FR2745929A1 - Integrated circuit smart card with partly detached zone round integrated circuit chip - Google Patents
Integrated circuit smart card with partly detached zone round integrated circuit chip Download PDFInfo
- Publication number
- FR2745929A1 FR2745929A1 FR9603039A FR9603039A FR2745929A1 FR 2745929 A1 FR2745929 A1 FR 2745929A1 FR 9603039 A FR9603039 A FR 9603039A FR 9603039 A FR9603039 A FR 9603039A FR 2745929 A1 FR2745929 A1 FR 2745929A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- card
- plastic
- card body
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
La présente invention concerne une carte à circuit intégré comportant un corps de carte ayant une zone désolidarisée, et un procédé de désolidarisation d'une zone d'une carte à circuit intégré. The present invention relates to an integrated circuit card comprising a card body having a separated zone, and to a method of separating an zone from an integrated circuit card.
On connaît des cartes à circuit intégré comportant un corps de carte en matière plastique dans lequel est fixé un circuit intégré. Le circuit intégré peut être enchâssé directement dans le corps de carte et relié à des plaques conductrices par des pistes en polymère conducteur, ou être porté par un support intermédiaire pourvu de plages conductrices, le circuit intégré étant alors relié aux plages conductrices par des fils conducteurs noyés dans un bloc de résine enchâssé dans le corps de carte. Integrated circuit cards are known comprising a plastic card body in which an integrated circuit is fixed. The integrated circuit can be embedded directly in the card body and connected to conductive plates by conductive polymer tracks, or be carried by an intermediate support provided with conductive pads, the integrated circuit then being connected to the conductive pads by conductive wires. embedded in a block of resin embedded in the card body.
Dans un cas comme dans l'autre, la carte est soumise lors de son utilisation à des efforts de flexion qui tendent à provoquer une rupture des éléments de liaison entre le circuit intégré et les plages de contact. Afin d'éviter cet inconvénient il a été envisagé de désolidariser la zone contenant le circuit intégré du reste du corps de carte en réalisant une rainure entourant le circuit intégré et s'étendant soit entre le circuit intégré et les plages de contact soit autour des plages de contact. Pour avoir une efficacité maximale, il est préférable que la zone désolidarisée contenant le circuit intégré soit de très faibles dimensions afin que cette zone ne soit pas elle-même soumise à des efforts de flexion. La rainure de désolidarisation est donc de préférence disposée entre le circuit intégré et les plages de contact. Dans ce cas il est toutefois nécessaire d'interrompre la rainure au niveau d'une intersection entre la direction de la rainure et une piste conductrice afin de ne pas fragiliser la piste conductrice. I1 est alors nécessaire de laisser une bande de matière non rainurée suffisamment large pour que cette bande ne risque pas elle-même de se fissurer lors d'une flexion de la carte. In one case as in the other, the card is subjected during its use to bending forces which tend to cause a rupture of the connecting elements between the integrated circuit and the contact pads. In order to avoid this drawback, it has been envisaged to separate the area containing the integrated circuit from the rest of the card body by making a groove surrounding the integrated circuit and extending either between the integrated circuit and the contact pads or around the pads of contact. To have maximum efficiency, it is preferable that the separated zone containing the integrated circuit is of very small dimensions so that this zone is not itself subjected to bending forces. The separation groove is therefore preferably disposed between the integrated circuit and the contact pads. In this case it is however necessary to interrupt the groove at an intersection between the direction of the groove and a conductive track so as not to weaken the conductive track. I1 is then necessary to leave a strip of non-grooved material sufficiently wide so that this strip itself does not risk cracking during bending of the card.
Par ailleurs, dans le cas d'un circuit intégré enchâssé directement dans le corps de carte et relié aux plages de contact par des pistes conductrices disposées à la surface de la carte, la rainure en creux apparait à la surface de la carte et est une source de défauts lors de l'impression d'un décor sur la surface de la carte. Furthermore, in the case of an integrated circuit embedded directly in the card body and connected to the contact pads by conductive tracks arranged on the surface of the card, the recessed groove appears on the surface of the card and is a source of faults when printing a decoration on the surface of the card.
