FR2842831B1 - Bains electrolytiques pour depot d'etain ou d'alliage d'etain - Google Patents

Bains electrolytiques pour depot d'etain ou d'alliage d'etain

Info

Publication number
FR2842831B1
FR2842831B1 FR0209590A FR0209590A FR2842831B1 FR 2842831 B1 FR2842831 B1 FR 2842831B1 FR 0209590 A FR0209590 A FR 0209590A FR 0209590 A FR0209590 A FR 0209590A FR 2842831 B1 FR2842831 B1 FR 2842831B1
Authority
FR
France
Prior art keywords
tin
deposition
electrolytic baths
alloy
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0209590A
Other languages
English (en)
Other versions
FR2842831A1 (fr
Inventor
Stephane Menard
David Mention
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micropulse Plating Concepts SAS MPC
Original Assignee
Micropulse Plating Concepts SAS MPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micropulse Plating Concepts SAS MPC filed Critical Micropulse Plating Concepts SAS MPC
Priority to FR0209590A priority Critical patent/FR2842831B1/fr
Priority to AU2003267530A priority patent/AU2003267530A1/en
Priority to PCT/FR2003/002324 priority patent/WO2004013382A1/fr
Publication of FR2842831A1 publication Critical patent/FR2842831A1/fr
Application granted granted Critical
Publication of FR2842831B1 publication Critical patent/FR2842831B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
FR0209590A 2002-07-29 2002-07-29 Bains electrolytiques pour depot d'etain ou d'alliage d'etain Expired - Fee Related FR2842831B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR0209590A FR2842831B1 (fr) 2002-07-29 2002-07-29 Bains electrolytiques pour depot d'etain ou d'alliage d'etain
AU2003267530A AU2003267530A1 (en) 2002-07-29 2003-07-23 Electrolytic baths for depositing tin or a tin alloy
PCT/FR2003/002324 WO2004013382A1 (fr) 2002-07-29 2003-07-23 Bains electrolytiques pour depot d'etain ou d'alliage d'etain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0209590A FR2842831B1 (fr) 2002-07-29 2002-07-29 Bains electrolytiques pour depot d'etain ou d'alliage d'etain

Publications (2)

Publication Number Publication Date
FR2842831A1 FR2842831A1 (fr) 2004-01-30
FR2842831B1 true FR2842831B1 (fr) 2004-11-19

Family

ID=30011558

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0209590A Expired - Fee Related FR2842831B1 (fr) 2002-07-29 2002-07-29 Bains electrolytiques pour depot d'etain ou d'alliage d'etain

Country Status (3)

Country Link
AU (1) AU2003267530A1 (fr)
FR (1) FR2842831B1 (fr)
WO (1) WO2004013382A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574912B2 (ja) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 スズめっき液
CN105648483B (zh) * 2016-04-11 2018-09-18 济南德锡科技有限公司 一种高速镀锡溶液及其制备方法
CN113957495A (zh) * 2020-07-21 2022-01-21 宝山钢铁股份有限公司 一种用于psa电镀锡不溶性阳极体系的光亮剂及应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
US6508927B2 (en) * 1998-11-05 2003-01-21 C. Uyemura & Co., Ltd. Tin-copper alloy electroplating bath
US6322686B1 (en) * 2000-03-31 2001-11-27 Shipley Company, L.L.C. Tin electrolyte

Also Published As

Publication number Publication date
WO2004013382A1 (fr) 2004-02-12
AU2003267530A1 (en) 2004-02-23
FR2842831A1 (fr) 2004-01-30

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20120330