FR2798219B1 - Inductance et procede de fabrication - Google Patents

Inductance et procede de fabrication

Info

Publication number
FR2798219B1
FR2798219B1 FR9911186A FR9911186A FR2798219B1 FR 2798219 B1 FR2798219 B1 FR 2798219B1 FR 9911186 A FR9911186 A FR 9911186A FR 9911186 A FR9911186 A FR 9911186A FR 2798219 B1 FR2798219 B1 FR 2798219B1
Authority
FR
France
Prior art keywords
inductance
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9911186A
Other languages
English (en)
Other versions
FR2798219A1 (fr
Inventor
Jou Chewnpu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to GB9919091A priority Critical patent/GB2353139B/en
Priority to US09/375,672 priority patent/US6201289B1/en
Priority to US09/375,688 priority patent/US6242791B1/en
Priority to DE19940035A priority patent/DE19940035A1/de
Priority to NL1012960A priority patent/NL1012960C2/nl
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to FR9911186A priority patent/FR2798219B1/fr
Priority to FR9914756A priority patent/FR2798220B1/fr
Publication of FR2798219A1 publication Critical patent/FR2798219A1/fr
Application granted granted Critical
Publication of FR2798219B1 publication Critical patent/FR2798219B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/10—Inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/957—Making metal-insulator-metal device

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Coils Or Transformers For Communication (AREA)
FR9911186A 1999-08-12 1999-09-07 Inductance et procede de fabrication Expired - Fee Related FR2798219B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
GB9919091A GB2353139B (en) 1999-08-12 1999-08-12 Inductor and method of manufacturing the same
US09/375,688 US6242791B1 (en) 1999-08-12 1999-08-17 Semiconductor inductor
US09/375,672 US6201289B1 (en) 1999-08-12 1999-08-17 Method of manufacturing an inductor
DE19940035A DE19940035A1 (de) 1999-08-12 1999-08-24 Spule und Verfahren zum Herstellen einer Spule
NL1012960A NL1012960C2 (nl) 1999-08-12 1999-09-02 Inductor en werkwijze voor het vervaardigen daarvan.
FR9911186A FR2798219B1 (fr) 1999-08-12 1999-09-07 Inductance et procede de fabrication
FR9914756A FR2798220B1 (fr) 1999-08-12 1999-11-23 Inductance et procede de fabrication

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
GB9919091A GB2353139B (en) 1999-08-12 1999-08-12 Inductor and method of manufacturing the same
US09/375,688 US6242791B1 (en) 1999-08-12 1999-08-17 Semiconductor inductor
US09/375,672 US6201289B1 (en) 1999-08-12 1999-08-17 Method of manufacturing an inductor
DE19940035A DE19940035A1 (de) 1999-08-12 1999-08-24 Spule und Verfahren zum Herstellen einer Spule
NL1012960A NL1012960C2 (nl) 1999-08-12 1999-09-02 Inductor en werkwijze voor het vervaardigen daarvan.
FR9911186A FR2798219B1 (fr) 1999-08-12 1999-09-07 Inductance et procede de fabrication
FR9914756A FR2798220B1 (fr) 1999-08-12 1999-11-23 Inductance et procede de fabrication

Publications (2)

Publication Number Publication Date
FR2798219A1 FR2798219A1 (fr) 2001-03-09
FR2798219B1 true FR2798219B1 (fr) 2002-06-28

Family

ID=27561767

Family Applications (2)

Application Number Title Priority Date Filing Date
FR9911186A Expired - Fee Related FR2798219B1 (fr) 1999-08-12 1999-09-07 Inductance et procede de fabrication
FR9914756A Expired - Fee Related FR2798220B1 (fr) 1999-08-12 1999-11-23 Inductance et procede de fabrication

Family Applications After (1)

Application Number Title Priority Date Filing Date
FR9914756A Expired - Fee Related FR2798220B1 (fr) 1999-08-12 1999-11-23 Inductance et procede de fabrication

Country Status (5)

