FR2967368B1 - Procede de preparation d'un tampon a polir contenant du silicate - Google Patents
Procede de preparation d'un tampon a polir contenant du silicateInfo
- Publication number
- FR2967368B1 FR2967368B1 FR1160259A FR1160259A FR2967368B1 FR 2967368 B1 FR2967368 B1 FR 2967368B1 FR 1160259 A FR1160259 A FR 1160259A FR 1160259 A FR1160259 A FR 1160259A FR 2967368 B1 FR2967368 B1 FR 2967368B1
- Authority
- FR
- France
- Prior art keywords
- silicate
- preparing
- polishing pad
- containing polishing
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0054—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impressing abrasive powder in a matrix
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/945,504 US8202334B2 (en) | 2010-11-12 | 2010-11-12 | Method of forming silicate polishing pad |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2967368A1 FR2967368A1 (fr) | 2012-05-18 |
FR2967368B1 true FR2967368B1 (fr) | 2015-08-21 |
Family
ID=45999143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1160259A Active FR2967368B1 (fr) | 2010-11-12 | 2011-11-10 | Procede de preparation d'un tampon a polir contenant du silicate |
Country Status (7)
Country | Link |
---|---|
US (1) | US8202334B2 (fr) |
JP (1) | JP5845832B2 (fr) |
KR (1) | KR101861372B1 (fr) |
CN (1) | CN102463531B (fr) |
DE (1) | DE102011117944B4 (fr) |
FR (1) | FR2967368B1 (fr) |
TW (1) | TWI593509B (fr) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8894732B2 (en) * | 2012-05-11 | 2014-11-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Hollow polymeric-alkaline earth metal oxide composite |
US8888877B2 (en) * | 2012-05-11 | 2014-11-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Forming alkaline-earth metal oxide polishing pad |
US9073172B2 (en) | 2012-05-11 | 2015-07-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Alkaline-earth metal oxide-polymeric polishing pad |
US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
US11524390B2 (en) * | 2017-05-01 | 2022-12-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Methods of making chemical mechanical polishing layers having improved uniformity |
KR102293801B1 (ko) * | 2019-11-28 | 2021-08-25 | 에스케이씨솔믹스 주식회사 | 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5447275A (en) | 1993-01-29 | 1995-09-05 | Canon Kabushiki Kaisha | Toner production process |
JP3984833B2 (ja) * | 2001-01-16 | 2007-10-03 | キヤノン株式会社 | 現像剤担持体の再生方法 |
JP2003062748A (ja) * | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
US6986705B2 (en) * | 2004-04-05 | 2006-01-17 | Rimpad Tech Ltd. | Polishing pad and method of making same |
JP5478066B2 (ja) * | 2006-08-21 | 2014-04-23 | 株式会社日本触媒 | 微粒子、微粒子の製造方法、この微粒子を含む樹脂組成物および光学フィルム |
JP5222586B2 (ja) * | 2008-02-29 | 2013-06-26 | 富士紡ホールディングス株式会社 | 研磨パッドおよび研磨パッドの製造方法 |
JP2009254938A (ja) * | 2008-04-14 | 2009-11-05 | Nippon Shokubai Co Ltd | 粒子の分級方法およびその方法を用いて得られる粒子 |
JP5543717B2 (ja) * | 2009-02-13 | 2014-07-09 | 積水化学工業株式会社 | 熱膨張性マイクロカプセル及び熱膨張性マイクロカプセルの製造方法 |
US7947098B2 (en) | 2009-04-27 | 2011-05-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects |
-
2010
- 2010-11-12 US US12/945,504 patent/US8202334B2/en active Active
-
2011
- 2011-11-08 TW TW100140662A patent/TWI593509B/zh active
- 2011-11-08 DE DE102011117944.9A patent/DE102011117944B4/de active Active
- 2011-11-10 JP JP2011246631A patent/JP5845832B2/ja active Active
- 2011-11-10 FR FR1160259A patent/FR2967368B1/fr active Active
- 2011-11-11 KR KR1020110117501A patent/KR101861372B1/ko active IP Right Grant
- 2011-11-11 CN CN201110371460.1A patent/CN102463531B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
TW201221293A (en) | 2012-06-01 |
JP2012101353A (ja) | 2012-05-31 |
US20120117889A1 (en) | 2012-05-17 |
US8202334B2 (en) | 2012-06-19 |
KR101861372B1 (ko) | 2018-05-28 |
DE102011117944B4 (de) | 2023-06-29 |
FR2967368A1 (fr) | 2012-05-18 |
DE102011117944A1 (de) | 2012-05-16 |
TWI593509B (zh) | 2017-08-01 |
JP5845832B2 (ja) | 2016-01-20 |
CN102463531B (zh) | 2014-10-01 |
CN102463531A (zh) | 2012-05-23 |
KR20120057518A (ko) | 2012-06-05 |
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Legal Events
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