FR2872629B1 - Circuit integre ayant une borne d'entree/sortie configurable dans une gamme de tension determinee - Google Patents
Circuit integre ayant une borne d'entree/sortie configurable dans une gamme de tension determineeInfo
- Publication number
- FR2872629B1 FR2872629B1 FR0407245A FR0407245A FR2872629B1 FR 2872629 B1 FR2872629 B1 FR 2872629B1 FR 0407245 A FR0407245 A FR 0407245A FR 0407245 A FR0407245 A FR 0407245A FR 2872629 B1 FR2872629 B1 FR 2872629B1
- Authority
- FR
- France
- Prior art keywords
- voltage
- integrated circuit
- output terminal
- determined range
- configurable input
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits
- H03K19/0175—Coupling arrangements; Interface arrangements
- H03K19/0185—Coupling arrangements; Interface arrangements using field effect transistors only
- H03K19/018585—Coupling arrangements; Interface arrangements using field effect transistors only programmable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05553—Shape in top view being rectangular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/528—Geometry or layout of the interconnection structure
- H01L23/5286—Arrangements of power or ground buses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Computing Systems (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Logic Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0407245A FR2872629B1 (fr) | 2004-06-30 | 2004-06-30 | Circuit integre ayant une borne d'entree/sortie configurable dans une gamme de tension determinee |
US11/170,760 US20060022710A1 (en) | 2004-06-30 | 2005-06-28 | Integrated circuit having an input/output terminal configurable within a given voltage range |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0407245A FR2872629B1 (fr) | 2004-06-30 | 2004-06-30 | Circuit integre ayant une borne d'entree/sortie configurable dans une gamme de tension determinee |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2872629A1 FR2872629A1 (fr) | 2006-01-06 |
FR2872629B1 true FR2872629B1 (fr) | 2007-07-13 |
Family
ID=34947669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0407245A Expired - Fee Related FR2872629B1 (fr) | 2004-06-30 | 2004-06-30 | Circuit integre ayant une borne d'entree/sortie configurable dans une gamme de tension determinee |
Country Status (2)
Country | Link |
---|---|
US (1) | US20060022710A1 (fr) |
FR (1) | FR2872629B1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8064197B2 (en) | 2009-05-22 | 2011-11-22 | Advanced Micro Devices, Inc. | Heat management using power management information |
US9848515B1 (en) | 2016-05-27 | 2017-12-19 | Advanced Micro Devices, Inc. | Multi-compartment computing device with shared cooling device |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140196A (en) * | 1991-04-15 | 1992-08-18 | Motorola, Inc. | Variable level translator |
JP2910474B2 (ja) * | 1992-02-21 | 1999-06-23 | 日本電気株式会社 | 半導体集積回路装置 |
FR2760914B1 (fr) * | 1997-03-14 | 1999-05-14 | Matra Mhs | Circuit convertisseur de niveaux analogiques |
US6111450A (en) * | 1998-07-15 | 2000-08-29 | Lucent Technologies, Inc. | Operating voltage adapting buffer |
US6271679B1 (en) * | 1999-03-24 | 2001-08-07 | Altera Corporation | I/O cell configuration for multiple I/O standards |
JP4963144B2 (ja) * | 2000-06-22 | 2012-06-27 | ルネサスエレクトロニクス株式会社 | 半導体集積回路 |
JP3786608B2 (ja) * | 2002-01-28 | 2006-06-14 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US6856173B1 (en) * | 2003-09-05 | 2005-02-15 | Freescale Semiconductor, Inc. | Multiplexing of digital signals at multiple supply voltages in an integrated circuit |
JP4367700B2 (ja) * | 2004-03-30 | 2009-11-18 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
US7750500B2 (en) * | 2004-06-28 | 2010-07-06 | Broadcom Corporation | Integrated circuit with multiple independent power supply zones |
-
2004
- 2004-06-30 FR FR0407245A patent/FR2872629B1/fr not_active Expired - Fee Related
-
2005
- 2005-06-28 US US11/170,760 patent/US20060022710A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
FR2872629A1 (fr) | 2006-01-06 |
US20060022710A1 (en) | 2006-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20100226 |