FR2745930A1 - Integrated circuit smart card with part floating support for semiconductor - Google Patents
Integrated circuit smart card with part floating support for semiconductor Download PDFInfo
- Publication number
- FR2745930A1 FR2745930A1 FR9603040A FR9603040A FR2745930A1 FR 2745930 A1 FR2745930 A1 FR 2745930A1 FR 9603040 A FR9603040 A FR 9603040A FR 9603040 A FR9603040 A FR 9603040A FR 2745930 A1 FR2745930 A1 FR 2745930A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- groove
- card
- conductive tracks
- extending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
La présente invention concerne une carte à circuit intégré comportant au moins une rainure de désolidarisation d'une zone de la carte contenant le circuit intégré. The present invention relates to an integrated circuit card comprising at least one groove for separating an area of the card containing the integrated circuit.
On connaît des cartes de circuit intégré comportant un corps de carte dans lequel est fixé un circuit intégré relié à des plages de contact par des pistes conductrices s'étendant sur une face du corps de carte. Integrated circuit cards are known comprising a card body in which an integrated circuit is fixed connected to contact pads by conductive tracks extending on one face of the card body.
On sait que lors des manipulations de la carte celle-ci est soumise à des efforts de flexion qui tendent à provoquer l'ouverture d'une fente le long du bord du circuit intégré en raison de la discontinuité résultant du changement de matière entre le corps de carte en matière plastique et le circuit intégré dont le substrat est en silicium. L'ouverture d'une fente le long du bord du circuit intégré provoque alors la rupture des pistes conductrices qui sont à l'aplomb de ce bord et la mise hors d'usage de la carte à circuit intégré. We know that when handling the card it is subjected to bending forces which tend to cause the opening of a slot along the edge of the integrated circuit due to the discontinuity resulting from the change of material between the body of plastic card and the integrated circuit whose substrate is made of silicon. The opening of a slot along the edge of the integrated circuit then causes the breaking of the conductive tracks which are perpendicular to this edge and the disabling of the integrated circuit card.
Un des moyens permettant de pallier cet inconvénient consiste à réaliser une rainure délimitant une zone contenant le circuit intégré et assurant une désolidarisation de cette zone par rapport au reste de la carte. One of the means making it possible to overcome this drawback consists in making a groove delimiting an area containing the integrated circuit and ensuring separation of this area from the rest of the card.
Pour être efficace, la zone désolidarisée doit avoir des dimensions aussi faibles que possible afin de ne pas être elle-même soumise à des efforts de flexion qui pourraient engendrer l'ouverture d'une fente le long du bord du circuit intégré. Afin de réduire autant que possible les dimensions de la zone désolidarisée, il a été proposé de réaliser la rainure selon un cadre entourant le circuit intégré au voisinage de celui-ci, la rainure étant interrompue au niveau d'une intersection avec les pistes conductrices afin que celles-ci restent supportées par la matière formant le corps de carte. Une telle solution pose toutefois des problèmes de réalisation en raison de la très faible longueur de certains segments de rainure et du risque de rupture de la matière formant le corps de carte entre les extrémités de deux segments de rainure adjacents. To be effective, the separated zone must have dimensions as small as possible so as not to be itself subjected to bending forces which could cause the opening of a slot along the edge of the integrated circuit. In order to reduce the dimensions of the separated zone as much as possible, it has been proposed to produce the groove in a frame surrounding the integrated circuit in the vicinity thereof, the groove being interrupted at an intersection with the conductive tracks in order that these remain supported by the material forming the card body. However, such a solution poses implementation problems due to the very short length of certain groove segments and the risk of the material forming the card body breaking between the ends of two adjacent groove segments.
On rappellera à ce propos que la longueur du côté d'un circuit intégré est de l'ordre de un millimètre à un millimètre et demi et que des pistes conductrices adjacentes sont donc séparées de quelques dixièmes de millimètres seulement.It will be recalled in this connection that the length of the side of an integrated circuit is of the order of one millimeter to one and a half millimeters and that adjacent conductive tracks are therefore separated by only a few tenths of a millimeter.