Selon l'invention on prévoit une carte à circuit intégré dans laquelle la matière constituant le corps de carte est structurellement modifiée selon un cordon entourant au moins partiellement une zone du corps de carte contenant le circuit intégré. La carte selon l'invention est obtenue selon un autre aspect de l'invention par un procédé comportant l'étape d'appliquer autour de la zone contenant le circuit intégré un produit chimique modifiant structurellement la matière plastique pour réaliser un affaiblissement mécanique de celle-ci. According to the invention there is provided an integrated circuit card in which the material constituting the card body is structurally modified according to a bead at least partially surrounding an area of the card body containing the integrated circuit. The card according to the invention is obtained according to another aspect of the invention by a method comprising the step of applying around the area containing the integrated circuit a chemical product structurally modifying the plastic material to achieve a mechanical weakening of it. this.
Ainsi, tout en préservant l'intégrité de la surface de la carte, le cordon de matière structurellement modifiée assure une désolidarisation de la zone contenant le circuit intégré par rapport à la zone environnante de la carte et minimise la transmission des efforts de flexion auxquels la carte est soumise. Thus, while preserving the integrity of the surface of the card, the bead of structurally modified material ensures separation of the area containing the integrated circuit from the surrounding area of the card and minimizes the transmission of bending forces to which the card is submitted.
Selon une version de l'invention en relation avec une carte dans laquelle le circuit intégré est fixé à un support intermédiaire lui-même fixé au corps de carte par un filet de colle, le cordon de matière structurellement modifiée est réalisé à l'aplomb du filet de colle en incorporant à la colle le produit chimique modifiant structurellement la matière plastique. According to a version of the invention in relation to a card in which the integrated circuit is fixed to an intermediate support itself fixed to the card body by a thread of glue, the bead of structurally modified material is produced directly above the glue stream by incorporating the chemical structurally modifying the plastic into the glue.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description qui suit de deux modes de réalisation particuliers non limitatifs de l'invention, en relation avec les figures cijointes parmi lesquelles:
- la figure 1 est une vue en perspective par tielle d'une carte dans laquelle le circuit intégré est directement enchâssé dans le corps de carte,
- la figure 2 est une vue en coupe d'une carte dans laquelle le circuit intégré est fixé à un support intermédiaire lui-même fixé au corps de carte.Other characteristics and advantages of the invention will appear on reading the following description of two particular non-limiting embodiments of the invention, in relation to the attached figures among which:
FIG. 1 is a partial perspective view of a card in which the integrated circuit is directly embedded in the card body,
- Figure 2 is a sectional view of a card in which the integrated circuit is fixed to an intermediate support itself fixed to the card body.
En référence à la figure 1, on a représenté de façon très agrandie une portion d'une carte comportant un corps de carte 1 en matière plastique dans lequel est fixé un circuit intégré 2, par exemple par enfoncement du circuit intégré au moyen d'un poinçon chauffant. Referring to Figure 1, there is shown in a very enlarged view a portion of a card comprising a card body 1 of plastic material in which is fixed an integrated circuit 2, for example by depressing the integrated circuit by means of a heating punch.
La carte comporte en outre également de façon connue en soi, des lignes conductrices 3 dont une seule a été représentée sur la figure, qui relient le circuit intégré 2 à des plages conductrices 4. Les pistes conductrices 3 et les plages conductrices 4 sont par exemple réalisées en polymère conducteur. The card also further comprises in a manner known per se, conductive lines 3 of which only one has been shown in the figure, which connect the integrated circuit 2 to conductive pads 4. The conductive tracks 3 and the conductive pads 4 are for example made of conductive polymer.
