FR3008543B1 - Procede de localisation de dispositifs - Google Patents
Procede de localisation de dispositifsInfo
- Publication number
- FR3008543B1 FR3008543B1 FR1301697A FR1301697A FR3008543B1 FR 3008543 B1 FR3008543 B1 FR 3008543B1 FR 1301697 A FR1301697 A FR 1301697A FR 1301697 A FR1301697 A FR 1301697A FR 3008543 B1 FR3008543 B1 FR 3008543B1
- Authority
- FR
- France
- Prior art keywords
- locating devices
- locating
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14687—Wafer level processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Die Bonding (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Electrodes Of Semiconductors (AREA)
- Micromachines (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1301697A FR3008543B1 (fr) | 2013-07-15 | 2013-07-15 | Procede de localisation de dispositifs |
PCT/FR2014/051568 WO2015007971A1 (fr) | 2013-07-15 | 2014-06-24 | Procede de localisation de dispositifs |
JP2016526673A JP6463751B2 (ja) | 2013-07-15 | 2014-06-24 | デバイスを位置決めするための方法 |
SG11201510638XA SG11201510638XA (en) | 2013-07-15 | 2014-06-24 | Process for locating devices |
DE112014003280.8T DE112014003280T5 (de) | 2013-07-15 | 2014-06-24 | Verfahren zum Lokalisieren von Vorrichtungen |
ATA9279/2014A AT521083B1 (de) | 2013-07-15 | 2014-06-24 | Verfahren zum Lokalisieren von Vorrichtungen |
KR1020167001033A KR102218891B1 (ko) | 2013-07-15 | 2014-06-24 | 디바이스를 위치시키는 방법 |
US14/903,961 US20160197006A1 (en) | 2013-07-15 | 2014-06-24 | Method for locating devices |
US16/685,938 US11088016B2 (en) | 2013-07-15 | 2019-11-15 | Method for locating devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1301697A FR3008543B1 (fr) | 2013-07-15 | 2013-07-15 | Procede de localisation de dispositifs |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3008543A1 FR3008543A1 (fr) | 2015-01-16 |
FR3008543B1 true FR3008543B1 (fr) | 2015-07-17 |
Family
ID=49546458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1301697A Active FR3008543B1 (fr) | 2013-07-15 | 2013-07-15 | Procede de localisation de dispositifs |
Country Status (8)
Country | Link |
---|---|
US (2) | US20160197006A1 (fr) |
JP (1) | JP6463751B2 (fr) |
KR (1) | KR102218891B1 (fr) |
AT (1) | AT521083B1 (fr) |
DE (1) | DE112014003280T5 (fr) |
FR (1) | FR3008543B1 (fr) |
SG (1) | SG11201510638XA (fr) |
WO (1) | WO2015007971A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3076292B1 (fr) * | 2017-12-28 | 2020-01-03 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de transfert d'une couche utile sur un substrat support |
FR3079659B1 (fr) * | 2018-03-29 | 2020-03-13 | Soitec | Procede de fabrication d'un substrat donneur pour la realisation d'une structure integree en trois dimensions et procede de fabrication d'une telle structure integree |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2628555B2 (ja) | 1988-03-22 | 1997-07-09 | 富士通株式会社 | 半導体装置の製造方法 |
KR0155835B1 (ko) * | 1995-06-23 | 1998-12-01 | 김광호 | 반도체 장치의 얼라인 키 패턴 형성방법 |
KR100543393B1 (ko) * | 2000-03-09 | 2006-01-20 | 후지쯔 가부시끼가이샤 | 반도체 장치 및 그 제조 방법 |
JP2005142252A (ja) * | 2003-11-05 | 2005-06-02 | Sony Corp | アライメントマークの形成方法および半導体装置の製造方法および半導体装置 |
EP1571705A3 (fr) | 2004-03-01 | 2006-01-04 | S.O.I.Tec Silicon on Insulator Technologies | Réalisation d'une entité en matériau semiconducteur sur substrat |
KR101236211B1 (ko) * | 2008-08-27 | 2013-02-25 | 소이텍 | 선택되거나 제어된 격자 파라미터들을 갖는 반도체 물질층들을 이용하여 반도체 구조물들 또는 소자들을 제조하는 방법 |
JP5196160B2 (ja) * | 2008-10-17 | 2013-05-15 | 日亜化学工業株式会社 | 半導体発光素子 |
US8536629B2 (en) | 2009-02-24 | 2013-09-17 | Nec Corporation | Semiconductor device and method for manufacturing the same |
US8058137B1 (en) * | 2009-04-14 | 2011-11-15 | Monolithic 3D Inc. | Method for fabrication of a semiconductor device and structure |
WO2011132654A1 (fr) | 2010-04-20 | 2011-10-27 | 住友電気工業株式会社 | Procédé de production d'un substrat composite |
JP5440442B2 (ja) * | 2010-08-18 | 2014-03-12 | 株式会社リコー | 光走査装置及び画像形成装置 |
WO2012042653A1 (fr) * | 2010-09-30 | 2012-04-05 | 富士電機株式会社 | Procédé de fabrication d'un dispositif semi-conducteur |
US8502389B2 (en) * | 2011-08-08 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | CMOS image sensor and method for forming the same |
US8779539B2 (en) * | 2011-09-21 | 2014-07-15 | United Microelectronics Corporation | Image sensor and method for fabricating the same |
FR3005648B1 (fr) * | 2013-05-15 | 2016-02-12 | Commissariat Energie Atomique | Procede d'encapsulation d'un dispositif microelectronique comprenant une injection de gaz noble a travers un materiau permeable a ce gaz noble |
-
2013
- 2013-07-15 FR FR1301697A patent/FR3008543B1/fr active Active
-
2014
- 2014-06-24 JP JP2016526673A patent/JP6463751B2/ja active Active
- 2014-06-24 SG SG11201510638XA patent/SG11201510638XA/en unknown
- 2014-06-24 DE DE112014003280.8T patent/DE112014003280T5/de active Pending
- 2014-06-24 AT ATA9279/2014A patent/AT521083B1/de active
- 2014-06-24 US US14/903,961 patent/US20160197006A1/en not_active Abandoned
- 2014-06-24 KR KR1020167001033A patent/KR102218891B1/ko active IP Right Grant
- 2014-06-24 WO PCT/FR2014/051568 patent/WO2015007971A1/fr active Application Filing
-
2019
- 2019-11-15 US US16/685,938 patent/US11088016B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20200161172A1 (en) | 2020-05-21 |
KR102218891B1 (ko) | 2021-02-24 |
WO2015007971A1 (fr) | 2015-01-22 |
KR20160031489A (ko) | 2016-03-22 |
JP2016527717A (ja) | 2016-09-08 |
JP6463751B2 (ja) | 2019-02-06 |
AT521083B1 (de) | 2020-04-15 |
US20160197006A1 (en) | 2016-07-07 |
DE112014003280T5 (de) | 2016-04-14 |
US11088016B2 (en) | 2021-08-10 |
AT521083A2 (de) | 2019-10-15 |
AT521083A3 (de) | 2019-12-15 |
FR3008543A1 (fr) | 2015-01-16 |
SG11201510638XA (en) | 2016-01-28 |
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Legal Events
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