FR2860945B1 - Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes - Google Patents
Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimesInfo
- Publication number
- FR2860945B1 FR2860945B1 FR0410782A FR0410782A FR2860945B1 FR 2860945 B1 FR2860945 B1 FR 2860945B1 FR 0410782 A FR0410782 A FR 0410782A FR 0410782 A FR0410782 A FR 0410782A FR 2860945 B1 FR2860945 B1 FR 2860945B1
- Authority
- FR
- France
- Prior art keywords
- circuit board
- flexible flat
- flat conductor
- conductor
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10348443 | 2003-10-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2860945A1 FR2860945A1 (fr) | 2005-04-15 |
FR2860945B1 true FR2860945B1 (fr) | 2007-07-06 |
Family
ID=34353461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0410782A Expired - Fee Related FR2860945B1 (fr) | 2003-10-14 | 2004-10-13 | Procede pour la connexion d'un conducteur plat flexible a une carte de circuits imprimes |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102004038401B4 (fr) |
FR (1) | FR2860945B1 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009055857A1 (de) * | 2009-11-26 | 2011-06-16 | Osram Gesellschaft mit beschränkter Haftung | Verfahren zum Kontaktieren einer Leiterplatte mit einem Flachbandkabel und Leiterplatte |
DE102010039189A1 (de) * | 2010-08-11 | 2012-02-16 | Robert Bosch Gmbh | Flexfolienkontaktierung |
JP2021158114A (ja) * | 2020-03-27 | 2021-10-07 | ティーイー コネクティビティ ジャーマニー ゲゼルシャフト ミット ベシュレンクテル ハフツンクTE Connectivity Germany GmbH | 導体ケーブルの導電体と接続相手側との間の電気コンタクト、自動車バッテリモジュール用のセル接続システム、およびセルシステムを製造するための方法 |
DE102021122329A1 (de) * | 2021-08-30 | 2023-03-02 | Md Elektronik Gmbh | Verbinder und Verfahren zum Verbinden einer Leiterplatte mit zumindest einem Leiter |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3926360A (en) * | 1974-05-28 | 1975-12-16 | Burroughs Corp | Method of attaching a flexible printed circuit board to a rigid printed circuit board |
DE3247338A1 (de) * | 1982-12-21 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum laserloeten von flexiblen verdrahtungen |
JPS6423543A (en) * | 1987-07-20 | 1989-01-26 | Agency Ind Science Techn | Soldering by use of laser |
US4889275A (en) * | 1988-11-02 | 1989-12-26 | Motorola, Inc. | Method for effecting solder interconnects |
JP2594354B2 (ja) * | 1989-04-10 | 1997-03-26 | 富士写真光機株式会社 | レーザハンダ付け方法 |
US5014162A (en) * | 1989-06-27 | 1991-05-07 | At&T Bell Laboratories | Solder assembly of components |
JPH0422591A (ja) * | 1990-05-08 | 1992-01-27 | Fuji Electric Co Ltd | レーザー半田付け装置 |
US6112406A (en) * | 1996-05-06 | 2000-09-05 | Siemens Aktiengesellschaft | Method for producing electrically conductive connections between two or more conductor structures |
DE10138583A1 (de) * | 2001-08-06 | 2003-02-20 | Delphi Tech Inc | Flachleiter und Verfahren zur Herstellung einer Lötverbindung mit demselben |
-
2004
- 2004-08-07 DE DE102004038401.0A patent/DE102004038401B4/de not_active Expired - Fee Related
- 2004-10-13 FR FR0410782A patent/FR2860945B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102004038401B4 (de) | 2017-07-06 |
FR2860945A1 (fr) | 2005-04-15 |
DE102004038401A1 (de) | 2005-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 12 |
|
PLFP | Fee payment |
Year of fee payment: 13 |
|
PLFP | Fee payment |
Year of fee payment: 14 |
|
PLFP | Fee payment |
Year of fee payment: 15 |
|
ST | Notification of lapse |
Effective date: 20200910 |