Selon l'invention, un cordon 5 de la matière constituant le corps de carte entourant le circuit intégré 2 est structurellement modifiée, par exemple en appliquant un produit chimique au moyen d'un tampon selon une bande délimitée par un trait mixte épais 6 sur la figure 1. Le produit chimique est de préférence un produit chimique volatile tel qu'une cétone, ou un acétate d'éthylène glycol. Lors de son application, le produit chimique diffuse dans la matière comme illustré par les flèches sur la figure 1 et forme le cordon 5 dont le contour a été délimité par un trait mixte fin 7 sur la figure 1. According to the invention, a bead 5 of the material constituting the card body surrounding the integrated circuit 2 is structurally modified, for example by applying a chemical product by means of a buffer in a strip delimited by a thick mixed line 6 on the Figure 1. The chemical is preferably a volatile chemical such as a ketone, or ethylene glycol acetate. During its application, the chemical diffuses into the material as illustrated by the arrows in FIG. 1 and forms the bead 5, the outline of which has been delimited by a thin dashed line 7 in FIG. 1.
On remarquera qu'à l'aplomb de la piste conductrice 3, le cordon 5 de matière structurellement modifiée est interrompu pour éviter de fragiliser la matière constituant le corps de carte, ce qui risquerait d'entrai- ner une rupture de la piste conductrice 3 lors de la flexion de la carte. It will be noted that at the base of the conductive track 3, the bead 5 of structurally modified material is interrupted to avoid weakening the material constituting the card body, which would risk causing the conductive track 3 to break. when bending the card.
La figure 2 illustre un autre mode de réalisation selon lequel la carte à circuit intégré comporte d'une façon conventionnelle un corps de carte 1 en matière plastique dans lequel est fraisée une cavité généralement désignée en 8 recevant un module comportant un support intermédiaire 9 portant sur l'une de ses faces des plages de contact 10 et sur la face opposée un circuit intégré 2 relié aux plages de contact 10 par des fils de liaison 11. FIG. 2 illustrates another embodiment according to which the integrated circuit card comprises in a conventional manner a card body 1 of plastic material in which is milled a cavity generally designated at 8 receiving a module comprising an intermediate support 9 bearing on one of its faces of the contact pads 10 and on the opposite face an integrated circuit 2 connected to the contact pads 10 by connecting wires 11.
Le circuit intégré 2 et les fils de liaison 11 sont noyés dans un bloc de résine 12 ayant des dimensions inférieures à celles du support intermédiaire de sorte que celui-ci s'étend au-delà de la paroi latérale du bloc de résine 12.The integrated circuit 2 and the connecting wires 11 are embedded in a resin block 12 having dimensions smaller than those of the intermediate support so that the latter extends beyond the side wall of the resin block 12.
Selon l'invention, le module ainsi formé est collé dans la cavité 2 par un filet de colle 13 comportant un produit chimique diffusant dans la matière plastique du corps de carte 1, comme illustré par les flèches sur la figure 2, et modifiant structurellement la matière plastique du corps de carte pour réaliser un affaiblissement mécanique selon un cordon 5 s'étendant à l'aplomb du filet de colle 13 et entourant le circuit intégré 2. According to the invention, the module thus formed is glued into the cavity 2 by a thread of glue 13 comprising a chemical diffusing into the plastic of the card body 1, as illustrated by the arrows in FIG. 2, and structurally modifying the plastic material of the card body to achieve a mechanical weakening along a bead 5 extending directly above the glue thread 13 and surrounding the integrated circuit 2.
Bien entendu l'invention n'est pas limitée aux modes de réalisation illustrés et on peut y apporter des variantes de réalisation sans sortir du cadre de l'invention. Of course, the invention is not limited to the illustrated embodiments and it is possible to make alternative embodiments without departing from the scope of the invention.
En particulier le cordon de matière structurellement modifiée peut présenter toute forme de contour et s'étendre selon toute position qui pourra s'avérer avantageuse compte tenu de la configuration des plages conductrices et des pistes conductrices qui les relient au circuit intégré. In particular, the bead of structurally modified material can have any shape of contour and extend in any position which could prove to be advantageous taking into account the configuration of the conductive pads and the conductive tracks which connect them to the integrated circuit.
