FR2770693B1 - Procede et appareil de mise en forme d'une impulsion laser - Google Patents

Procede et appareil de mise en forme d'une impulsion laser

Info

Publication number
FR2770693B1
FR2770693B1 FR9813491A FR9813491A FR2770693B1 FR 2770693 B1 FR2770693 B1 FR 2770693B1 FR 9813491 A FR9813491 A FR 9813491A FR 9813491 A FR9813491 A FR 9813491A FR 2770693 B1 FR2770693 B1 FR 2770693B1
Authority
FR
France
Prior art keywords
shaping
laser pulse
pulse
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9813491A
Other languages
English (en)
Other versions
FR2770693A1 (fr
Inventor
Phillip Randall Staver
Josef Robert Unternahrer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2770693A1 publication Critical patent/FR2770693A1/fr
Application granted granted Critical
Publication of FR2770693B1 publication Critical patent/FR2770693B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
    • H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
FR9813491A 1997-10-31 1998-10-28 Procede et appareil de mise en forme d'une impulsion laser Expired - Fee Related FR2770693B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/961,584 US5987042A (en) 1997-10-31 1997-10-31 Method and apparatus for shaping a laser pulse

Publications (2)

Publication Number Publication Date
FR2770693A1 FR2770693A1 (fr) 1999-05-07
FR2770693B1 true FR2770693B1 (fr) 2005-08-26

Family

ID=25504682

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9813491A Expired - Fee Related FR2770693B1 (fr) 1997-10-31 1998-10-28 Procede et appareil de mise en forme d'une impulsion laser

Country Status (4)

Country Link
US (1) US5987042A (fr)
JP (1) JPH11195830A (fr)
DE (1) DE19848105B4 (fr)
FR (1) FR2770693B1 (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6141362A (en) * 1998-06-05 2000-10-31 The United States Of America As Represented By The United States Department Of Energy Reduction of B-integral accumulation in lasers
US6373876B1 (en) * 1998-10-26 2002-04-16 Lsp Technologies, Inc. Single mode oscillator for a laser peening laser
US6254703B1 (en) * 1999-02-19 2001-07-03 Lsp Technologies, Inc. Quality control plasma monitor for laser shock processing
PL195102B1 (pl) 1999-07-19 2007-08-31 Univ California Sposób formowania kształtów i konturów w metalowym przedmiocie i układ do formowania kształtów i konturów w metalowym przedmiocie
US6670578B2 (en) 1999-07-19 2003-12-30 The Regents Of The University Of California Pre-loading of components during laser peenforming
US6423935B1 (en) 2000-02-18 2002-07-23 The Regents Of The University Of California Identification marking by means of laser peening
JP2002040627A (ja) * 2000-07-24 2002-02-06 Nec Corp レーザパターン修正方法並びに修正装置
US6657160B2 (en) 2001-01-25 2003-12-02 The Regents Of The University Of California Laser peening of components of thin cross-section
US6753947B2 (en) 2001-05-10 2004-06-22 Ultratech Stepper, Inc. Lithography system and method for device manufacture
US6570126B2 (en) 2001-08-31 2003-05-27 General Electric Company Simultaneous offset dual sided laser shock peening using low energy laser beams
US6570125B2 (en) 2001-08-31 2003-05-27 General Electric Company Simultaneous offset dual sided laser shock peening with oblique angle laser beams
KR100853233B1 (ko) * 2002-01-17 2008-08-20 김영호 광스위치를 이용한 정보보안장치 및 암호화 장치
US6900409B2 (en) * 2003-08-22 2005-05-31 General Electric Company Single head laser high throughput laser shock peening
US7148448B2 (en) * 2003-10-31 2006-12-12 General Electric Company Monitored laser shock peening
US8049137B2 (en) * 2004-02-13 2011-11-01 Boston Scientific Scimed, Inc. Laser shock peening of medical devices
US8319150B2 (en) * 2004-07-09 2012-11-27 General Electric Company Continuous motion laser shock peening
US7508850B2 (en) * 2004-09-02 2009-03-24 Coherent, Inc. Apparatus for modifying CO2 slab laser pulses
US7564879B2 (en) * 2005-04-08 2009-07-21 Mitsubishi Electric Corporation Laser system
DE102005061716A1 (de) * 2005-12-22 2007-07-05 BME Meßgeräte Entwicklung KG Pockelszellen-Ansteuerschaltung zur schnellen Variation der Pulsamplitude von kurzen oder ultrakurzen Laserpulsen
DE102006006582B4 (de) * 2006-02-13 2009-06-10 Jenoptik Laser, Optik, Systeme Gmbh Laser und Verfahren zur Erzeugung gepulster Laserstrahlung
JP5165210B2 (ja) * 2006-04-18 2013-03-21 三菱電機株式会社 Ｑスイッチレーザ装置
US7897895B2 (en) 2006-05-01 2011-03-01 General Electric Company System and method for controlling the power level of a laser apparatus in a laser shock peening process
DE102007057129B4 (de) * 2007-11-24 2010-07-22 Hochschule Mittweida (Fh) Verfahren und Einrichtung zur Hochleistungs-Mikrobearbeitung eines Körpers oder einer Pulverschicht mit einem Laser hoher Brillanz
US9478931B2 (en) * 2013-02-04 2016-10-25 Nlight Photonics Corporation Method for actively controlling the optical output of a seed laser
US9263855B2 (en) 2013-03-15 2016-02-16 Nlight Photonics Corporation Injection locking of gain switched diodes for spectral narrowing and jitter stabilization
CN105119134A (zh) 2014-03-13 2015-12-02 恩耐激光技术有限公司 用于种子可中止的脉冲光纤激光放大器的快速选通的算法
US9806488B2 (en) 2015-06-30 2017-10-31 Nlight, Inc. Adaptive boost control for gating picosecond pulsed fiber lasers
CN115241726A (zh) * 2016-03-21 2022-10-25 鲁美斯Be有限公司 激光系统中的脉冲削波器
US10686581B2 (en) * 2018-02-20 2020-06-16 Keysight Technologies, Inc. Methods, systems, and computer readable media for transmit timestamp autocalibration

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3747019A (en) * 1970-07-16 1973-07-17 Union Carbide Corp Method and means for stabilizing the amplitude and repetition frequency of a repetitively q-switched laser
US4256962A (en) * 1977-12-19 1981-03-17 Jersey Nuclear-Avco Isotopes, Inc. Laser pulse superimposing
US4959838A (en) * 1989-05-31 1990-09-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Method and circuit for shaping laser output pulses
ES2075435T3 (es) * 1990-01-11 1995-10-01 Battelle Memorial Institute Mejora de las propiedades de los materiales.
US4995044A (en) * 1990-03-23 1991-02-19 Tektronix, Inc. Laser diode impulse circuit
DE4114492C2 (de) * 1991-05-03 1996-10-24 Baasel Carl Lasertech Verfahren und Vorrichtung zur Materialbearbeitung mit Hilfe eines Lasers
US5343483A (en) * 1993-03-19 1994-08-30 Wisconsin Alumni Research Foundation High voltage fast pulse control for a Q-switched laser

Also Published As

Publication number Publication date
JPH11195830A (ja) 1999-07-21
DE19848105A1 (de) 1999-05-06
DE19848105B4 (de) 2009-08-20
US5987042A (en) 1999-11-16
FR2770693A1 (fr) 1999-05-07

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20160630