FR2937790B1 - Capteur d'image aminci - Google Patents
Capteur d'image aminciInfo
- Publication number
- FR2937790B1 FR2937790B1 FR0805983A FR0805983A FR2937790B1 FR 2937790 B1 FR2937790 B1 FR 2937790B1 FR 0805983 A FR0805983 A FR 0805983A FR 0805983 A FR0805983 A FR 0805983A FR 2937790 B1 FR2937790 B1 FR 2937790B1
- Authority
- FR
- France
- Prior art keywords
- aminci
- image sensor
- sensor
- image
- aminci image
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1464—Back illuminated imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/148—Charge coupled imagers
- H01L27/14806—Structural or functional details thereof
- H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1892—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof methods involving the use of temporary, removable substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0805983A FR2937790B1 (fr) | 2008-10-28 | 2008-10-28 | Capteur d'image aminci |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0805983A FR2937790B1 (fr) | 2008-10-28 | 2008-10-28 | Capteur d'image aminci |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2937790A1 FR2937790A1 (fr) | 2010-04-30 |
FR2937790B1 true FR2937790B1 (fr) | 2011-03-25 |
Family
ID=40756386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0805983A Expired - Fee Related FR2937790B1 (fr) | 2008-10-28 | 2008-10-28 | Capteur d'image aminci |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2937790B1 (fr) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5244817A (en) * | 1992-08-03 | 1993-09-14 | Eastman Kodak Company | Method of making backside illuminated image sensors |
JPH06275803A (ja) * | 1993-03-18 | 1994-09-30 | Hitachi Ltd | 半導体装置及びその製造方法 |
JP4032454B2 (ja) * | 1997-06-27 | 2008-01-16 | ソニー株式会社 | 三次元回路素子の製造方法 |
JP4046067B2 (ja) * | 2003-11-04 | 2008-02-13 | ソニー株式会社 | 固体撮像素子の製造方法 |
JP4046069B2 (ja) * | 2003-11-17 | 2008-02-13 | ソニー株式会社 | 固体撮像素子及び固体撮像素子の製造方法 |
US7749799B2 (en) * | 2005-11-15 | 2010-07-06 | California Institute Of Technology | Back-illuminated imager and method for making electrical and optical connections to same |
FR2910707B1 (fr) * | 2006-12-20 | 2009-06-12 | E2V Semiconductors Soc Par Act | Capteur d'image a haute densite d'integration |
-
2008
- 2008-10-28 FR FR0805983A patent/FR2937790B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2937790A1 (fr) | 2010-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 9 |
|
PLFP | Fee payment |
Year of fee payment: 10 |
|
CD | Change of name or company name |
Owner name: TELEDYNE E2V SEMICONDUCTORS SAS, FR Effective date: 20180907 |
|
PLFP | Fee payment |
Year of fee payment: 11 |
|
ST | Notification of lapse |
Effective date: 20200910 |