Dans le cas d'un circuit intégré porté par un support intermédiaire comme illustré par la figure 2, on peut également prévoir de réaliser le cordon de matière structurellement modifiée à l'extérieur de la cavité 8, en particulier dans le cas où le produit chimique devant être utilisé pour obtenir la modification structurelle de la matière est incompatible avec le solvant de la colle. In the case of an integrated circuit carried by an intermediate support as illustrated in FIG. 2, it is also possible to provide for producing the bead of structurally modified material outside the cavity 8, in particular in the case where the chemical to be used to obtain the structural modification of the material is incompatible with the adhesive solvent.
Bien que l'invention ait été décrite en relation avec un procédé selon lequel un produit chimique est appliqué au moyen d'un tampon ou inclus dans un filet de colle pour assurer la modification structurelle de la matière du corps de carte, cette modification pourra être assurée par d'autres moyens, par exemple par irradiation ou par tout autre traitement physico-chimique approprié en fonction de la matière constituant le corps de carte. Although the invention has been described in relation to a method according to which a chemical is applied by means of a pad or included in a thread of glue to ensure the structural modification of the material of the card body, this modification may be provided by other means, for example by irradiation or by any other appropriate physico-chemical treatment depending on the material constituting the card body.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9603039A FR2745929B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD HAVING A DESOLIDARIZED ZONE AND METHOD FOR DESOLIDARIZING A ZONE OF AN INTEGRATED CIRCUIT CARD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR9603039A FR2745929B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD HAVING A DESOLIDARIZED ZONE AND METHOD FOR DESOLIDARIZING A ZONE OF AN INTEGRATED CIRCUIT CARD |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2745929A1 true FR2745929A1 (en) | 1997-09-12 |
| FR2745929B1 FR2745929B1 (en) | 1998-04-10 |
Family
ID=9490060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR9603039A Expired - Fee Related FR2745929B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD HAVING A DESOLIDARIZED ZONE AND METHOD FOR DESOLIDARIZING A ZONE OF AN INTEGRATED CIRCUIT CARD |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2745929B1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58210646A (en) * | 1982-06-02 | 1983-12-07 | Kyodo Printing Co Ltd | Ic chip mold product |
| FR2614451A1 (en) * | 1987-04-27 | 1988-10-28 | Mitsubishi Electric Corp | Integrated circuit card |
| FR2624999A1 (en) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Method of manufacturing smart cards |
| FR2625350A1 (en) * | 1987-12-29 | 1989-06-30 | Bull Cp8 | Card with electronic microcircuits and a method of manufacturing this card |
| EP0331316A1 (en) * | 1988-02-29 | 1989-09-06 | AT&T Corp. | Personal data card and method of constructing the same |
-
1996
- 1996-03-11 FR FR9603039A patent/FR2745929B1/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58210646A (en) * | 1982-06-02 | 1983-12-07 | Kyodo Printing Co Ltd | Ic chip mold product |
| FR2614451A1 (en) * | 1987-04-27 | 1988-10-28 | Mitsubishi Electric Corp | Integrated circuit card |
| FR2624999A1 (en) * | 1987-12-22 | 1989-06-23 | Sgs Thomson Microelectronics | Method of manufacturing smart cards |
| FR2625350A1 (en) * | 1987-12-29 | 1989-06-30 | Bull Cp8 | Card with electronic microcircuits and a method of manufacturing this card |
| EP0331316A1 (en) * | 1988-02-29 | 1989-09-06 | AT&T Corp. | Personal data card and method of constructing the same |
Non-Patent Citations (1)
| Title |
|---|
| PATENT ABSTRACTS OF JAPAN vol. 8, no. 59 (E - 232)<1496> 17 March 1984 (1984-03-17) * |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2745929B1 (en) | 1998-04-10 |
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| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |