FR2855891B1 - Module a carte a puce - Google Patents

Module a carte a puce

Info

Publication number
FR2855891B1
FR2855891B1 FR0403977A FR0403977A FR2855891B1 FR 2855891 B1 FR2855891 B1 FR 2855891B1 FR 0403977 A FR0403977 A FR 0403977A FR 0403977 A FR0403977 A FR 0403977A FR 2855891 B1 FR2855891 B1 FR 2855891B1
Authority
FR
France
Prior art keywords
chip
card module
link
contacts
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0403977A
Other languages
English (en)
Other versions
FR2855891A1 (fr
Inventor
Frank Puschner
Jochen Muller
Wolfgang Schindler
Stephan Janka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of FR2855891A1 publication Critical patent/FR2855891A1/fr
Application granted granted Critical
Publication of FR2855891B1 publication Critical patent/FR2855891B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)
FR0403977A 2003-06-05 2004-04-16 Module a carte a puce Expired - Fee Related FR2855891B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10325566A DE10325566A1 (de) 2003-06-05 2003-06-05 Chipkartenmodul

Publications (2)

Publication Number Publication Date
FR2855891A1 FR2855891A1 (fr) 2004-12-10
FR2855891B1 true FR2855891B1 (fr) 2006-06-23

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DE (1) DE10325566A1 (fr)
FR (1) FR2855891B1 (fr)

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Publication number Priority date Publication date Assignee Title
JP6125332B2 (ja) * 2013-05-31 2017-05-10 ルネサスエレクトロニクス株式会社 半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL184184C (nl) * 1981-03-20 1989-05-01 Philips Nv Werkwijze voor het aanbrengen van kontaktverhogingen op kontaktplaatsen van een electronische microketen.
DE19639025C2 (de) * 1996-09-23 1999-10-28 Siemens Ag Chipmodul und Verfahren zur Herstellung eines Chipmoduls
DE50015980D1 (de) * 2000-07-25 2010-10-14 Infineon Technologies Ag Etikettierte Chipkarte
DE10131940B4 (de) * 2001-07-02 2006-01-19 Infineon Technologies Ag Halbleiterchip und Verfahren zur Ausbildung von Kontakten auf einer Halbleiteranordnung
TW518729B (en) * 2001-09-04 2003-01-21 Siliconware Precision Industries Co Ltd Quad flat non-leaded semiconductor package structure and manufacturing process

Also Published As

Publication number Publication date
DE10325566A1 (de) 2005-01-13
FR2855891A1 (fr) 2004-12-10

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