FR2958435A1 - PHOTOELECTRIC CHIP MOUNTED ON WAVY GUIDE WIRE. - Google Patents

Abstract

The present invention relates to a security document (20), comprising: - at least one waveguide wire (10), - at least one photoelectric chip (40) fixed to said waveguide wire (10), so as to being activated by a light transmitted to said chip by said waveguide wire, - at least one input surface (25) for the light, allowing when illuminated to introduce light into the waveguide wire.

Description

The present invention relates to security documents and more particularly to those comprising a photoelectric chip. "Photoelectric chip" means an electronic device activated by light, visible or not, and emitting in response to activation by light a radio frequency signal. Photoelectric chips emitting, when activated by light, a radio frequency signal are known, in particular publications US 2004/0052203 A1, US 5 874 724, US 2008/0174436 A1, WO 2008/091826 A1., WO 02/37721. and US 2003/0172968 Al.

The invention aims more particularly at integrating a photoelectric chip in a security document. "Security documents" means documents such as banknotes, passports, identity cards, vouchers, driving licenses. interactive playing or collectible cards, payment methods, including payment cards, gift vouchers, transport cards, loyalty cards, benefit cards, and subscription cards. The object of the invention is, according to a first aspect, a security document, comprising - a waveguide wire, - a photoelectric chip fixed to the waveguide wire, so as to be activated by a light transmitted to the chip by the waveguide wire, - an input surface for the light, allowing when illuminated to introduce light into the waveguide. The invention makes it possible to use the wave guided wire to manipulate the photoelectric chip when it is put in place in the security document. The wire can help maintain the photoelectric chip within the document, which can be used to at least partially protect it from moisture, direct light, and mechanical shock. According to a particular embodiment of the invention, the photoelectric chip comprises an optical light energy sensor which is in contact with the waveguide wire. The optical sensor may be a photovoltaic sensor generating an electrical voltage when subjected to incident light energy.

The waveguide wire may extend from a first edge of the document to a second edge opposite the first edge. These edges may have been made by cutting the document. The security document may comprise a fibrous substrate, for example a paper. The waveguide wire may extend in the thickness of the fibrous substrate, which may make it possible to avoid generating an excess thickness and to obtain a security document of constant thickness. The document can thus be without excess thickness at the level of the waveguide wire and the photoelectric chip. Advantageously, this configuration according to the invention protects the chip, for example against shocks, pulling and moisture. In addition the chip is hidden which makes the chip difficult to detect and provides additional security. The chip can not be removed without damaging the article because it is integral with the waveguide wire and the latter is taken into the mass of the fibrous substrate. Finally, the constant thickness of the document facilitates subsequent printing steps. The entry surface of the light may be located on a main surface of the document, for example being defined within a window formed in the fibrous substrate. The window may be free of fibrous material to visibly reveal the waveguide to the naked eye or it may be covered by a layer of a sufficiently transparent material at the wavelength used to activate the chip 20 photoelectric so that the chip can be activated. The photoelectric chip is preferably located outside this window so as to be protected as explained above and to be activated only when the window is illuminated. The waveguide wire may comprise at least one security element other than the photoelectric chip. This security element can, if necessary, react with the activation light of the chip, for example because it contains a luminescent compound, and / or selectively screen the light so as to make an inscription appear. element comprising, for example, a demetallization in the form of a pattern which allows the light propagating in the wire to pass through. The waveguide wire may also comprise another security element such as a hologram, an optically variable or optical effect element showing a succession of different images depending on the inclination of the security document, which results in by a movement effect. In this case, the additional security element only partially covers the waveguide wire in the width direction so as to leave a passage for the light in the wire. In addition, the waveguide wire may comprise one of the following elements: an element for evidencing a falsification, in particular visible and / or detectable by means of a specific detection device, an optical effect element variable, interferential and / or diffractive, iridescent or liquid crystal, a magnetic coating, detectable tracers by X-ray fluorescence, biomarkers, a varnish or an ink, luminescent, fluorescent or phosphorescent tracers, photochromic, thermochromic, electroluminescent compounds and and / or piezochromic and / or which change color in contact with one or more predetermined products. The photoelectric chip is preferably located in an opaque area of the document. The waveguide wire may have a multilayer structure composed of a first layer, for example PET, a second layer of waveguide material, for example fiberglass, and a third layer, for example for example a protective varnish comprising micro-impressions and translucent areas to let the light wave for activation of the chip. The invention extends to a security document such as a passport, an identity card, a driving license, a card to play or to collect interactive, a means of payment, including a payment card, a voucher, voucher, transport card, loyalty card, service card or membership card. The invention also relates to a method of manufacturing a security document, as defined above, wherein the photoelectric chip is placed in the document while being integral with the waveguide wire. The photoelectric chip may be introduced with the waveguide between two jets of paper also called fibrous layers, preferably still wet, or in the mass of a jet of paper in formation. The fibrous layer is for example formed by depositing fibers on a surface immersed in a dispersion of fibrous material, in particular a rotating roll cylinder of a round-shaped papermaking machine. According to this manufacturing method, the chip is brought into contact with the chip by means of the flexible waveguide wire. The fibers are, for example, cellulose fibers and / or cotton linters and / or synthetic and / or artificial fibers, or a mixture thereof.

