FR2850638B1 - Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres - Google Patents

Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres

Info

Publication number
FR2850638B1
FR2850638B1 FR0301199A FR0301199A FR2850638B1 FR 2850638 B1 FR2850638 B1 FR 2850638B1 FR 0301199 A FR0301199 A FR 0301199A FR 0301199 A FR0301199 A FR 0301199A FR 2850638 B1 FR2850638 B1 FR 2850638B1
Authority
FR
France
Prior art keywords
integrated circuits
electronic label
label box
manufacturing integrated
detachable electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0301199A
Other languages
English (en)
Other versions
FR2850638A1 (fr
Inventor
Houcine Gourini
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EXCEL SERVICES EMBALLAGES SA
Original Assignee
EXCEL SERVICES EMBALLAGES SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EXCEL SERVICES EMBALLAGES SA filed Critical EXCEL SERVICES EMBALLAGES SA
Priority to FR0301199A priority Critical patent/FR2850638B1/fr
Publication of FR2850638A1 publication Critical patent/FR2850638A1/fr
Application granted granted Critical
Publication of FR2850638B1 publication Critical patent/FR2850638B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
FR0301199A 2003-02-03 2003-02-03 Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres Expired - Fee Related FR2850638B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0301199A FR2850638B1 (fr) 2003-02-03 2003-02-03 Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0301199A FR2850638B1 (fr) 2003-02-03 2003-02-03 Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres

Publications (2)

Publication Number Publication Date
FR2850638A1 FR2850638A1 (fr) 2004-08-06
FR2850638B1 true FR2850638B1 (fr) 2006-09-29

Family

ID=32696299

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0301199A Expired - Fee Related FR2850638B1 (fr) 2003-02-03 2003-02-03 Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres

Country Status (1)

Country Link
FR (1) FR2850638B1 (fr)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5295522A (en) * 1992-09-24 1994-03-22 International Business Machines Corporation Gas purge system for isolation enclosure for contamination sensitive items
US5669508A (en) * 1996-05-28 1997-09-23 Taiwan Semiconductor Manufacturing Company, Ltd. Pod carrier function expansion by adding a fixture
JP3370279B2 (ja) * 1998-07-07 2003-01-27 信越ポリマー株式会社 精密基板収納容器
DE10045202A1 (de) * 2000-09-13 2002-04-11 Infineon Technologies Ag Kassette für flache Werkstücke
FR2819794B1 (fr) * 2001-01-22 2003-09-05 Excel Services Emballages Sa Boite a fermeture controlee pour le conditionnement de plaquettes distinees a la fabrication de circuits integres
US7040487B2 (en) * 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper

Also Published As

Publication number Publication date
FR2850638A1 (fr) 2004-08-06

Similar Documents

Publication Publication Date Title
GB0503654D0 (en) Integrated circuit package
EP1483355A4 (fr) Affinement de profil destine a une metrologie d'un circuit integre
AU2002326555A1 (en) Microelectronic circuit package having die fixed within a package core
DE10393094D2 (de) Schaltungsanordnung für eine Photovoltaikanlage -
FR2851373B1 (fr) Procede de fabrication d'un circuit electronique integre incorporant des cavites
HK1118256A1 (en) Label film for a blow moulding method
HK1071637A1 (en) A modular integrated circuit chip carrier
SG106115A1 (en) Apparatus for assembling integrated circuit packages
AU2003232716A8 (en) An integrated circuit package
SG121881A1 (en) System for fabricating an integrated circuit package on a printed circuit board
FR2857143B1 (fr) Support individuel pour etiquette electronique
FR2884681B1 (fr) Antenne pour etiquette electronique
DE60317685D1 (de) Substrattransfervorrichtung für eine komponentenanbringmaschine
FR2850638B1 (fr) Boite a etiquette electronique amovible, pour le conditionnement de plaquettes destinees a la fabrication de circuits integres
GB2398944B (en) A logic circuit
DE60237806D1 (de) Integrierte schaltung für einen druckkopf
DE50205336D1 (de) Gitterkorb für einen Behälter
AU2003275824A8 (en) Method for producing a packaged integrated circuit with a microcavity
DE60230693D1 (de) Austauschvorrichtung für einen geschlossenen Kreislauf
FR2854147B1 (fr) Machine a convoyeur pour la fabrication de brochettes
FR2859705B1 (fr) Etui de conditionnement a alveole de calage integre en forme de pyramide
DE60325777D1 (de) Vakuumvorrichtung für eine papiermaschine
TW547764U (en) Package for a high frequency integrated circuit
TW505096U (en) Mold for substrate on chip package
DE50107814D1 (de) Schaltungsanordnung für ein selbstleuchtendes Kennzeichen

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20111102