FR2775830B1 - PROCESS FOR ATTACKING SILICON NITRIDE - Google Patents
PROCESS FOR ATTACKING SILICON NITRIDEInfo
- Publication number
- FR2775830B1 FR2775830B1 FR9806530A FR9806530A FR2775830B1 FR 2775830 B1 FR2775830 B1 FR 2775830B1 FR 9806530 A FR9806530 A FR 9806530A FR 9806530 A FR9806530 A FR 9806530A FR 2775830 B1 FR2775830 B1 FR 2775830B1
- Authority
- FR
- France
- Prior art keywords
- silicon nitride
- attacking silicon
- attacking
- nitride
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052581 Si3N4 Inorganic materials 0.000 title 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Drying Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW87103397 | 1998-03-09 | ||
GB9809769A GB2337026B (en) | 1998-03-09 | 1998-05-07 | Method of etching silicon nitride |
NL1009202A NL1009202C2 (en) | 1998-03-09 | 1998-05-19 | Method for etching silicon nitride. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2775830A1 FR2775830A1 (en) | 1999-09-10 |
FR2775830B1 true FR2775830B1 (en) | 2002-10-11 |
Family
ID=27269304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9806530A Expired - Fee Related FR2775830B1 (en) | 1998-03-09 | 1998-05-25 | PROCESS FOR ATTACKING SILICON NITRIDE |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPH11283964A (en) |
DE (1) | DE19821452B4 (en) |
FR (1) | FR2775830B1 (en) |
GB (1) | GB2337026B (en) |
NL (1) | NL1009202C2 (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4857140A (en) * | 1987-07-16 | 1989-08-15 | Texas Instruments Incorporated | Method for etching silicon nitride |
US5176790A (en) * | 1991-09-25 | 1993-01-05 | Applied Materials, Inc. | Process for forming a via in an integrated circuit structure by etching through an insulation layer while inhibiting sputtering of underlying metal |
US5269879A (en) * | 1991-10-16 | 1993-12-14 | Lam Research Corporation | Method of etching vias without sputtering of underlying electrically conductive layer |
DE4340590A1 (en) * | 1992-12-03 | 1994-06-09 | Hewlett Packard Co | Trench isolation using doped sidewalls |
US5514247A (en) * | 1994-07-08 | 1996-05-07 | Applied Materials, Inc. | Process for plasma etching of vias |
US5935877A (en) * | 1995-09-01 | 1999-08-10 | Applied Materials, Inc. | Etch process for forming contacts over titanium silicide |
US5728619A (en) * | 1996-03-20 | 1998-03-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Selective reactive Ion etch (RIE) method for forming a narrow line-width high aspect ratio via through an integrated circuit layer |
US5843847A (en) * | 1996-04-29 | 1998-12-01 | Applied Materials, Inc. | Method for etching dielectric layers with high selectivity and low microloading |
US5719089A (en) * | 1996-06-21 | 1998-02-17 | Vanguard International Semiconductor Corporation | Method for etching polymer-assisted reduced small contacts for ultra large scale integration semiconductor devices |
-
1998
- 1998-05-07 GB GB9809769A patent/GB2337026B/en not_active Expired - Fee Related
- 1998-05-13 DE DE19821452A patent/DE19821452B4/en not_active Expired - Fee Related
- 1998-05-19 NL NL1009202A patent/NL1009202C2/en not_active IP Right Cessation
- 1998-05-21 JP JP10139493A patent/JPH11283964A/en active Pending
- 1998-05-25 FR FR9806530A patent/FR2775830B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
NL1009202C2 (en) | 1999-11-22 |
GB2337026B (en) | 2000-11-08 |
DE19821452A1 (en) | 1999-09-23 |
GB9809769D0 (en) | 1998-07-08 |
JPH11283964A (en) | 1999-10-15 |
FR2775830A1 (en) | 1999-09-10 |
DE19821452B4 (en) | 2005-02-17 |
GB2337026A (en) | 1999-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150130 |