According to the invention, one of the two jets may have a succession of windows or openings constituting input surfaces for the light and extending along said jet. For example, these windows result from an embossing protruding from the jet forming fabric in a paper machine. round shape. The photoelectric chips are arranged on the waveguide wire in a distribution corresponding to the succession of windows present on the document. Preferably, this arrangement is performed at regular intervals. The waveguide on which are fixed the photoelectric chips may be arranged at the reference relative to the succession of windows so that the wire is for example visible at. level of the windows and that the photoelectric chips are arranged between the windows. The security document comprises at least one window and the manufacturing process can be implemented so that the waveguide wire is visible at the window and the photoelectric chip is arranged on the wire but outside. of the window once the document is formed. Alternatively, punching by a punch tool can be made on a sheet so as to make the window. The thus-formed sheet may then be hot-rolled with another foil or reel sheet on a platen press, the waveguide carrying the chip being disposed between these two sheets. In the case of paper sheets, the compressibility of the paper allows the compensation of the thickness of the wire carrying the chip so that the security document has a constant thickness over its entire surface, which facilitates the subsequent printing. The yarn can be laminated between two layers of paper, synthetic paper or plastic material such as PE, PET, PETG, PVC, PC, PA etc. The two layers may be made of different materials. The waveguide wire may comprise a core at least partially covered with a sheath of refractive index different from the core. The sheath may be covered with protective layers of transparent thermoplastic material, for example PE. The chip may be disposed to a non-zero depth within the heart. The chip can pass through the sheath and the protective layer. The chip may be located on the outermost side recessed or flush of the sheath, or the protective layer when it exists.

The invention will be better understood on reading the following detailed description of nonlimiting examples thereof, and on examining the appended drawing, in which: FIG. front view, a security document incorporating a photoelectric chip, according to an exemplary implementation of the invention, - Figures 2 and 3 are sections according to 1-H and iii.-Ill of Figure 1 respectively, and - Figure 4 is a view similar to Figure 3, an alternative embodiment; Figures 5 and 6 are two longitudinal sections in the direction of the length 1.0 of the waveguide wire in alternative embodiments. Photoelectric chip The photoelectric chip may be produced in accordance with the teachings of the publications mentioned above, including publications WO 02/37721 A1 and US 2003/0172968 A1. In general, a photoelectric chip may comprise at least one photovoltaic element enabling generating an electric voltage from incident light energy. The electrical voltage thus generated can ensure the operation of the chip and in particular the generation of a radiofrequency signal used by the chip to respond to the activation light signal. According to the invention, the transmitted radiofrequency signal can be picked up and decoded to identify and / or authenticate the security document. Alternatively, the chip comprises a memory in which an identifier number is registered. In that case. the electrical voltage generated from the light energy is used to read the number in the memory and transmit a radio frequency signal corresponding to this number. The photoelectric chip may comprise a radiofrequency antenna so as to emit the radiofrequency signal, this antenna being for example etched on a substrate of the chip or made otherwise on this substrate, for example by printing or deposition of an electrical conductor, or even carried out on the waveguide wire. The activation light may be visible, UV or W light. The activation light may be continuous or pulsed, coherent or not, monochromatic or not. When the activation light is pulsed, it can convey a code that activates the chip in case of recognition of this code by a processor of the chip.

