication of FR3009667A1 publication Critical patent/FR3009667A1/fr
Application granted granted Critical
Publication of FR3009667B1 publication Critical patent/FR3009667B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R1/00—Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
    • B60R1/02—Rear-view mirror arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R1/00—Optical viewing arrangements; Real-time viewing arrangements for drivers or passengers using optical image capturing systems, e.g. cameras or video systems specially adapted for use in or on vehicles
    • B60R1/12—Mirror assemblies combined with other articles, e.g. clocks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09963—Programming circuit by using small elements, e.g. small PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
FR1457611A 2013-08-07 2014-08-05 Procede de fabrication d'une carte de circuit imprime pour retroviseur de vehicule Active FR3009667B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013108535.0A DE102013108535A1 (de) 2013-08-07 2013-08-07 Verfahren zum Herstellen einer Platine, Platine und Rückblickvorrichtung

Publications (2)

Publication Number Publication Date
FR3009667A1 FR3009667A1 (fr) 2015-02-13
FR3009667B1 true FR3009667B1 (fr) 2018-01-26

Family

ID=51494935

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1457611A Active FR3009667B1 (fr) 2013-08-07 2014-08-05 Procede de fabrication d'une carte de circuit imprime pour retroviseur de vehicule

Country Status (5)

Country Link
US (1) US20150043188A1 (fr)
CN (1) CN104349591A (fr)
DE (1) DE102013108535A1 (fr)
FR (1) FR3009667B1 (fr)
GB (1) GB2519191B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3139712A1 (fr) 2015-09-03 2017-03-08 SMR Patents S.à.r.l. Unité à carte de circuit électronique, module électronique et dispositif de vision arrière pour un véhicule
WO2017116544A1 (fr) * 2015-12-30 2017-07-06 Continental Automotive Systems, Inc. Ensemble carte de circuit imprimé modulaire
AT519441A1 (de) * 2016-11-04 2018-06-15 Zkw Group Gmbh Ansteuerplatine für einen Kraftfahrzeugscheinwerfer
DE102017211578A1 (de) * 2017-07-06 2019-01-10 Zf Friedrichshafen Ag Elektronikmodul, Aktuatoreinrichtung und Verfahren zum Herstellen einer Aktuatoreinrichtung
CN111511110B (zh) * 2020-03-31 2022-08-02 宁波吉利汽车研究开发有限公司 一种电路板结构及应用其的保险丝盒

Family Cites Families (26)

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DE3209914A1 (de) * 1982-03-18 1983-09-29 Robert Bosch Gmbh, 7000 Stuttgart Hoergeraet mit einer verstaerkerschaltung
FR2591054B1 (fr) * 1985-08-29 1989-05-12 Merlin Gerin Montage de cartes de circuit imprime
US4990462A (en) * 1989-04-12 1991-02-05 Advanced Micro Devices, Inc. Method for coplanar integration of semiconductor ic devices
US5110298A (en) * 1990-07-26 1992-05-05 Motorola, Inc. Solderless interconnect
US5219292A (en) * 1992-04-03 1993-06-15 Motorola, Inc. Printed circuit board interconnection
US5325267A (en) * 1992-11-25 1994-06-28 Xerox Corporation Remote driver board having input/output connector circuitry molded therein
US6019475A (en) * 1994-09-30 2000-02-01 Donnelly Corporation Modular rearview mirror assembly including an electronic control module
US5938455A (en) * 1996-05-15 1999-08-17 Ford Motor Company Three-dimensional molded circuit board having interlocking connections
DE19640684A1 (de) * 1996-10-02 1998-04-09 Teves Gmbh Alfred Mikroschalteranordnung für Bedienelemente von Kraftahrzeugschaltern
DE29623310U1 (de) * 1996-11-15 1998-02-19 Leopold Kostal GmbH & Co KG, 58507 Lüdenscheid Dachmodul
JPH11261186A (ja) * 1998-03-11 1999-09-24 Omron Corp モジュール基板およびこれを用いたモジュール基板実装構造
DE19951916C1 (de) * 1999-10-28 2001-01-25 Brose Fahrzeugteile Elektronische Steuerungseinrichtung zur Ansteuerung elektrischer Aggregate von Kraftfahrzeugtüren mit unterschiedlicher Ausstattung
DE10004162A1 (de) * 2000-02-01 2001-08-09 Bosch Gmbh Robert Verfahren zur Kontaktierung einer Leiterplatte mit einer auf einem Träger angeordneten Leiterbahn und Vorrichtung
US6412959B1 (en) * 2000-08-09 2002-07-02 Huan Chin Tseng Rear view mirror device having displayer or monitor
DE10105621B4 (de) * 2001-02-08 2010-09-23 Insta Elektro Gmbh Elektrische Leiterplatte
US7329013B2 (en) * 2002-06-06 2008-02-12 Donnelly Corporation Interior rearview mirror system with compass
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CN102256451B (zh) * 2010-05-20 2013-05-08 深南电路有限公司 埋入片式器件的印刷电路板及其制造方法
DE102010062759A1 (de) * 2010-12-09 2012-06-14 Zf Friedrichshafen Ag Leiterplattenanordnung
DE102011000138A1 (de) 2011-01-14 2012-07-19 Lpkf Laser & Electronics Ag Verfahren zur selektiven Metallisierung eines Substrats sowie ein nach diesem Verfahren hergestellter Schaltungsträger
DE102011081554A1 (de) 2011-08-25 2013-02-28 Lpkf Laser & Electronics Ag Verfahren und Vorrichtung zum Laserschweißen von zwei Fügepartnern aus Kunststoff
CN203211203U (zh) * 2012-11-29 2013-09-25 信利半导体有限公司 一种防眩后视镜
US9084362B2 (en) * 2013-01-08 2015-07-14 Nvidia Corporation Reducing impedance of a printed circuit board through a square wave pattern of plated-through holes

Also Published As

Publication number Publication date
US20150043188A1 (en) 2015-02-12
GB2519191A9 (en) 2018-05-02
CN104349591A (zh) 2015-02-11
GB2519191A (en) 2015-04-15
GB2519191B (en) 2018-07-18
GB201412958D0 (en) 2014-09-03
DE102013108535A1 (de) 2015-02-12
FR3009667A1 (fr) 2015-02-13

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