FR2769168B1 - Appareil electronique dans le boitier duquel est loge un module a carte a circuits imprimes - Google Patents

Appareil electronique dans le boitier duquel est loge un module a carte a circuits imprimes

Info

Publication number
FR2769168B1
FR2769168B1 FR9811636A FR9811636A FR2769168B1 FR 2769168 B1 FR2769168 B1 FR 2769168B1 FR 9811636 A FR9811636 A FR 9811636A FR 9811636 A FR9811636 A FR 9811636A FR 2769168 B1 FR2769168 B1 FR 2769168B1
Authority
FR
France
Prior art keywords
offered
housing
circuit board
printed circuit
electronic apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR9811636A
Other languages
English (en)
Other versions
FR2769168A1 (fr
Inventor
Yoshikatsu Kuroda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Publication of FR2769168A1 publication Critical patent/FR2769168A1/fr
Application granted granted Critical
Publication of FR2769168B1 publication Critical patent/FR2769168B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR9811636A 1997-09-19 1998-09-17 Appareil electronique dans le boitier duquel est loge un module a carte a circuits imprimes Expired - Lifetime FR2769168B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9255124A JPH1197870A (ja) 1997-09-19 1997-09-19 電子装置

Publications (2)

Publication Number Publication Date
FR2769168A1 FR2769168A1 (fr) 1999-04-02
FR2769168B1 true FR2769168B1 (fr) 2001-01-26

Family

ID=17274430

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9811636A Expired - Lifetime FR2769168B1 (fr) 1997-09-19 1998-09-17 Appareil electronique dans le boitier duquel est loge un module a carte a circuits imprimes

Country Status (4)

Country Link
US (1) US6252775B1 (fr)
JP (1) JPH1197870A (fr)
DE (1) DE19842615A1 (fr)
FR (1) FR2769168B1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292556B1 (en) 1997-11-06 2001-09-18 Anacapa Technology, Inc. Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
US6430044B2 (en) 2000-02-10 2002-08-06 Special Product Company Telecommunications enclosure with individual, separated card holders
US6404637B2 (en) * 2000-02-14 2002-06-11 Special Product Company Concentrical slot telecommunications equipment enclosure
US6507494B1 (en) 2000-07-27 2003-01-14 Adc Telecommunications, Inc. Electronic equipment enclosure
US6940014B1 (en) 2000-07-27 2005-09-06 Special Product Company Modular electronic equipment enclosure comprising sealed cable interface module
US6514095B1 (en) 2000-07-27 2003-02-04 Special Product Company Cable interface for electronic equipment enclosure
US6625017B1 (en) 2001-02-12 2003-09-23 Special Products Company Telecommunications enclosure with individual, separated card holders
US6496375B2 (en) * 2001-04-30 2002-12-17 Hewlett-Packard Company Cooling arrangement for high density packaging of electronic components
JP4556174B2 (ja) * 2004-12-15 2010-10-06 日本電気株式会社 携帯端末機器及び放熱方法
US20060221573A1 (en) * 2005-04-04 2006-10-05 Ming Li Heat sink for multiple semiconductor modules
DE102005036299B4 (de) 2005-08-02 2008-01-24 Siemens Ag Kühlanordnung
US20070253169A1 (en) * 2006-05-01 2007-11-01 Honeywell International Inc. Wedgelock device for increased thermal conductivity of a printed wiring wiring assembly
US7663888B2 (en) * 2006-07-17 2010-02-16 Alcatel Lucent Printed circuit board thickness adaptors
US7460367B2 (en) * 2007-03-05 2008-12-02 Tracewell Systems, Inc. Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology
DE102008005747A1 (de) * 2008-01-24 2009-07-30 Bayerische Motoren Werke Aktiengesellschaft Leistungselektronikmodul
JP4937951B2 (ja) * 2008-03-25 2012-05-23 三菱電機株式会社 電力用半導体装置およびその製造方法
DE202009016531U1 (de) * 2009-12-04 2011-04-14 Liebherr-Elektronik Gmbh Leistungselektronische Baugruppe und Wechselrichteranordnung
DE102010030525A1 (de) * 2010-06-25 2011-12-29 Zf Friedrichshafen Ag Elektronische Steuerbaugruppe
US8174831B2 (en) * 2010-07-20 2012-05-08 GM Global Technology Operations LLC Heating circuit and electronics assembly
FR2983676B1 (fr) * 2011-12-05 2013-12-20 Schneider Electric Ind Sas Armoire electrique a dissipation thermique amelioree
US9807905B2 (en) * 2015-11-25 2017-10-31 General Electric Company Adapter cooling apparatus and method for modular computing devices

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4298904A (en) 1979-12-17 1981-11-03 The Boeing Company Electronic conduction cooling clamp
US4480287A (en) 1982-12-27 1984-10-30 Raytheon Company Module retainer apparatus
DE3402256A1 (de) * 1984-01-24 1985-08-01 Brown, Boveri & Cie Ag, 6800 Mannheim Gehaeuse zur aufnahme elektronischer bauelemente
US4650923A (en) 1984-06-01 1987-03-17 Narumi China Corporation Ceramic article having a high moisture proof
US4730232A (en) 1986-06-25 1988-03-08 Westinghouse Electric Corp. High density microelectronic packaging module for high speed chips
US4867235A (en) * 1986-10-20 1989-09-19 Westinghouse Electric Corp. Composite heat transfer means
US4849858A (en) 1986-10-20 1989-07-18 Westinghouse Electric Corp. Composite heat transfer means
US4963414A (en) 1989-06-12 1990-10-16 General Electric Company Low thermal expansion, heat sinking substrate for electronic surface mount applications
US5485353A (en) 1993-02-26 1996-01-16 Eg&G Birtcher, Inc. Retainer assembly
US5414592A (en) 1993-03-26 1995-05-09 Honeywell Inc. Heat transforming arrangement for printed wiring boards
US5432675A (en) 1993-11-15 1995-07-11 Fujitsu Limited Multi-chip module having thermal contacts
FR2742294B1 (fr) * 1995-12-11 1998-02-27 Valeo Electronique Assemblage electronique a drain thermique, notamment pour transformateur haute tension de lampe a decharge de projecteur de vehicule automobile
FR2747005B1 (fr) * 1996-03-26 1998-06-19 Thomson Csf Boitier de micro-electronique avec systeme de refroidissement
US5859764A (en) 1997-02-27 1999-01-12 Raytheon Company Electronics package employing a high thermal performance wedgelock

Also Published As

Publication number Publication date
JPH1197870A (ja) 1999-04-09
DE19842615A1 (de) 1999-04-15
FR2769168A1 (fr) 1999-04-02
US6252775B1 (en) 2001-06-26

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