FR2794851B1 - Dispositif de refroidissement du type a evaporation d'eau pour une unite de production de chaleur - Google Patents

Dispositif de refroidissement du type a evaporation d'eau pour une unite de production de chaleur

Info

Publication number
FR2794851B1
FR2794851B1 FR9914357A FR9914357A FR2794851B1 FR 2794851 B1 FR2794851 B1 FR 2794851B1 FR 9914357 A FR9914357 A FR 9914357A FR 9914357 A FR9914357 A FR 9914357A FR 2794851 B1 FR2794851 B1 FR 2794851B1
Authority
FR
France
Prior art keywords
cooling device
production unit
heat production
water evaporation
type cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9914357A
Other languages
English (en)
Other versions
FR2794851A1 (fr
Inventor
Tetsuo Moriguchi
Kazuhiko Hara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2794851A1 publication Critical patent/FR2794851A1/fr
Application granted granted Critical
Publication of FR2794851B1 publication Critical patent/FR2794851B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D5/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, using the cooling effect of natural or forced evaporation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9914357A 1999-06-11 1999-11-16 Dispositif de refroidissement du type a evaporation d'eau pour une unite de production de chaleur Expired - Fee Related FR2794851B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11165367A JP2000353774A (ja) 1999-06-11 1999-06-11 水蒸発式発熱体冷却装置

Publications (2)

Publication Number Publication Date
FR2794851A1 FR2794851A1 (fr) 2000-12-15
FR2794851B1 true FR2794851B1 (fr) 2001-09-21

Family

ID=15811033

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9914357A Expired - Fee Related FR2794851B1 (fr) 1999-06-11 1999-11-16 Dispositif de refroidissement du type a evaporation d'eau pour une unite de production de chaleur

Country Status (3)

Country Link
US (1) US6282913B1 (fr)
JP (1) JP2000353774A (fr)
FR (1) FR2794851B1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7107783B2 (en) * 1997-09-19 2006-09-19 Advanced Porcus Technologies, Llc Self-cooling containers for liquids
US6718790B2 (en) * 2001-08-07 2004-04-13 Tetsuo Moriguchi Cooling device, condenser, and air conditioning system
JP2003193114A (ja) * 2001-08-28 2003-07-09 Advanced Materials Technologies Pte Ltd ヒートパイプ及びその製造方法
US6796140B1 (en) * 2003-12-10 2004-09-28 Cohand Technology Co., Ltd. Heat exchanger
JP4056504B2 (ja) * 2004-08-18 2008-03-05 Necディスプレイソリューションズ株式会社 冷却装置及びこれを備えた電子機器
US20080022942A1 (en) * 2006-07-27 2008-01-31 Graham C (Hong Kong) Limited Pet shelter
TW200821528A (en) * 2006-11-08 2008-05-16 Jun-Guang Luo Phase-transformation heat dissipation device with heat dissipation chamber
CN101182976A (zh) * 2006-11-14 2008-05-21 诺亚公司 散热腔体及具有散热腔体的相变散热装置
US20080264614A1 (en) * 2007-04-27 2008-10-30 Szolyga Thomas H Cooling components in electronic devices
US8650891B2 (en) * 2009-04-16 2014-02-18 Telefonaktiebolaget L M Ericsson (Publ) Heat transfer arrangement and electronic housing comprising a heat transfer arrangement and method of controlling heat transfer
US8776868B2 (en) 2009-08-28 2014-07-15 International Business Machines Corporation Thermal ground plane for cooling a computer
CN110612015B (zh) * 2019-08-05 2020-10-20 南京理工大学 具有叠层结构的相变型自然对流散热装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034521A (ja) 1989-05-31 1991-01-10 Toshiba Corp 液相結晶成長方法
JP2996304B2 (ja) * 1989-07-12 1999-12-27 東レ株式会社 分離膜の製造方法
US5184470A (en) * 1991-11-18 1993-02-09 Hughes Aircraft Company Endothermic cooler for electronic components
JPH0621279A (ja) 1992-07-03 1994-01-28 Hitachi Cable Ltd 伝熱装置
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
JPH09196504A (ja) 1995-07-24 1997-07-31 Mitsubishi Electric Corp 電解反応による水蒸発式冷却方法およびその冷却装置
JP2861945B2 (ja) * 1996-06-24 1999-02-24 日本電気株式会社 密閉型装置の放熱構造
JP3207138B2 (ja) 1997-07-29 2001-09-10 三菱電機株式会社 水蒸発式冷却装置
US6069791A (en) * 1997-08-14 2000-05-30 Fujikura Ltd. Cooling device for notebook personal computer
US5946931A (en) * 1998-02-25 1999-09-07 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Evaporative cooling membrane device
US6166907A (en) * 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system

Also Published As

Publication number Publication date
FR2794851A1 (fr) 2000-12-15
JP2000353774A (ja) 2000-12-19
US6282913B1 (en) 2001-09-04

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Legal Events

Date Code Title Description
ST Notification of lapse