FR2884743B1 - Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau - Google Patents

Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau

Info

Publication number
FR2884743B1
FR2884743B1 FR0551007A FR0551007A FR2884743B1 FR 2884743 B1 FR2884743 B1 FR 2884743B1 FR 0551007 A FR0551007 A FR 0551007A FR 0551007 A FR0551007 A FR 0551007A FR 2884743 B1 FR2884743 B1 FR 2884743B1
Authority
FR
France
Prior art keywords
femtosecond laser
machining device
laser micro
dynamic beam
beam conformation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0551007A
Other languages
English (en)
Other versions
FR2884743A1 (fr
Inventor
Herve Soder
Nicolas Huot
Eric Audouard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMPULSION SOC PAR ACTIONS SIMP
Original Assignee
IMPULSION SOC PAR ACTIONS SIMP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by IMPULSION SOC PAR ACTIONS SIMP filed Critical IMPULSION SOC PAR ACTIONS SIMP
Priority to FR0551007A priority Critical patent/FR2884743B1/fr
Priority to EP06743814A priority patent/EP1871565A1/fr
Priority to US11/911,985 priority patent/US20080210673A1/en
Priority to PCT/FR2006/050356 priority patent/WO2006111682A1/fr
Publication of FR2884743A1 publication Critical patent/FR2884743A1/fr
Application granted granted Critical
Publication of FR2884743B1 publication Critical patent/FR2884743B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Laser Beam Processing (AREA)
FR0551007A 2005-04-20 2005-04-20 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau Expired - Fee Related FR2884743B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
FR0551007A FR2884743B1 (fr) 2005-04-20 2005-04-20 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau
EP06743814A EP1871565A1 (fr) 2005-04-20 2006-04-19 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau
US11/911,985 US20080210673A1 (en) 2005-04-20 2006-04-19 Femtosecond Laser Micromachining Device with Dynamic Bean Conformation
PCT/FR2006/050356 WO2006111682A1 (fr) 2005-04-20 2006-04-19 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0551007A FR2884743B1 (fr) 2005-04-20 2005-04-20 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau

Publications (2)

Publication Number Publication Date
FR2884743A1 FR2884743A1 (fr) 2006-10-27
FR2884743B1 true FR2884743B1 (fr) 2007-07-20

Family

ID=35432747

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0551007A Expired - Fee Related FR2884743B1 (fr) 2005-04-20 2005-04-20 Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau

Country Status (4)

Country Link
US (1) US20080210673A1 (fr)
EP (1) EP1871565A1 (fr)
FR (1) FR2884743B1 (fr)
WO (1) WO2006111682A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8208505B2 (en) 2001-01-30 2012-06-26 Board Of Trustees Of Michigan State University Laser system employing harmonic generation
US7567596B2 (en) 2001-01-30 2009-07-28 Board Of Trustees Of Michigan State University Control system and apparatus for use with ultra-fast laser
US8618470B2 (en) 2005-11-30 2013-12-31 Board Of Trustees Of Michigan State University Laser based identification of molecular characteristics
US9018562B2 (en) 2006-04-10 2015-04-28 Board Of Trustees Of Michigan State University Laser material processing system
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
EP2211430A3 (fr) 2009-01-23 2015-05-27 Board of Trustees of Michigan State University Système d'autocorrélation laser
WO2010141128A2 (fr) 2009-03-05 2010-12-09 Board Of Trustees Of Michigan State University Système d'amplification laser
US8630322B2 (en) 2010-03-01 2014-01-14 Board Of Trustees Of Michigan State University Laser system for output manipulation
US10350705B2 (en) 2014-07-01 2019-07-16 Qiova Micromachining method for patterning a material

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0886352A4 (fr) * 1996-03-08 2006-02-08 Nippon Aspherical Lens Co Ltd Lentille, element laser a semi-conducteur, dispositif d'usinage de la lentille et de l'element, procede de fabrication de l'element laser a semi-conducteur, element optique et dispositif et procede d'usinage dudit element optique
US5986807A (en) * 1997-01-13 1999-11-16 Xerox Corporation Single binary optical element beam homogenizer
JP2002273583A (ja) * 2001-03-19 2002-09-25 Inst Of Physical & Chemical Res 透明媒質加工装置
US6717104B2 (en) * 2001-06-13 2004-04-06 The Regents Of The University Of California Programmable phase plate for tool modification in laser machining applications
US20060207976A1 (en) * 2005-01-21 2006-09-21 Bovatsek James M Laser material micromachining with green femtosecond pulses

Also Published As

Publication number Publication date
FR2884743A1 (fr) 2006-10-27
US20080210673A1 (en) 2008-09-04
EP1871565A1 (fr) 2008-01-02
WO2006111682A1 (fr) 2006-10-26

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Legal Events

Date Code Title Description
TQ Partial transmission of property
ST Notification of lapse

Effective date: 20131231