FR2860945B1 - Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes - Google Patents

Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes

Info

Publication number
FR2860945B1
FR2860945B1 FR0410782A FR0410782A FR2860945B1 FR 2860945 B1 FR2860945 B1 FR 2860945B1 FR 0410782 A FR0410782 A FR 0410782A FR 0410782 A FR0410782 A FR 0410782A FR 2860945 B1 FR2860945 B1 FR 2860945B1
Authority
FR
France
Prior art keywords
circuit board
flexible flat
flat conductor
conductor
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0410782A
Other languages
English (en)
Other versions
FR2860945A1 (fr
Inventor
Heinz Helmut
Konig Sibyll
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Conti Temic Microelectronic GmbH
Original Assignee
Conti Temic Microelectronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conti Temic Microelectronic GmbH filed Critical Conti Temic Microelectronic GmbH
Publication of FR2860945A1 publication Critical patent/FR2860945A1/fr
Application granted granted Critical
Publication of FR2860945B1 publication Critical patent/FR2860945B1/fr
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/59Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10666Plated through-hole for surface mounting on PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494Heating methods for reflowing of solder
FR0410782A 2003-10-14 2004-10-13 Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes Expired - Fee Related FR2860945B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10348443 2003-10-14

Publications (2)

Publication Number Publication Date
FR2860945A1 FR2860945A1 (fr) 2005-04-15
FR2860945B1 true FR2860945B1 (fr) 2007-07-06

Family

ID=34353461

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0410782A Expired - Fee Related FR2860945B1 (fr) 2003-10-14 2004-10-13 Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes

Country Status (2)

Country Link
DE (1) DE102004038401B4 (fr)
FR (1) FR2860945B1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009055857A1 (de) * 2009-11-26 2011-06-16 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Kontaktieren einer Leiterplatte mit einem Flachbandkabel und Leiterplatte
DE102010039189A1 (de) * 2010-08-11 2012-02-16 Robert Bosch Gmbh Flexfolienkontaktierung
JP2021158114A (ja) * 2020-03-27 2021-10-07 ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクTE Connectivity Germany GmbH 導体ケーブルの導電体と接続相手側との間の電気コンタクト、自動車バッテリモジュール用のセル接続システム、およびセルシステムを製造するための方法
DE102021122329A1 (de) * 2021-08-30 2023-03-02 Md Elektronik Gmbh Verbinder und Verfahren zum Verbinden einer Leiterplatte mit zumindest einem Leiter

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3926360A (en) * 1974-05-28 1975-12-16 Burroughs Corp Method of attaching a flexible printed circuit board to a rigid printed circuit board
DE3247338A1 (de) * 1982-12-21 1984-06-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum laserloeten von flexiblen verdrahtungen
JPS6423543A (en) * 1987-07-20 1989-01-26 Agency Ind Science Techn Soldering by use of laser
US4889275A (en) * 1988-11-02 1989-12-26 Motorola, Inc. Method for effecting solder interconnects
JP2594354B2 (ja) * 1989-04-10 1997-03-26 富士写真光機株式会社 レーザハンダ付け方法
US5014162A (en) * 1989-06-27 1991-05-07 At&T Bell Laboratories Solder assembly of components
JPH0422591A (ja) * 1990-05-08 1992-01-27 Fuji Electric Co Ltd レーザー半田付け装置
US6112406A (en) * 1996-05-06 2000-09-05 Siemens Aktiengesellschaft Method for producing electrically conductive connections between two or more conductor structures
DE10138583A1 (de) * 2001-08-06 2003-02-20 Delphi Tech Inc Flachleiter und Verfahren zur Herstellung einer Lötverbindung mit demselben

Also Published As

Publication number Publication date
DE102004038401B4 (de) 2017-07-06
FR2860945A1 (fr) 2005-04-15
DE102004038401A1 (de) 2005-05-19

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Effective date: 20200910