EP1871565A1 - Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau - Google Patents
Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceauInfo
- Publication number
- EP1871565A1 EP1871565A1 EP06743814A EP06743814A EP1871565A1 EP 1871565 A1 EP1871565 A1 EP 1871565A1 EP 06743814 A EP06743814 A EP 06743814A EP 06743814 A EP06743814 A EP 06743814A EP 1871565 A1 EP1871565 A1 EP 1871565A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- component
- laser
- wavefront
- active
- spatial
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
Definitions
- the invention relates to the technical sector of micro-machining of various materials, including femtosecond laser.
- Harzic 2002 R. Harzic, N. Huot, Audouard E., Jonin C., Laporte P., S.
- the object of the invention is to remedy these disadvantages in a simple, safe, effective and rational manner.
- the problem that the invention proposes to solve is to be able to suppress the wavefront sensor which makes it possible to obtain a linear correction with a quasi-direct correspondence between address pixels and detected pixels and to use, according to invention, an optimization method for making the correction.
- a femtosecond laser micro-machining device with dynamic beam conformation of the type comprising: a source of coherent light radiation of laser type emitting ultrashort pulses;
- the dynamic conformation assembly of the beam comprises an optical system composed of an active part for modifying the wavefront of the beam.
- the means capable of ensuring the spatial shaping of the beam is a simple detection system of the CDD camera type or photodetector.
- the feedback loop implements an algorithm selected to adapt the phase functions performed by the first and second components, in order to optimize the result in the form of an assigned score. by criteria dependent on the selected simple detection system.
- the action of a high-speed ultrashort pulse laser, with programmable shaping of the beam, without phase measurement is of real industrial interest.
- the high rate decreases the rate of the process
- the programmable formatting makes it possible to structure the shape of the beam and to vary it by computer.
- the absence of phase measurement saves the use of a wavefront sensor or an interferometric device whose prices are prohibitive.
- FIG. 1 is a purely schematic view of the main assemblies of the device according to the invention for implementing the laser method in the context of micromachining operations, in the case of direct transmission of the laser source;
- Figure 2 is a view similar to Figure 1, in the case of a transmission by reflection of the laser source.
- the femtosecond laser micro-machining device comprises in combination a coherent light source of laser type emitting ultrashort pulses (1), a dynamic beamforming assembly (2), (3), (4), (5), ) and (6) and a set of implementation and processing of the laser beam (7), (8), (9) and (10) (micromachining operation for example).
- the laser source (1) operates in mode-locked pulse mode and delivers ultra-short pulses of less than 100 ps duration and repetition rates greater than or equal to 1 kHz.
- the energies delivered for each pulse are generally greater than or equal to 1 nJ.
- the laser source emits at a wavelength compatible with the dynamic beam conformation assembly.
- a source may consist of an amplified femtosecond chain based on titanium doped Sapphire crystal emitting pulses of 4 ⁇ J for a duration of 200 fs at a variable rate of 10 to 250 kHz.
- a diode pumped femtosecond source based on Ytterbium ion doping emitting pulses of 100 ⁇ J for a duration of 400 fs at a rate of 1 to 10 kHz can be used. It is also possible to use an amplified femtosecond source based on titanium doped sapphire crystal emitting pulses of about 1-1.5 mJ for a duration of 150 fs at a rate of 1-5 kHz.
- the dynamic conformation assembly of the beam comprises an optical device composed of an active wavefront modification system (2) of the laser source (1) and a detection system without phase measurement (5) .
- the wavefront modification system (2) and the phase-less detection system (5) are connected by a feedback loop (6).
- the detection system (5) is not a wavefront sensor whatever it is or an interferometric device for phase measurement.
- the active wavefront modification system (5) contains a first fixed or active component and a second active component.
- the first component has a low spatial resolution in terms of wavefront sculpture.
- this component When this component is fixed, it may be constituted by an afocal optical system composed of lenses and / or mirrors and which is capable of producing a curvature of the wavefront.
- This first component when it is fixed, may also consist of a diffractive optical element performing a "pre-shaping" function modulated by the second component.
- this first component When this first component is active, it may be constituted by a deformable mirror (for example of the type marketed by CILAS France) or by a deformable membrane (for example of the type marketed at OKO Technologies, Japan) or by a valve optically addressed optically and more generally by any means for performing a modulation of the spatial phase with a fairly high dynamic (typically greater than or equal to 2 ⁇ ) with a low spatial resolution, especially with pixels less than or equal to 100 microns.
- a deformable mirror for example of the type marketed by CILAS France
- a deformable membrane for example of the type marketed at OKO Technologies, Japan
- the first component When the first component is active, it allows to realize the phase function necessary to obtain the desired formatting, without solving the details of this basic function. In this case, such details are made by the second active component.
- This second component has a high spatial resolution with a pixel dimension less than or equal to 100 ⁇ m and a number of pixels of at least 100.
- This second active component is based on a liquid crystal layer and can, for example, be constituted by a spatial light modulator set in phase modulator and addressed electrically or be constituted by an optical valve optically addressed and more generally by any means performing this function with sufficient spatial resolution.
- This active component can operate by reflection or transmission having the function of refining the spatial shape of the wavefront.
- the detection system (5) combining with the feedback loop (6) makes it possible to assign a note to the formatting performed.
- the detection system is not a phase measuring device making it possible to compare the phase front produced with an expected phase front. It is a simple detection system of the CDD camera type or photodetector, after nonlinear crystal.