Selon l'invention, on propose de réaliser au moins une rainure s'étendant entre les plages de contact et le circuit intégré et ayant des extrémités s'étendant à distance des pistes conductrices selon une direction de la rainure au voisinage des extrémités. According to the invention, it is proposed to produce at least one groove extending between the contact pads and the integrated circuit and having ends extending at a distance from the conductive tracks in a direction of the groove in the vicinity of the ends.
Ainsi, tout en restant très proche du circuit intégré, la rainure ne provoque pas d'affaiblissement notable de la carte au voisinage des pistes conductrices. Thus, while remaining very close to the integrated circuit, the groove does not cause any noticeable weakening of the card in the vicinity of the conductive tracks.
Selon une version avantageuse de l'invention, les lignes conductrices s'étendent selon une direction sensiblement parallèle à un bord du circuit intégré au voisinage de celui-ci, et la carte comporte une rainure en U ayant des côtés encadrant le circuit intégré. Il est ainsi possible de rapprocher la rainure du circuit intégré sans pour autant augmenter le risque de rupture des pistes conductrices. According to an advantageous version of the invention, the conductive lines extend in a direction substantially parallel to an edge of the integrated circuit in the vicinity thereof, and the card has a U-shaped groove having sides framing the integrated circuit. It is thus possible to bring the groove closer to the integrated circuit without increasing the risk of breaking the conductive tracks.
Selon un aspect préféré de cette version de l'invention, la carte comporte une autre rainure en U disposée entre les pistes conductrices au voisinage du circuit intégré. Les deux rainures en U se combinent ainsi pour encadrer complètement le circuit intégré sans réaliser d'intersection avec les pistes conductrices. According to a preferred aspect of this version of the invention, the card has another U-shaped groove disposed between the conductive tracks in the vicinity of the integrated circuit. The two U-shaped grooves combine to completely frame the integrated circuit without intersecting the conductive tracks.
Selon un autre aspect avantageux de l'invention, au moins une rainure comporte à ses extrémités des évasements curvilignes, de préférence de forme circulaire, ayant une largeur supérieure à celle de la rainure. On libère ainsi les contraintes qui apparaissent aux extrémités de la rainure lors d'une flexion, et l'on minimise en conséquence le risque d'apparition d'une fissure aux extrémités de la rainure. According to another advantageous aspect of the invention, at least one groove has at its ends curvilinear flares, preferably of circular shape, having a width greater than that of the groove. The stresses which appear at the ends of the groove are thus released during bending, and the risk of a crack appearing at the ends of the groove is therefore minimized.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description qui suit d'un mode de réalisation particulier non limitatif de l'invention, en relation avec la figure unique ci-jointe qui est une vue de dessus très agrandie d'une partie d'une carte comportant le circuit intégré. Other characteristics and advantages of the invention will appear on reading the following description of a particular non-limiting embodiment of the invention, in relation to the attached single figure which is a very enlarged top view of a part of a card comprising the integrated circuit.
En référence à la figure, la carte à circuit intégré selon l'invention comporte de façon connue en soi un corps de carte 1 en matière plastique, dans lequel est fixé un circuit intégré 2 relié à des plages de contact 3 par des pistes conductrices généralement désignées par 4. With reference to the figure, the integrated circuit card according to the invention comprises, in a manner known per se, a card body 1 of plastic material, in which an integrated circuit 2 is fixed connected to contact pads 3 by generally conducting tracks designated by 4.
Selon un aspect de l'invention les lignes conductrices 4 comportent une portion 5 qui s'étend selon une direction sensiblement parallèle à un bord du circuit intégré au voisinage de celui-ci.According to one aspect of the invention the conductive lines 4 comprise a portion 5 which extends in a direction substantially parallel to an edge of the integrated circuit in the vicinity thereof.
