FR2891759B1 - Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux - Google Patents

Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux

Info

Publication number
FR2891759B1
FR2891759B1 FR0510412A FR0510412A FR2891759B1 FR 2891759 B1 FR2891759 B1 FR 2891759B1 FR 0510412 A FR0510412 A FR 0510412A FR 0510412 A FR0510412 A FR 0510412A FR 2891759 B1 FR2891759 B1 FR 2891759B1
Authority
FR
France
Prior art keywords
silica
particles
materials
cerium dioxide
polishing surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0510412A
Other languages
English (en)
Other versions
FR2891759A1 (fr
Inventor
Georges Michel
Mohamed Ennahali
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KEMESYS
Original Assignee
KEMESYS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KEMESYS filed Critical KEMESYS
Priority to FR0510412A priority Critical patent/FR2891759B1/fr
Priority to PCT/FR2006/002305 priority patent/WO2007042681A2/fr
Priority to EP06820206A priority patent/EP1954776A2/fr
Publication of FR2891759A1 publication Critical patent/FR2891759A1/fr
Application granted granted Critical
Publication of FR2891759B1 publication Critical patent/FR2891759B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
FR0510412A 2005-10-12 2005-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux Expired - Fee Related FR2891759B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0510412A FR2891759B1 (fr) 2005-10-12 2005-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux
PCT/FR2006/002305 WO2007042681A2 (fr) 2005-10-12 2006-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux
EP06820206A EP1954776A2 (fr) 2005-10-12 2006-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0510412A FR2891759B1 (fr) 2005-10-12 2005-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux

Publications (2)

Publication Number Publication Date
FR2891759A1 FR2891759A1 (fr) 2007-04-13
FR2891759B1 true FR2891759B1 (fr) 2009-04-10

Family

ID=36603720

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0510412A Expired - Fee Related FR2891759B1 (fr) 2005-10-12 2005-10-12 Suspension aqueuse abrasive a base de particules de dioxyde de cerium et de silice pour le polissage de surfaces de materiaux

Country Status (3)

Country Link
EP (1) EP1954776A2 (fr)
FR (1) FR2891759B1 (fr)
WO (1) WO2007042681A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6694653B2 (ja) * 2017-04-10 2020-05-20 信越化学工業株式会社 合成石英ガラス基板用研磨剤及びその製造方法並びに合成石英ガラス基板の研磨方法
CN114045153B (zh) * 2021-12-21 2022-09-20 清华大学 一种制备二氧化铈悬浮液的方法、二氧化铈悬浮液及抛光液

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5527423A (en) * 1994-10-06 1996-06-18 Cabot Corporation Chemical mechanical polishing slurry for metal layers
JP5017574B2 (ja) * 2001-05-25 2012-09-05 エア プロダクツ アンド ケミカルズ インコーポレイテッド 酸化セリウム研磨剤及び基板の製造方法
US6726535B2 (en) * 2002-04-25 2004-04-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method for preventing localized Cu corrosion during CMP
TWI307712B (en) * 2002-08-28 2009-03-21 Kao Corp Polishing composition
US20040127045A1 (en) * 2002-09-12 2004-07-01 Gorantla Venkata R. K. Chemical mechanical planarization of wafers or films using fixed polishing pads and a nanoparticle composition

Also Published As

Publication number Publication date
FR2891759A1 (fr) 2007-04-13
WO2007042681A2 (fr) 2007-04-19
EP1954776A2 (fr) 2008-08-13
WO2007042681A3 (fr) 2007-05-31

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Effective date: 20160630