AU2003267530A1 - Electrolytic baths for depositing tin or a tin alloy - Google Patents

Electrolytic baths for depositing tin or a tin alloy

Info

Publication number
AU2003267530A1
AU2003267530A1 AU2003267530A AU2003267530A AU2003267530A1 AU 2003267530 A1 AU2003267530 A1 AU 2003267530A1 AU 2003267530 A AU2003267530 A AU 2003267530A AU 2003267530 A AU2003267530 A AU 2003267530A AU 2003267530 A1 AU2003267530 A1 AU 2003267530A1
Authority
AU
Australia
Prior art keywords
tin
depositing
electrolytic baths
alloy
tin alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003267530A
Inventor
Stephane Menard
David Mention
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micropulse Plating Concepts SAS MPC
Original Assignee
Micropulse Plating Concepts SAS MPC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micropulse Plating Concepts SAS MPC filed Critical Micropulse Plating Concepts SAS MPC
Publication of AU2003267530A1 publication Critical patent/AU2003267530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU2003267530A 2002-07-29 2003-07-23 Electrolytic baths for depositing tin or a tin alloy Abandoned AU2003267530A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0209590A FR2842831B1 (en) 2002-07-29 2002-07-29 ELECTROLYTIC BATHS FOR TIN DEPOSITION OR TIN ALLOY
FR02/09590 2002-07-29
PCT/FR2003/002324 WO2004013382A1 (en) 2002-07-29 2003-07-23 Electrolytic baths for depositing tin or a tin alloy

Publications (1)

Publication Number Publication Date
AU2003267530A1 true AU2003267530A1 (en) 2004-02-23

Family

ID=30011558

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003267530A Abandoned AU2003267530A1 (en) 2002-07-29 2003-07-23 Electrolytic baths for depositing tin or a tin alloy

Country Status (3)

Country Link
AU (1) AU2003267530A1 (en)
FR (1) FR2842831B1 (en)
WO (1) WO2004013382A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5574912B2 (en) * 2010-10-22 2014-08-20 ローム・アンド・ハース電子材料株式会社 Tin plating solution
CN105648483B (en) * 2016-04-11 2018-09-18 济南德锡科技有限公司 A kind of high speed tin plating solution and preparation method thereof
CN113957495A (en) * 2020-07-21 2022-01-21 宝山钢铁股份有限公司 Brightener for PSA (pressure swing adsorption) electrotinning insoluble anode system and application

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
TW577938B (en) * 1998-11-05 2004-03-01 Uyemura C & Co Ltd Tin-copper alloy electroplating bath and plating process therewith
US6322686B1 (en) * 2000-03-31 2001-11-27 Shipley Company, L.L.C. Tin electrolyte

Also Published As

Publication number Publication date
FR2842831B1 (en) 2004-11-19
FR2842831A1 (en) 2004-01-30
WO2004013382A1 (en) 2004-02-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase