MY158237A - Electronic control unit - Google Patents

Electronic control unit

Info

Publication number
MY158237A
MY158237A MYPI2011004594A MYPI2011004594A MY158237A MY 158237 A MY158237 A MY 158237A MY PI2011004594 A MYPI2011004594 A MY PI2011004594A MY PI2011004594 A MYPI2011004594 A MY PI2011004594A MY 158237 A MY158237 A MY 158237A
Authority
MY
Malaysia
Prior art keywords
semi
metal plate
control unit
extending
electronic control
Prior art date
Application number
MYPI2011004594A
Inventor
Oota Shinsuke
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of MY158237A publication Critical patent/MY158237A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A SEMI-CONDUCTOR MODULE (6) MOUNTED TO A CIRCUIT BOARD (3) HAS A METAL PLATE PORTION (64) ELECTRICALLY CONNECTED TO A SEMI-CONDUCTOR CHIP (61). THE METAL PLATE PORTION (64) HAS AN EXTENDING PORTION (66) EXTENDING FROM A RESIN BODY PORTION (62) OF THE SEMI-CONDUCTOR MODULE (6). A PROJECTING PORTION (71), WHICH IS PROJECTING TOWARD TO THE EXTENDING PORTION (66) OF THE METAL PLATE PORTION (64), IS FORMED LN A COVER MEMBER (7). A HEAT TRANSFERRING MEMBER (81) IS PROVIDED IN A SPACE BETWEEN THE PROJECTING PORTION (71) AND THE EXTENDING PORTION (66), SO THAT HEAT GENERATED AT THE SEMI-CONDUCTOR MODULE (6) IS TRANSMITTED TO THE COVER MEMBER (7) VIA THE METAL PLATE MEMBER (64) AND THE HEAT TRANSFERRING MEMBER (81).
MYPI2011004594A 2010-09-30 2011-09-27 Electronic control unit MY158237A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010220747A JP5418851B2 (en) 2010-09-30 2010-09-30 Electronic control unit

Publications (1)

Publication Number Publication Date
MY158237A true MY158237A (en) 2016-09-30

Family

ID=46239681

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011004594A MY158237A (en) 2010-09-30 2011-09-27 Electronic control unit

Country Status (3)

Country Link
JP (1) JP5418851B2 (en)
CN (1) CN102569221B (en)
MY (1) MY158237A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6035952B2 (en) * 2012-07-27 2016-11-30 Tdk株式会社 Power supply
JP6177510B2 (en) * 2012-09-13 2017-08-09 株式会社デンソー Electronic control unit
JP5725055B2 (en) 2013-02-12 2015-05-27 株式会社デンソー Electronic control unit
ITTO20140012U1 (en) * 2014-01-23 2015-07-23 Johnson Electric Asti S R L VOLTAGE REGULATOR FOR A COOLING ELECTRIC FAN, IN PARTICULAR FOR A HEAT EXCHANGER OF A MOTOR VEHICLE
JP6287659B2 (en) * 2014-07-22 2018-03-07 株式会社オートネットワーク技術研究所 Circuit structure
JP6198068B2 (en) * 2014-11-19 2017-09-20 株式会社デンソー Electronic equipment
JP6201966B2 (en) * 2014-11-25 2017-09-27 株式会社デンソー Electronic equipment
JP6287815B2 (en) * 2014-12-24 2018-03-07 株式会社オートネットワーク技術研究所 Method for manufacturing circuit structure
JP7054993B2 (en) * 2017-05-11 2022-04-15 日本電産サンキョー株式会社 Drive
JP2018006765A (en) * 2017-08-28 2018-01-11 株式会社デンソー Electronic device
US20200404803A1 (en) * 2017-12-14 2020-12-24 Autonetworks Technologies, Ltd. Circuit assembly and electrical junction box
JP2019161136A (en) * 2018-03-16 2019-09-19 株式会社トランストロン Electronic apparatus, and manufacturing method for electronic apparatus
JP7127498B2 (en) 2018-11-09 2022-08-30 住友電装株式会社 Heat dissipation material and electric connection box
JP7172471B2 (en) 2018-11-09 2022-11-16 住友電装株式会社 Substrate structure
JP2020182293A (en) * 2019-04-24 2020-11-05 株式会社デンソー Rotary actuator
JP7180523B2 (en) * 2019-04-24 2022-11-30 株式会社デンソー rotary actuator

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60143654A (en) * 1983-12-29 1985-07-29 Matsushita Electric Ind Co Ltd Electronic parts
FR2588122B1 (en) * 1985-10-01 1988-06-24 Radiotechnique Compelec SEMICONDUCTOR POWER DEVICE FOR SURFACE MOUNTING
JPH06349980A (en) * 1993-06-03 1994-12-22 Canon Inc Semiconductor element
JP2002134970A (en) * 2000-10-26 2002-05-10 Denso Corp Electronic controller
JP4084984B2 (en) * 2002-10-23 2008-04-30 株式会社ルネサステクノロジ Manufacturing method of semiconductor device
JP4029822B2 (en) * 2003-10-27 2008-01-09 三菱電機株式会社 Electronic circuit equipment
JP2009054701A (en) * 2007-08-24 2009-03-12 Hitachi Kokusai Electric Inc Electronic component heat dissipating structure
JP4407759B2 (en) * 2008-03-04 2010-02-03 株式会社デンソー Electronic control unit

Also Published As

Publication number Publication date
CN102569221B (en) 2014-10-22
CN102569221A (en) 2012-07-11
JP5418851B2 (en) 2014-02-19
JP2012079741A (en) 2012-04-19

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