Incident pulsed light can still serve as a clock signal for the operation of a processor of the chip. The energy required for the operation of the chip may come exclusively from the incident light, for example at 90 mW for an activation wavelength of 650 nr. Alternatively, the incident light is only used for. carry an activation code and the energy required for the operation of the chip is provided by radio frequency, as for conventional RFID chips, In this case, the chip may not generate electrical voltage by photovoltaic effect. The width of the chip may be between 40 and 150 microns. 1.0 The thickness of the chip may be between 50 and 200 microns. Waveguide wire The waveguide wire provides the mechanical support function of the chip when it is put in place in the safety document and the waveguide function to convey the light to the chip in order to allow its activation. The waveguide function is obtained by virtue of a difference in refractive index between that of the medium in which the light propagates and the environment outside this medium, this environment possibly consisting of one or more layers of the guide wire. waveform or by the middle of the security document in contact with the waveguide wire. The waveguide wire may comprise a substrate which provides both the waveguide function and the mechanical cohesion of the wire. In a variant, the waveguide wire comprises a substrate which provides the mechanical function and which is different from the. medium in which the light spreads. All known techniques for securing a security thread can be applied to the waveguide, e.g. metallizations, demetallizations, prints, luminescent ink incorporation, tagging, holograms, or the like. optically variable structures. The waveguide wire may thus comprise at least one security element other than the photoelectric chip chosen, for example, from metallizations, demetallizations, prints, incorporation of luminescent ink, incorporation of a taggant, production of holograms or other optically variable structures.

Preferably, the waveguide wire is coated on at least one of its faces, and preferably on both sides, with an adhesive material intended to improve the cohesion of the waveguide wire with the rest of the document. of security. It may be, for example, a thermoactivatable adhesive, chosen, for example, from polyurethanes, acrylics, acrylic styrenes, acrylic ethylene-polyester styrenes, acrylic ethylene-nitrocellulose styrenes, polyacetates, polyesters, silica-filled polyesters ( s). The waveguide may have any cross-sectional shape, preferably a flattened cross section, of width for example between 0.8 mm and 12 mm and thickness for example between 50 g, m and 250 gm The cross section the waveguide film is preferably rectangular, or square but in another example may also be of round section. The photoelectric chip may be inserted into the waveguide wire by thermo-compression, for example by means of a pick-up tool well known in the field of electronics. Preferably, the photovoltaic element generating a voltage from the incident light energy is in direct contact only with the waveguide wire, so that the photoelectric chip is activatable only via the light transmitted by the guide wire. 'wave. In Figure 4, there is illustrated an alternative embodiment in which the waveguide wire 10 comes flush with the surface of the document at least for the portion defining the entrance surface of the light. Elsewhere, especially where the waveguide wire carries the chip 40, the waveguide wire may be located below the surface of the document. Security document The security document advantageously comprises at least one layer in the thickness of which are at least partially housed the waveguide wire and the. or the photoelectric chips arranged on the wire, so as to avoid generating a significant extra thickness on the document, at the wire and the chip. In a more particularly preferred variant, the security document comprises at least one layer of a fibrous substrate, in particular a papermaker, in the thickness of which the waveguide wire and the photoelectric chip are housed at least partially.

The fibrous substrate may comprise fibers, for example cellulose fibers and / or cotton flax and / or synthetic and / or artificial fibers, or a mixture thereof. When the substrate is fibrous, the waveguide wire is for example integrated into a fibrous jet in formation by insertion of the chip-carrying wire into the round-shaped jet forming tank, in accordance with the teaching of the WO application. In FIG. 1, it can be seen that the waveguide wire 10 extends between two opposite edges of the document 20, for example between the long sides 2I of the document. It is not beyond the scope of the present invention when the orientation of the waveguide wire 11 is different relative to the document, and the waveguide wire can: also extend parallel to the long sides of the document, between small sides 22. Preferably, the document comprises at least one input surface 25 for the light, which is for example present on at least one of the main faces 26 of the document. as illustrated. The waveguide wire appears for example visible at the level of this input surface 25. When the waveguide wire and the photoelectric chip 40 are at least partially buried in the thickness e of the security document, as can be seen in FIG. as can be seen in FIG. 2, the entrance surface for the light can be defined by a window 27 made on the document, for example made in a fibrous layer in which the waveguide wire 20 extends. Such a window 27 is for example made during the formation of the jet of fibrous material, by the watermark technique. For example, the window results from an embossing protruding from the cylindrical jet-forming fabric in a round-shaped paper machine. The waveguide wire on which the photoelectric chips are fixed is in this case arranged at the mark so that the wire appears for example visible at the windows and that the photoelectric chips are arranged between the windows. The window 27 may also be formed by cutting an opening in a jet of fibrous material laminated with another fibrous material jet, with insertion at the mark 30 of the waveguide between the two jets. The Ruin of the window may be any, for example square, rectangular or more complex pattern such as a star, for example.

