FR2795822B1 - Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique - Google Patents
Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette techniqueInfo
- Publication number
- FR2795822B1 FR2795822B1 FR9908522A FR9908522A FR2795822B1 FR 2795822 B1 FR2795822 B1 FR 2795822B1 FR 9908522 A FR9908522 A FR 9908522A FR 9908522 A FR9908522 A FR 9908522A FR 2795822 B1 FR2795822 B1 FR 2795822B1
- Authority
- FR
- France
- Prior art keywords
- dit
- copper
- silicon
- same
- quantitative determination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Sampling And Sample Adjustment (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9908522A FR2795822B1 (fr) | 1999-06-30 | 1999-06-30 | Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique |
PCT/FR2000/001837 WO2001003177A1 (fr) | 1999-06-30 | 2000-06-29 | Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique |
US09/763,792 US6504377B1 (en) | 1999-06-30 | 2000-06-29 | Device for quantitative detection of copper in silicon by transient ionic drift and method using same |
JP2001508491A JP2003504597A (ja) | 1999-06-30 | 2000-06-29 | 過渡的イオンドリフト(dit)によるシリコン内の銅量決定装置及びその技術を使用する方法 |
EP00949586A EP1114452A1 (fr) | 1999-06-30 | 2000-06-29 | Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique |
DE1114452T DE1114452T1 (de) | 1999-06-30 | 2000-06-29 | Apparat zur bestimmung des kupfergehaltes in silizium durch transistor-ionendrainage und ein zugehöriges verfahren |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9908522A FR2795822B1 (fr) | 1999-06-30 | 1999-06-30 | Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2795822A1 FR2795822A1 (fr) | 2001-01-05 |
FR2795822B1 true FR2795822B1 (fr) | 2001-09-14 |
Family
ID=9547618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9908522A Expired - Fee Related FR2795822B1 (fr) | 1999-06-30 | 1999-06-30 | Dispositif de determination quantitative du cuivre dans le silicium par drainage ionique transitoire (dit) et procede utilisant cette technique |
Country Status (6)
Country | Link |
---|---|
US (1) | US6504377B1 (fr) |
EP (1) | EP1114452A1 (fr) |
JP (1) | JP2003504597A (fr) |
DE (1) | DE1114452T1 (fr) |
FR (1) | FR2795822B1 (fr) |
WO (1) | WO2001003177A1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4371587A (en) * | 1979-12-17 | 1983-02-01 | Hughes Aircraft Company | Low temperature process for depositing oxide layers by photochemical vapor deposition |
US4474829A (en) * | 1981-11-23 | 1984-10-02 | Hughes Aircraft Company | Low-temperature charge-free process for forming native oxide layers |
JPH07297246A (ja) * | 1994-04-27 | 1995-11-10 | Hitachi Ltd | シリコン半導体の金属汚染モニタ方法 |
US6095084A (en) * | 1996-02-02 | 2000-08-01 | Applied Materials, Inc. | High density plasma process chamber |
US5943552A (en) * | 1997-02-06 | 1999-08-24 | Seh America, Inc. | Schottky metal detection method |
-
1999
- 1999-06-30 FR FR9908522A patent/FR2795822B1/fr not_active Expired - Fee Related
-
2000
- 2000-06-29 US US09/763,792 patent/US6504377B1/en not_active Expired - Fee Related
- 2000-06-29 JP JP2001508491A patent/JP2003504597A/ja not_active Withdrawn
- 2000-06-29 DE DE1114452T patent/DE1114452T1/de active Pending
- 2000-06-29 WO PCT/FR2000/001837 patent/WO2001003177A1/fr not_active Application Discontinuation
- 2000-06-29 EP EP00949586A patent/EP1114452A1/fr not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
WO2001003177A1 (fr) | 2001-01-11 |
EP1114452A1 (fr) | 2001-07-11 |
DE1114452T1 (de) | 2002-04-04 |
US6504377B1 (en) | 2003-01-07 |
JP2003504597A (ja) | 2003-02-04 |
FR2795822A1 (fr) | 2001-01-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20080229 |