- the system without a wavefront sensor may consist of any detection system whose function is to spatially shape the beam and to obtain a better result.
- a score assigned according to the criteria depending on the selected means for example the image quality if it is with a CDD camera or frequency doubled intensity detected on a photodiode.
- the rating assigned depends on the pixel rate of the address at a time. As a result, there is no direct correspondence as is the case with a wavefront sensor. It is therefore necessary to optimize the entire dressing matrix at the same time.
- the note is integrated into the feedback loop (6).
- the feedback loop implements an algorithm to adapt the phase functions performed by the first and second components to optimize the note delivered by the detection part.
- the so-called “genetic” or “revolutionary” algorithms can be used.
- the device After dynamic conformation of the beam, the device comprises an objective (Fourier lenses (3), (4), for example) which focuses the beam thus structured and produced in its focal point or in its vicinity, a spot having the desired spatial distribution . If the minimum dimension of this spot does not correspond to the desired dimensions, a lens and / or mirror imaging device (7) can be added downstream.
- an objective Frier lenses (3), (4), for example
- a sample (9) on which the laser process is performed is arranged.
- the sample (9) is mechanically connected to a mobile assembly (10) controlled by computer.
- this mobile assembly may be a set of motorized translations coupled or not to motorized rotation devices.
- a set of scanner type (8) (galvanometric mirror system) can also be inserted on the optical path before forming the image spot so as to deflect the beam by computer control.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Mechanical Light Control Or Optical Switches (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0551007A FR2884743B1 (fr) | 2005-04-20 | 2005-04-20 | Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau |
PCT/FR2006/050356 WO2006111682A1 (fr) | 2005-04-20 | 2006-04-19 | Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1871565A1 true EP1871565A1 (fr) | 2008-01-02 |
Family
ID=35432747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06743814A Withdrawn EP1871565A1 (fr) | 2005-04-20 | 2006-04-19 | Dispositif de micro-usinage par laser femtoseconde avec conformation dynamique de faisceau |
Country Status (4)
Country | Link |
---|---|
US (1) | US20080210673A1 (fr) |
EP (1) | EP1871565A1 (fr) |
FR (1) | FR2884743B1 (fr) |
WO (1) | WO2006111682A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8208505B2 (en) | 2001-01-30 | 2012-06-26 | Board Of Trustees Of Michigan State University | Laser system employing harmonic generation |
US7567596B2 (en) | 2001-01-30 | 2009-07-28 | Board Of Trustees Of Michigan State University | Control system and apparatus for use with ultra-fast laser |
US8618470B2 (en) | 2005-11-30 | 2013-12-31 | Board Of Trustees Of Michigan State University | Laser based identification of molecular characteristics |
US9018562B2 (en) | 2006-04-10 | 2015-04-28 | Board Of Trustees Of Michigan State University | Laser material processing system |
JP4402708B2 (ja) * | 2007-08-03 | 2010-01-20 | 浜松ホトニクス株式会社 | レーザ加工方法、レーザ加工装置及びその製造方法 |
EP2211430A3 (fr) | 2009-01-23 | 2015-05-27 | Board of Trustees of Michigan State University | Système d'autocorrélation laser |
WO2010141128A2 (fr) | 2009-03-05 | 2010-12-09 | Board Of Trustees Of Michigan State University | Système d'amplification laser |
US8630322B2 (en) | 2010-03-01 | 2014-01-14 | Board Of Trustees Of Michigan State University | Laser system for output manipulation |
US10350705B2 (en) | 2014-07-01 | 2019-07-16 | Qiova | Micromachining method for patterning a material |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0886352A4 (fr) * | 1996-03-08 | 2006-02-08 | Nippon Aspherical Lens Co Ltd | Lentille, element laser a semi-conducteur, dispositif d'usinage de la lentille et de l'element, procede de fabrication de l'element laser a semi-conducteur, element optique et dispositif et procede d'usinage dudit element optique |
US5986807A (en) * | 1997-01-13 | 1999-11-16 | Xerox Corporation | Single binary optical element beam homogenizer |
JP2002273583A (ja) * | 2001-03-19 | 2002-09-25 | Inst Of Physical & Chemical Res | 透明媒質加工装置 |
US6717104B2 (en) * | 2001-06-13 | 2004-04-06 | The Regents Of The University Of California | Programmable phase plate for tool modification in laser machining applications |
US20060207976A1 (en) * | 2005-01-21 | 2006-09-21 | Bovatsek James M | Laser material micromachining with green femtosecond pulses |
-
2005
- 2005-04-20 FR FR0551007A patent/FR2884743B1/fr not_active Expired - Fee Related
-
2006
- 2006-04-19 EP EP06743814A patent/EP1871565A1/fr not_active Withdrawn
- 2006-04-19 US US11/911,985 patent/US20080210673A1/en not_active Abandoned
- 2006-04-19 WO PCT/FR2006/050356 patent/WO2006111682A1/fr active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2006111682A1 * |
Also Published As
Publication number | Publication date |
---|---|
FR2884743A1 (fr) | 2006-10-27 |
US20080210673A1 (en) | 2008-09-04 |
FR2884743B1 (fr) | 2007-07-20 |
WO2006111682A1 (fr) | 2006-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20071024 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
DAX | Request for extension of the european patent (deleted) | ||
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: HUOT, NICOLAS Inventor name: SODER, HERVE Inventor name: AUDOUARD, ERIC |
|
17Q | First examination report despatched |
Effective date: 20090519 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20131101 |