FR2966286B1 - COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER - Google Patents

COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER

Info

Publication number
FR2966286B1
FR2966286B1 FR1058366A FR1058366A FR2966286B1 FR 2966286 B1 FR2966286 B1 FR 2966286B1 FR 1058366 A FR1058366 A FR 1058366A FR 1058366 A FR1058366 A FR 1058366A FR 2966286 B1 FR2966286 B1 FR 2966286B1
Authority
FR
France
Prior art keywords
printed circuit
components
leds
thickness
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1058366A
Other languages
French (fr)
Other versions
FR2966286A1 (en
Inventor
Alain Eyraud
Jean-Claude Gas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SGAME
Original Assignee
SGAME
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGAME filed Critical SGAME
Priority to FR1058366A priority Critical patent/FR2966286B1/en
Publication of FR2966286A1 publication Critical patent/FR2966286A1/en
Application granted granted Critical
Publication of FR2966286B1 publication Critical patent/FR2966286B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Devices (AREA)

Abstract

The components (2, 10) have an isolated type metal support type specific printed circuit (4) whose dimensions correspond to that of LEDs (3), where thickness of the specific printed circuit corresponds to thickness of a standard printed circuit (1) for receiving other components e.g. current regulating devices. The specific printed circuit is provided with bonding pads for welding connections or threads to ensure electrical conduction between the LEDs and conductive tracks of the standard printed circuit. The standard printed circuit is pierced with crossing orifices (11). An independent claim is also included for an electronic component comprising a heat energy dissipating element at which the unitary or elementary components are arranged.
FR1058366A 2010-10-14 2010-10-14 COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER Active FR2966286B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1058366A FR2966286B1 (en) 2010-10-14 2010-10-14 COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1058366A FR2966286B1 (en) 2010-10-14 2010-10-14 COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER

Publications (2)

Publication Number Publication Date
FR2966286A1 FR2966286A1 (en) 2012-04-20
FR2966286B1 true FR2966286B1 (en) 2013-06-14

Family

ID=44070034

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1058366A Active FR2966286B1 (en) 2010-10-14 2010-10-14 COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER

Country Status (1)

Country Link
FR (1) FR2966286B1 (en)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6498355B1 (en) * 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
US6501103B1 (en) * 2001-10-23 2002-12-31 Lite-On Electronics, Inc. Light emitting diode assembly with low thermal resistance
JP2006005290A (en) * 2004-06-21 2006-01-05 Citizen Electronics Co Ltd Light emitting diode
KR100641889B1 (en) * 2005-04-01 2006-11-06 박병재 Light emitting diode structure
KR101305884B1 (en) * 2006-01-06 2013-09-06 엘지이노텍 주식회사 Light emitting diode package, manufacturing method thereof and Back light unit having the same
WO2008126564A1 (en) * 2007-03-12 2008-10-23 Toyo Tanso Co., Ltd. Radiating member, circuit board using the member, electronic part module, and method for manufacturing the module
TWI356486B (en) * 2007-09-07 2012-01-11 Young Lighting Technology Led light source module and manufacturing method t

Also Published As

Publication number Publication date
FR2966286A1 (en) 2012-04-20

Similar Documents

Publication Publication Date Title
CN203131524U (en) Bendable light-emitting diode (LED) light source module
KR101044200B1 (en) A rigid-flexible circuit board and a method of manufacturing the same
ATE453311T1 (en) CIRCUIT BOARD WITH ADDITIONAL FUNCTIONAL ELEMENTS AND MANUFACTURING METHOD AND APPLICATION
EP2450613A3 (en) Lighting device
IN2014DN08073A (en)
ATE532400T1 (en) HEAT-CONDUCTIVE MOUNTING ELEMENT FOR ATTACHING AN EMBLED CIRCUIT BOARD TO A HEATSINK
KR101130137B1 (en) Led module
EP2475236A3 (en) Power Switching Circuitry
MY158237A (en) Electronic control unit
EP1703554A3 (en) Power semiconductor module
EP1701380A3 (en) Semiconductor power module
PH22016000060Y1 (en) A packaging structure for a laser diode
CN104247581A (en) Surface-mounting substrate
JP2016040806A (en) Wiring board and electronic apparatus
WO2014209502A3 (en) Integrated electrical components of a welding power supply
WO2012011701A3 (en) Radiant heat circuit board and method for manufacturing the same
GB2532869A (en) Semiconductor die and package jigsaw submount
TW201130108A (en) High-density integrated circuit module structure
WO2013063625A3 (en) Synchronous rectifier
SG161124A1 (en) Insulated metal substrate and method of forming the same
CN203151860U (en) Bendable metal-base printed circuit board
US9648750B2 (en) Light emitting diode (LED) assembly and flexible circuit board with improved thermal conductivity
JP2015211196A5 (en)
FR2966286B1 (en) COMPONENT FOR ELECTROLUMINESCENT DIODES, IN PARTICULAR POWER
TW200509769A (en) Structure of terminal member

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 6

PLFP Fee payment

Year of fee payment: 7

PLFP Fee payment

Year of fee payment: 8

PLFP Fee payment

Year of fee payment: 9

PLFP Fee payment

Year of fee payment: 10

PLFP Fee payment

Year of fee payment: 11

PLFP Fee payment

Year of fee payment: 12

PLFP Fee payment

Year of fee payment: 13

PLFP Fee payment

Year of fee payment: 14