FR2821959B1 - Procede de fabrication d'un corps de support de donnees - Google Patents
Procede de fabrication d'un corps de support de donneesInfo
- Publication number
- FR2821959B1 FR2821959B1 FR0202889A FR0202889A FR2821959B1 FR 2821959 B1 FR2821959 B1 FR 2821959B1 FR 0202889 A FR0202889 A FR 0202889A FR 0202889 A FR0202889 A FR 0202889A FR 2821959 B1 FR2821959 B1 FR 2821959B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing
- support body
- data support
- data
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2001111683 DE10111683C1 (de) | 2001-03-09 | 2001-03-09 | Verfahren zur Herstellung eines Datenträgerkörpers |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2821959A1 FR2821959A1 (fr) | 2002-09-13 |
FR2821959B1 true FR2821959B1 (fr) | 2004-11-05 |
Family
ID=7677072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0202889A Expired - Fee Related FR2821959B1 (fr) | 2001-03-09 | 2002-03-07 | Procede de fabrication d'un corps de support de donnees |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE10111683C1 (de) |
FR (1) | FR2821959B1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005002728A1 (de) * | 2005-01-20 | 2006-08-03 | Giesecke & Devrient Gmbh | Tragbarer Datenträger |
US8351213B2 (en) * | 2006-05-26 | 2013-01-08 | Brian Gorrell | Electrical assembly |
EP2323076A1 (de) * | 2009-11-12 | 2011-05-18 | Gemalto SA | Bearbeitungsverfahren eines Kartenkörpers und entsprechende Bearbeitungsstation |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3122981A1 (de) * | 1981-06-10 | 1983-01-05 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Verfahren zum einbau von ic-bausteinen in ausweiskarten |
DE69317180T2 (de) * | 1992-08-28 | 1998-10-08 | Citizen Watch Co Ltd | Verfahren zur Herstellung von IC-Karten |
DE4446369A1 (de) * | 1994-12-23 | 1996-06-27 | Giesecke & Devrient Gmbh | Datenträger mit einem elektronischen Modul |
-
2001
- 2001-03-09 DE DE2001111683 patent/DE10111683C1/de not_active Expired - Fee Related
-
2002
- 2002-03-07 FR FR0202889A patent/FR2821959B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2821959A1 (fr) | 2002-09-13 |
DE10111683C1 (de) | 2002-11-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 15 |
|
PLFP | Fee payment |
Year of fee payment: 16 |
|
PLFP | Fee payment |
Year of fee payment: 17 |
|
TP | Transmission of property |
Owner name: GIESECKE+DEVRIENT MOBILE SECURITY GMBH, DE Effective date: 20180619 |
|
ST | Notification of lapse |
Effective date: 20191105 |