Dans le mode de réalisation particulier illustré, la carte comporte une première rainure 6 rectiligne qui s'étend entre les plages de contact 3 et le circuit intégré et dont les extrémités s'étendent à distance des pistes conductrices selon la direction de la rainure symbolisée par un trait mixte sur la figure. On notera à ce propos qu'au sens de l'invention la distance entre l'extrémité de la rainure 6 et la piste conductrice la plus proche dans la direction de la rainure est considérée comme suffisante dès l'instant où elle est supérieure à environ un millimètre. In the particular embodiment illustrated, the card has a first rectilinear groove 6 which extends between the contact pads 3 and the integrated circuit and the ends of which extend away from the conductive tracks in the direction of the groove symbolized by a dashed line in the figure. It will be noted in this regard that within the meaning of the invention the distance between the end of the groove 6 and the nearest conductive track in the direction of the groove is considered to be sufficient from the moment it is greater than approximately a millimeter.
Selon l'invention la rainure 6 comporte à ses extrémités un évasement de forme circulaire 7 ayant une largeur supérieure à celle de la rainure. I1 est également prévu une seconde rainure, généralement désignée en 8, ayant une forme générale en U, cette seconde rainure étant disposée pour encadrer le circuit intégré 2 sur trois côtés en s'étendant entre les plages de contact 3 et les tronçons 5 des pistes conductrices 4. La rainure en U 8 comporte des branches 9 qui s'étendent dans le prolongement des deux côtés parallèles 10 dans une direction opposée à ceux-ci. According to the invention the groove 6 has at its ends a flaring of circular shape 7 having a width greater than that of the groove. I1 is also provided a second groove, generally designated at 8, having a general U-shaped, this second groove being arranged to frame the integrated circuit 2 on three sides extending between the contact pads 3 and the sections 5 of the tracks conductive 4. The U-shaped groove 8 comprises branches 9 which extend in the extension of the two parallel sides 10 in a direction opposite to them.
Aux extrémités des branches 9 et des côtés 10, la rainure 8 comporte des évasements circulaires 11 ayant comme les évasements 7 une largeur supérieure à celle de la rainure.At the ends of the branches 9 and the sides 10, the groove 8 has circular flares 11 having, like the flares 7, a width greater than that of the groove.
De même que pour la rainure 6, les extrémités des côtés 10 de la rainure 8 s'étendent à distance des pistes conductrices 4 adjacentes selon une direction de la rainure 8 au voisinage de ses extrémités. As for the groove 6, the ends of the sides 10 of the groove 8 extend away from the adjacent conductive tracks 4 in a direction of the groove 8 in the vicinity of its ends.
Une troisième rainure, généralement désignée en 12 et ayant la forme générale d'un U, est disposée entre les pistes conductrices 4 au voisinage du circuit intégré. A third groove, generally designated at 12 and having the general shape of a U, is disposed between the conductive tracks 4 in the vicinity of the integrated circuit.
Cette troisième rainure comporte un côté central 13 qui s'étend parallèlement à un côté du circuit intégré 2 pour former avec la rainure 8 un cadre discontinu entourant le circuit intégré.This third groove has a central side 13 which extends parallel to one side of the integrated circuit 2 to form with the groove 8 a discontinuous frame surrounding the integrated circuit.
Bien entendu l'invention n'est pas limitée au mode de réalisation décrit et on peut y apporter des variantes de réalisation sans sortir du cadre de l'invention. Of course, the invention is not limited to the embodiment described and it is possible to make variant embodiments without departing from the scope of the invention.
En particulier, bien que l'invention ait été décrite en relation avec une carte comportant trois rainures, on pourra réaliser l'invention avec un nombre quelconque de rainures en fonction de la configuration des pistes conductrices et des lignes de flexion privilégiées de la carte lors des manipulations. In particular, although the invention has been described in relation to a card comprising three grooves, it is possible to carry out the invention with any number of grooves depending on the configuration of the conductive tracks and the preferred bending lines of the card during manipulations.