Country Link
US (2) US6242791B1 (fr)
DE (1) DE19940035A1 (fr)
FR (2) FR2798219B1 (fr)
GB (1) GB2353139B (fr)
NL (1) NL1012960C2 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8421158B2 (en) * 1998-12-21 2013-04-16 Megica Corporation Chip structure with a passive device and method for forming the same
US6965165B2 (en) 1998-12-21 2005-11-15 Mou-Shiung Lin Top layers of metal for high performance IC's
US6303423B1 (en) * 1998-12-21 2001-10-16 Megic Corporation Method for forming high performance system-on-chip using post passivation process
US8178435B2 (en) 1998-12-21 2012-05-15 Megica Corporation High performance system-on-chip inductor using post passivation process
US7531417B2 (en) * 1998-12-21 2009-05-12 Megica Corporation High performance system-on-chip passive device using post passivation process
US6356183B1 (en) * 1999-08-17 2002-03-12 United Microelectronics Corp. Method of manufacturing an inductor
SG98398A1 (en) 2000-05-25 2003-09-19 Inst Of Microelectronics Integrated circuit inductor
US6441442B1 (en) * 2000-05-30 2002-08-27 Programmable Silicon Solutions Integrated inductive circuits
US6917095B1 (en) 2000-05-30 2005-07-12 Altera Corporation Integrated radio frequency circuits
US6420773B1 (en) * 2000-10-04 2002-07-16 Winbond Electronics Corp. Multi-level spiral inductor structure having high inductance (L) and high quality factor (Q)
US6373121B1 (en) * 2001-03-23 2002-04-16 United Microelectronics Corp. Silicon chip built-in inductor structure
US6759275B1 (en) 2001-09-04 2004-07-06 Megic Corporation Method for making high-performance RF integrated circuits
US6833781B1 (en) 2002-06-27 2004-12-21 National Semiconductor Corporation High Q inductor in multi-level interconnect
US7492463B2 (en) * 2004-04-15 2009-02-17 Davidson Instruments Inc. Method and apparatus for continuous readout of Fabry-Perot fiber optic sensor
US7627381B2 (en) 2004-05-07 2009-12-01 Therm Med, Llc Systems and methods for combined RF-induced hyperthermia and radioimmunotherapy
US7355282B2 (en) 2004-09-09 2008-04-08 Megica Corporation Post passivation interconnection process and structures
US8008775B2 (en) 2004-09-09 2011-08-30 Megica Corporation Post passivation interconnection structures
EP1681540A1 (fr) * 2004-12-21 2006-07-19 Davidson Instruments, Inc. Processeur de réseau à canaux multiples
EP1674833A3 (fr) 2004-12-21 2007-05-30 Davidson Instruments, Inc. Système de détection à fibres optiques
EP1869737B1 (fr) * 2005-03-16 2021-05-12 Davidson Instruments, Inc. Capteur fabry-perot haute intensite
US8384189B2 (en) * 2005-03-29 2013-02-26 Megica Corporation High performance system-on-chip using post passivation process
TWI305951B (en) 2005-07-22 2009-02-01 Megica Corp Method for forming a double embossing structure
US7705421B1 (en) 2005-11-18 2010-04-27 National Semiconductor Corporation Semiconductor die with an integrated inductor
WO2007109336A2 (fr) * 2006-03-22 2007-09-27 Davidson Instruments, Inc. Appareil de lecture en continu d'un capteur à fibre optique fabry-pérot
US7684051B2 (en) * 2006-04-18 2010-03-23 Halliburton Energy Services, Inc. Fiber optic seismic sensor based on MEMS cantilever
EP2021747B1 (fr) 2006-04-26 2018-08-01 Halliburton Energy Services, Inc. Capteurs sismiques micro-électromécanique à fibres optiques à masse supportée par des bras articulés
JP4878502B2 (ja) * 2006-05-29 2012-02-15 ルネサスエレクトロニクス株式会社 半導体装置
US8115937B2 (en) 2006-08-16 2012-02-14 Davidson Instruments Methods and apparatus for measuring multiple Fabry-Perot gaps
CA2676246C (fr) * 2007-01-24 2013-03-19 Halliburton Energy Services, Inc. Transducteur de mesure de parametres environnementaux
US20080186123A1 (en) * 2007-02-07 2008-08-07 Industrial Technology Research Institute Inductor devices
US8129817B2 (en) * 2008-12-31 2012-03-06 Taiwan Semiconductor Manufacturing Co., Ltd. Reducing high-frequency signal loss in substrates
US8546907B2 (en) * 2009-04-15 2013-10-01 Taiwan Semiconductor Manufacturing Company, Ltd. Enhanced transmission lines for radio frequency applications
US8552829B2 (en) 2010-11-19 2013-10-08 Infineon Technologies Austria Ag Transformer device and method for manufacturing a transformer device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0272660A (ja) * 1988-09-07 1990-03-12 Kawasaki Steel Corp 半導体装置
US5500552A (en) * 1993-07-26 1996-03-19 T.I.F. Co., Ltd. LC element, semiconductor device and LC element manufacturing method
TW275152B (fr) * 1993-11-01 1996-05-01 Ikeda Takeshi
US5497028A (en) * 1993-11-10 1996-03-05 Ikeda; Takeshi LC element and semiconductor device having a signal transmission line and LC element manufacturing method
TW267260B (fr) * 1993-12-29 1996-01-01 Tif Kk
GB2301706A (en) * 1995-06-01 1996-12-11 Plessey Semiconductors Ltd Intergrated inductor arrangement
US5760456A (en) * 1995-12-21 1998-06-02 Grzegorek; Andrew Z. Integrated circuit compatible planar inductors with increased Q
US6008713A (en) * 1996-02-29 1999-12-28 Texas Instruments Incorporated Monolithic inductor
US5736749A (en) * 1996-11-19 1998-04-07 Lucent Technologies Inc. Integrated circuit device with inductor incorporated therein
KR100243658B1 (ko) * 1996-12-06 2000-02-01 정선종 기판 변환기술을 이용한 인덕터 소자 및 그 제조 방법
US5936299A (en) * 1997-03-13 1999-08-10 International Business Machines Corporation Substrate contact for integrated spiral inductors
EP0940849A1 (fr) * 1998-03-05 1999-09-08 Interuniversitair Micro-Elektronica Centrum Vzw Piste conductrice à faibles pertes sur un substrat et procédé pour sa fabrication
JP3942264B2 (ja) * 1998-03-11 2007-07-11 富士通株式会社 半導体基板上に形成されるインダクタンス素子
US6133079A (en) * 1999-07-22 2000-10-17 Chartered Semiconductor Manufacturing Ltd. Method for reducing substrate capacitive coupling of a thin film inductor by reverse P/N junctions

Also Published As

Publication number Publication date
US6201289B1 (en) 2001-03-13
GB2353139A (en) 2001-02-14
GB9919091D0 (en) 1999-10-13
NL1012960C2 (nl) 2001-03-05
FR2798220B1 (fr) 2001-11-16
US6242791B1 (en) 2001-06-05
FR2798220A1 (fr) 2001-03-09
GB2353139B (en) 2001-08-29
FR2798219A1 (fr) 2001-03-09
GB2353139A9 (en) 2001-06-21
DE19940035A1 (de) 2001-03-01

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Legal Events

Date Code Title Description
TP Transmission of property
ST Notification of lapse

Effective date: 20150529