FR2977984B1 - Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur - Google Patents
Generateur thermoelectrique integre, et circuit integre comprenant un tel generateurInfo
- Publication number
- FR2977984B1 FR2977984B1 FR1156417A FR1156417A FR2977984B1 FR 2977984 B1 FR2977984 B1 FR 2977984B1 FR 1156417 A FR1156417 A FR 1156417A FR 1156417 A FR1156417 A FR 1156417A FR 2977984 B1 FR2977984 B1 FR 2977984B1
- Authority
- FR
- France
- Prior art keywords
- generator
- integrated
- conductivity
- integrated circuit
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Semiconductor Integrated Circuits (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1156417A FR2977984B1 (fr) | 2011-07-13 | 2011-07-13 | Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur |
| US13/549,248 US9177994B2 (en) | 2011-07-13 | 2012-07-13 | Integrated thermoelectric generator |
| US14/930,204 US9490415B2 (en) | 2011-07-13 | 2015-11-02 | Integrated thermoelectric generator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1156417A FR2977984B1 (fr) | 2011-07-13 | 2011-07-13 | Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2977984A1 FR2977984A1 (fr) | 2013-01-18 |
| FR2977984B1 true FR2977984B1 (fr) | 2013-07-05 |
Family
ID=45350858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1156417A Expired - Fee Related FR2977984B1 (fr) | 2011-07-13 | 2011-07-13 | Generateur thermoelectrique integre, et circuit integre comprenant un tel generateur |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US9177994B2 (fr) |
| FR (1) | FR2977984B1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2972571A1 (fr) * | 2011-03-09 | 2012-09-14 | St Microelectronics Crolles 2 | Générateur thermoélectrique |
| JP5979240B2 (ja) * | 2012-10-10 | 2016-08-24 | 富士通株式会社 | 熱電変換装置および電子装置 |
| DE112013006978B4 (de) * | 2013-06-18 | 2021-12-16 | Intel Corporation | Integrierte thermoelektrische Kühlung |
| US11424399B2 (en) | 2015-07-07 | 2022-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Integrated thermoelectric devices in Fin FET technology |
| CN108615697B (zh) * | 2016-12-09 | 2020-11-03 | 矽电半导体设备(深圳)股份有限公司 | 自动上下芯片装置 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01245549A (ja) * | 1988-03-26 | 1989-09-29 | Matsushita Electric Works Ltd | 半導体装置およびその製法 |
| US6597051B2 (en) * | 2001-05-22 | 2003-07-22 | Yeda Research And Development Co. Ltd. | Thermoelectric infrared detector |
| US7205675B2 (en) * | 2003-01-29 | 2007-04-17 | Hewlett-Packard Development Company, L.P. | Micro-fabricated device with thermoelectric device and method of making |
| US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
| US20050139250A1 (en) * | 2003-12-02 | 2005-06-30 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
| DE602007002805D1 (de) * | 2006-04-20 | 2009-11-26 | Nxp Bv | Verfahren und vorrichtung zur bestimmung der temperatur eines halbleitersubstrats |
| TWI338390B (en) * | 2007-07-12 | 2011-03-01 | Ind Tech Res Inst | Flexible thermoelectric device and manufacturing method thereof |
| US20090056345A1 (en) * | 2007-08-29 | 2009-03-05 | Texas Instruments Incorporated | Nanoscale thermoelectric refrigerator |
| JP2010109132A (ja) * | 2008-10-30 | 2010-05-13 | Yamaha Corp | 熱電モジュールを備えたパッケージおよびその製造方法 |
| DE102009000333A1 (de) * | 2009-01-20 | 2010-07-22 | Ihp Gmbh - Innovations For High Performance Microelectronics / Leibniz-Institut Für Innovative Mikroelektronik | Thermoelektrisches Halbleiterbauelement |
| JP5515721B2 (ja) * | 2009-12-21 | 2014-06-11 | 富士通株式会社 | 熱電変換モジュールの製造方法 |
| US10224474B2 (en) * | 2013-01-08 | 2019-03-05 | Analog Devices, Inc. | Wafer scale thermoelectric energy harvester having interleaved, opposing thermoelectric legs and manufacturing techniques therefor |
| US9231025B2 (en) * | 2014-05-30 | 2016-01-05 | Texas Instruments Incorporated | CMOS-based thermoelectric device with reduced electrical resistance |
-
2011
- 2011-07-13 FR FR1156417A patent/FR2977984B1/fr not_active Expired - Fee Related
-
2012
- 2012-07-13 US US13/549,248 patent/US9177994B2/en active Active
-
2015
- 2015-11-02 US US14/930,204 patent/US9490415B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20160056364A1 (en) | 2016-02-25 |
| FR2977984A1 (fr) | 2013-01-18 |
| US20130015549A1 (en) | 2013-01-17 |
| US9177994B2 (en) | 2015-11-03 |
| US9490415B2 (en) | 2016-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |
Effective date: 20150331 |