FR2806398B1 - Procede pour fabriquer un systeme de capteur - Google Patents

Procede pour fabriquer un systeme de capteur

Info

Publication number
FR2806398B1
FR2806398B1 FR0102180A FR0102180A FR2806398B1 FR 2806398 B1 FR2806398 B1 FR 2806398B1 FR 0102180 A FR0102180 A FR 0102180A FR 0102180 A FR0102180 A FR 0102180A FR 2806398 B1 FR2806398 B1 FR 2806398B1
Authority
FR
France
Prior art keywords
manufacturing
sensor system
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0102180A
Other languages
English (en)
Other versions
FR2806398A1 (fr
Inventor
Guy Hoffmann
Peter Weyand
Stefan K Linke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Publication of FR2806398A1 publication Critical patent/FR2806398A1/fr
Application granted granted Critical
Publication of FR2806398B1 publication Critical patent/FR2806398B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01FMEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845Micromachined devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00626Processes for achieving a desired geometry not provided for in groups B81C1/00563 - B81C1/00619
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00Basic microelectromechanical structures
    • B81B2203/01Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128Processes for removing material
    • B81C2201/013Etching
    • B81C2201/0135Controlling etch progression
    • B81C2201/014Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Volume Flow (AREA)
FR0102180A 2000-02-25 2001-02-16 Procede pour fabriquer un systeme de capteur Expired - Fee Related FR2806398B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2000108988 DE10008988A1 (de) 2000-02-25 2000-02-25 Verfahren zur Herstellung einer Sensoranordnung

Publications (2)

Publication Number Publication Date
FR2806398A1 FR2806398A1 (fr) 2001-09-21
FR2806398B1 true FR2806398B1 (fr) 2006-02-17

Family

ID=7632456

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0102180A Expired - Fee Related FR2806398B1 (fr) 2000-02-25 2001-02-16 Procede pour fabriquer un systeme de capteur

Country Status (2)

Country Link
DE (1) DE10008988A1 (fr)
FR (1) FR2806398B1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4610447B2 (ja) * 2005-08-31 2011-01-12 Okiセミコンダクタ株式会社 半導体装置とその製造方法及び検査方法
WO2007034240A2 (fr) 2005-09-20 2007-03-29 Bae Systems Plc Capteur
US7372115B2 (en) 2005-11-16 2008-05-13 Delphi Technologies, Inc. Thermally isolated membrane structure
GB2451909B (en) * 2007-08-17 2012-07-11 Wolfson Microelectronics Plc Mems process and device
GB2557364B (en) * 2016-11-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
GB2566117A (en) * 2017-08-31 2019-03-06 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237867A (en) * 1990-06-29 1993-08-24 Siemens Automotive L.P. Thin-film air flow sensor using temperature-biasing resistive element
DE4215722C2 (de) * 1992-05-13 1997-02-13 Bosch Gmbh Robert Sensorsubstrat mit einer Membran und Verfahren zu deren Herstellung
JP3301334B2 (ja) * 1997-01-31 2002-07-15 三菱電機株式会社 センサ素子及びその製造方法
DE19903380B4 (de) * 1998-02-02 2007-10-18 Denso Corp., Kariya Halbleitersensoren für eine physikalische Grösse und ihre Herstellungsverfahren

Also Published As

Publication number Publication date
DE10008988A1 (de) 2001-08-30
FR2806398A1 (fr) 2001-09-21

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20081031