FR2808408B3 - LIGHT EMITTING DIODE DEVICE - Google Patents

LIGHT EMITTING DIODE DEVICE

Info

Publication number
FR2808408B3
FR2808408B3 FR0005391A FR0005391A FR2808408B3 FR 2808408 B3 FR2808408 B3 FR 2808408B3 FR 0005391 A FR0005391 A FR 0005391A FR 0005391 A FR0005391 A FR 0005391A FR 2808408 B3 FR2808408 B3 FR 2808408B3
Authority
FR
France
Prior art keywords
light emitting
emitting diode
diode device
light
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0005391A
Other languages
French (fr)
Other versions
FR2808408A3 (en
Inventor
Chen Chen Lun Hsing
I Hsiang Li
Hsiao Tsui Chin Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lite On Electronics Inc
Original Assignee
Lite On Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB0009879A priority Critical patent/GB2361581A/en
Application filed by Lite On Electronics Inc filed Critical Lite On Electronics Inc
Priority to FR0005391A priority patent/FR2808408B3/en
Priority to DE20007730U priority patent/DE20007730U1/en
Publication of FR2808408A3 publication Critical patent/FR2808408A3/en
Application granted granted Critical
Publication of FR2808408B3 publication Critical patent/FR2808408B3/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
FR0005391A 2000-04-20 2000-04-27 LIGHT EMITTING DIODE DEVICE Expired - Lifetime FR2808408B3 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB0009879A GB2361581A (en) 2000-04-20 2000-04-20 A light emitting diode device
FR0005391A FR2808408B3 (en) 2000-04-20 2000-04-27 LIGHT EMITTING DIODE DEVICE
DE20007730U DE20007730U1 (en) 2000-04-20 2000-04-28 Device with light emitting diodes

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0009879A GB2361581A (en) 2000-04-20 2000-04-20 A light emitting diode device
FR0005391A FR2808408B3 (en) 2000-04-20 2000-04-27 LIGHT EMITTING DIODE DEVICE
DE20007730U DE20007730U1 (en) 2000-04-20 2000-04-28 Device with light emitting diodes

Publications (2)

Publication Number Publication Date
FR2808408A3 FR2808408A3 (en) 2001-11-02
FR2808408B3 true FR2808408B3 (en) 2002-04-12

Family

ID=27219451

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0005391A Expired - Lifetime FR2808408B3 (en) 2000-04-20 2000-04-27 LIGHT EMITTING DIODE DEVICE

Country Status (3)

Country Link
DE (1) DE20007730U1 (en)
FR (1) FR2808408B3 (en)
GB (1) GB2361581A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
US6527422B1 (en) * 2000-08-17 2003-03-04 Power Signal Technologies, Inc. Solid state light with solar shielded heatsink
US20020079505A1 (en) * 2000-12-21 2002-06-27 Stefan Becker Semiconductor light unit and method for production of the same
JP2005513815A (en) * 2001-12-29 2005-05-12 杭州富陽新穎電子有限公司 Light emitting diode and light emitting diode lamp
GB0203588D0 (en) * 2002-02-14 2002-04-03 Enfis Ltd A light system
NZ531587A (en) 2002-06-14 2008-06-30 Lednium Technology Pty Ltd A lamp and method of producing a lamp
DE10245892A1 (en) 2002-09-30 2004-05-13 Siemens Ag Illumination device for backlighting an image display device
AU2003281967A1 (en) 2002-11-19 2004-06-15 Dan Friis Lighting body or source of light based on light-emitting diodes
JP2004342870A (en) * 2003-05-16 2004-12-02 Stanley Electric Co Ltd Light emitting diode to be driven with large current
FR2862424B1 (en) * 2003-11-18 2006-10-20 Valeo Electronique Sys Liaison DEVICE FOR COOLING AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
US20060083017A1 (en) * 2004-10-18 2006-04-20 Bwt Propety, Inc. Solid-state lighting apparatus for navigational aids
US20060097385A1 (en) 2004-10-25 2006-05-11 Negley Gerald H Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same
DE102006002275A1 (en) * 2005-01-19 2006-07-20 Osram Opto Semiconductors Gmbh lighting device
US7262438B2 (en) 2005-03-08 2007-08-28 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. LED mounting having increased heat dissipation
CN100405621C (en) * 2005-09-29 2008-07-23 上海乐金广电电子有限公司 High-output white light source and its production
DE102006033893B4 (en) 2005-12-16 2017-02-23 Osram Opto Semiconductors Gmbh lighting device
DE102006015377B4 (en) * 2006-04-03 2018-06-14 Ivoclar Vivadent Ag Semiconductor radiation source and light curing device
DE102006036544A1 (en) * 2006-08-04 2008-02-07 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Optoelectronic module
KR100888228B1 (en) * 2007-06-22 2009-03-12 (주)웨이브닉스이에스피 Metal-Based Photonic Device Package Module and Process of The Same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62196878A (en) * 1986-02-25 1987-08-31 Koito Mfg Co Ltd Illumination system
JPS62229987A (en) * 1986-03-31 1987-10-08 Koito Mfg Co Ltd Illuminator
JPH0680841B2 (en) * 1986-04-07 1994-10-12 株式会社小糸製作所 Lighting equipment
US4935665A (en) * 1987-12-24 1990-06-19 Mitsubishi Cable Industries Ltd. Light emitting diode lamp
JP2896905B2 (en) * 1989-09-30 1999-05-31 三菱電線工業株式会社 lamp
JPH088463A (en) * 1994-06-21 1996-01-12 Sharp Corp Thin type led dot matrix unit
JPH11298048A (en) * 1998-04-15 1999-10-29 Matsushita Electric Works Ltd Led mounting board

Also Published As

Publication number Publication date
FR2808408A3 (en) 2001-11-02
GB0009879D0 (en) 2000-06-07
DE20007730U1 (en) 2000-08-03
GB2361581A (en) 2001-10-24

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