FIG. 5 shows an exemplary document 20 comprising two fibrous jets 51 and 52 between which a waveguide 10 carrying a chip 40 extends. One of the fibrous jets is traversed by a window 27. which opens on the waveguide wire 10, at a non-zero distance d of the chip, measured along the waveguide wire. The latter comprises a waveguide-forming court 62 in which the light propagates, entirely covered with a sheath 61. The latter comprises at least one perforation arranged for example at the level of the window 27 to allow light passing through the window 27. The chip 40 has an optical sensor 65 facing the core 62 being for example in contact therewith.

The chip 40 can penetrate from a non-zero distance t into the court, as illustrated, which can also pass through the sheath 61. The embodiment of FIG. 6 differs from that of FIG. 5 in the presence, above and at the below the sheath 61 of protective layers 68 and 69, preferably transparent thermoplastic material such as PE.

The protective layers 68 and 69 each interpose between the sheath 61 and the adjacent fibrous layer. The chip 40 is for example housed through the protective layer 68 and the sheath 61 underlying, and can sink a non-zero distance t in the core 62, as illustrated. The sensor 65 of the chip may be in contact with the heart. The chip 40 may not protrude out of the protective layer 68, which may thus contribute to protecting the chip in addition to protecting the core 62. The protective layers 68 and 69 may or may not belong to the guide wire. 'wave. The waveguide wire may be wider than the window or vice versa. The waveguide wire may or may not be apparent when the document is observed in reflection. For example, the waveguide wire may be exposed as it passes through the window. Alternatively, it can be covered, as it passes through the window, by a layer of a material sufficiently transparent to the wavelength used to activate the photoelectric chip so that the chip can be activated. The photoelectric chip may be located in the security document in a location that is opaque, i.e. a reflection observation of the security document does not distinguish the photoelectric chip and / or the guide wire from the security document. 'wave. Furthermore, the presence of the chip can not be detected tactilely because the chip generates no extra thickness on the surface of the security document. The opacity may possibly be such, in an alternative embodiment, that even in transmitted light, the user does not distinguish the presence of the waveguide wire at the level of the photoelectric chip. Such an opaque zone may for example be formed by printing on the security document, covering the photoelectric chip or by adding a pillar or a faith? opaque. The distance d between the input surface for the light and the photoelectric chip may be zero but it is preferably non-zero, for example at least 5 mm, that is to say that the photoelectric chip is located outside the entrance surface for the light, as is the case in the illustrated example. To activate the photoelectric chip, the input surface is illuminated with a light of suitable wavelength, for example 650 nr, and the signal emitted by the photoelectric chip is detected, for example by means of a radio frequency detector. The activation of the photoelectric chip can be carried out automatically as soon as it receives light in sufficient quantity, for example 90 mW, or alternatively the chip can emit a signal in response to the capture of light only when the signal The chip is recognized by the chip as an interrogation signal of the chip. Of course, the invention is not limited to the embodiments which have just been described. The waveguide wire and the chip can be further laminated between two sheets of plastic materials such as PE, PET, PETG, PVC, PC, PA, PA among others. the lamination can be done in the desired format by pressure in a platen press, or on a platen press, or. by colamination of the different elements in coils. The waveguide and the chip may be trapped between two sheets of different natures, for example paper, Teslin ~ i and / or Polyart ü. To allow the adhesion of the layers to one another and / or the adhesion of the waveguide to the layer (s), an adhesive chosen from PSA (pressure-sensitive adhesives), thermoplastics, may be used. crosslinkable thermoplastics.

In particular, the waveguide wire may carry a plurality of photoelectric chips which are activated by the same light or alternatively by lights of different wavelengths and / or carrying different interrogation codes. The structure of the document may be modified and for example it may not comprise a fibrous substrate. The security document may comprise, for example in the fibrous substrate, on the surface or elsewhere, dyes and / or luminescent pigments and / or interferential pigments and / or liquid crystal pigments, in particular in printed form or mixed with at least one constituent layer of the document, coloring components and / or photochromic or thermochromic pigments, in particular in printed form or mixed with at least one constituent layer of the document, an ultraviolet (UV) absorber, especially in coated or mixed form at least one constituent layer of the document, an interferential multilayer film, a structure with variable optical effects based on interference pigments or liquid crystals, a birefringent or polarizing layer, a diffraction structure, an embossed image, means producing a "moiré effect", such an effect being able for example to reveal a pattern produced by the superimposition of e two security elements on the article, for example by the approximation of lines of two security elements, a partially reflective refractive element, a transparent lenticular grid, - a lens, for example a magnifying glass, - a colored filter. a security thread incorporated for example in the mass of at least one constituent layer of the article or in the window, optionally comprising a positive or negative printed impression, a fluorescence, a metallic, goniochromatic or holographic effect, with or no one or more demetallized parts, a foil metallized, goniochromatic or holographic, a layer with variable optical effect based on interference pigments or crystals ilq uides, a flat security element and relatively small format such as a planchette. visible or non-visible, especially luminescent, with or without an electronic device. particles or agglomerates of pigment particles or dyes of I-LITE type, visible or non-visible, in particular luminescent, - security fibers, in particular metallic fibers, magnetic fibers (with soft and / or hard magnetism), or absorbent, or excitable ultraviolet, visible or infrared, and in particular the near-infrared (NIR), - an automatically readable security having specific and measurable characteristics of luminescence (eg fluorescence, phosphorescence), light absorption (e.g. ultraviolet, visible or infrared), Raman activity, magnetism, microwave interaction, X-ray interaction or electrical conductivity. infalesification reagents, for example dipyridyl with ferric ions which, when an attempt is made to falsify with a reducing agent, are reduced to ferrous ions and give rise to a red color; a reagent such as iodate; potassium that may form a visible and colored mark during an attempt to falsify. The waveguide wire can carry a conventional RFID chip, in addition to the photoelectric chip. The expression "having one" shall be understood as being synonymous with "having at least one" unless the contrary is specified.

Claims (10)

REVENDICATIONS1. Security document (20), comprising at least one CLAIMS1. Security document (20), comprising at least one photoelectric chip (40) fixed to said waveguide wire (IO), so as to be activated by a light transmitted to said chip by said waveguide wire, W at least an input surface (25) for the light, allowing when illuminated to introduce light into the waveguide wire, IO The document of claim 1, wherein the photoelectric chip comprises an optical light energy sensor which is in contact with the waveguide wire. The document of claim 2, wherein said optical light energy sensor is a photovoltaic sensor generating an electrical voltage when subjected to incident light energy. 4. Document according to any one of claims 1 to 3, the wave guide wire (10) extending from a first edge (21) of the document to a second edge (21), opposite to the first. The document according to any one of the preceding claims, comprising a fibrous substrate. 6. Document according to the preceding claim, the waveguide wire extending in the thickness (e) of the fibrous substrate. 7. Document according to any one of the preceding claims, the input surface (25) being located on a main face (26) of the document. 25 8. Document according to the preceding claim and one of claims 5 and 7, the input surface being defined within a window (27) formed in the fibrous substrate. 9. Document according to the preceding claim, the photoelectric chip (40) being located outside the window (27). 30 10. Document according to any one of the preceding claims, the waveguide wire comprising at least one security element other than the photoelectric chip chosen from at least one of the following elements: an element for evidencing a falsification. , especially visible and / or detectable with the aid of a specific detection device, a variable optical effect element, interferential and / or diffractive iridescent or liquid crystal, a magnetic coating, tracers detectable by X-ray fluorescence, biomarkers, a varnish or ink, luminescent, fluorescent or phosphorescent tracers, photochromic, thermochromic, electroluminescent and / or piezochromic and / or color-changing compounds in contact with one or more predetermined products. 1. Document according to any one of the preceding claims, the photoelectric chip being located in an opaque zone (30) of the document. 12. Document according to any one of the preceding claims, the document being without excess thickness at the level of the waveguide wire and the photoelectric chip. 13. Document according to any one of the preceding claims, the waveguide wire having a multilayer structure. 1.5 14. Security document according to one of the preceding claims, such as a passport, an identity card, a driving peznzis, an interactive playing or collecting card, a means of payment, in particular a payment card, a voucher or voucher, a transport card, a loyalty card, a service card or a membership card. 15. A method of manufacturing a security document as defined in any one of the preceding claims, wherein the photoelectric chip (40) is in place integral with the waveguide wire. 16. Method according to the preceding claim, the photoelectric chip being introduced between two jets of paper or in the mass of a jet of paper in formation. 17. A method of verifying a security document as defined in any one of claims 1 to 14, wherein the input surface is illuminated so as to activate the photoelectric chip and an emitted signal is detected. pal: the photoelectric chip in response to this activation. 30