De même, la forme et la disposition des rainures pourra être modifiée. Avec une configuration de pistes conductrices 4 comme illustré, on pourra par exemple réaliser la rainure 8 sous une forme en V dont les branches s'étendront entre les plages de contact 3 et les tronçons 5 en regard des pistes conductrices 4. Likewise, the shape and arrangement of the grooves may be modified. With a configuration of conductive tracks 4 as illustrated, it is for example possible to produce the groove 8 in a V shape, the branches of which extend between the contact pads 3 and the sections 5 opposite the conductive tracks 4.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9603040A FR2745930B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD COMPRISING A ZONE DESOLIDARIZED BY A GROOVE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9603040A FR2745930B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD COMPRISING A ZONE DESOLIDARIZED BY A GROOVE |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2745930A1 true FR2745930A1 (en) | 1997-09-12 |
FR2745930B1 FR2745930B1 (en) | 1998-04-10 |
Family
ID=9490061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9603040A Expired - Fee Related FR2745930B1 (en) | 1996-03-11 | 1996-03-11 | INTEGRATED CIRCUIT CARD COMPRISING A ZONE DESOLIDARIZED BY A GROOVE |
Country Status (1)
Country | Link |
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FR (1) | FR2745930B1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1334647A1 (en) * | 2000-10-20 | 2003-08-13 | Silverbrook Research Pty. Limited | An integrated circuit carrier |
EP1410700A1 (en) * | 2000-10-20 | 2004-04-21 | Silverbrook Research Pty. Limited | Integrated circuit carrier with recesses |
EP1496728A1 (en) * | 2003-07-10 | 2005-01-12 | Delphi Technologies, Inc. | Circuit assemby having compliant substrate stuctures for mounting circuit devices |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0163880A2 (en) * | 1984-05-29 | 1985-12-11 | GAO Gesellschaft für Automation und Organisation mbH | Data carrier with integrated circuit and method of producing such a carrier |
JPS6175986A (en) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | Loading medium for integrated circuit element |
FR2595848A1 (en) * | 1986-03-17 | 1987-09-18 | Mitsubishi Electric Corp | THIN SEMICONDUCTOR CARD |
EP0311434A2 (en) * | 1987-10-09 | 1989-04-12 | The De La Rue Company Plc | Integrated circuit card |
JPH02188299A (en) * | 1989-01-18 | 1990-07-24 | Dainippon Printing Co Ltd | Ic module and ic card |
-
1996
- 1996-03-11 FR FR9603040A patent/FR2745930B1/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0163880A2 (en) * | 1984-05-29 | 1985-12-11 | GAO Gesellschaft für Automation und Organisation mbH | Data carrier with integrated circuit and method of producing such a carrier |
JPS6175986A (en) * | 1984-09-21 | 1986-04-18 | Tokyo Jiki Insatsu Kk | Loading medium for integrated circuit element |
FR2595848A1 (en) * | 1986-03-17 | 1987-09-18 | Mitsubishi Electric Corp | THIN SEMICONDUCTOR CARD |
EP0311434A2 (en) * | 1987-10-09 | 1989-04-12 | The De La Rue Company Plc | Integrated circuit card |
JPH02188299A (en) * | 1989-01-18 | 1990-07-24 | Dainippon Printing Co Ltd | Ic module and ic card |
Non-Patent Citations (2)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 010, no. 247 (P - 490) 26 August 1986 (1986-08-26) * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 469 (M - 1034) 12 October 1990 (1990-10-12) * |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1334647A1 (en) * | 2000-10-20 | 2003-08-13 | Silverbrook Research Pty. Limited | An integrated circuit carrier |
EP1410700A1 (en) * | 2000-10-20 | 2004-04-21 | Silverbrook Research Pty. Limited | Integrated circuit carrier with recesses |
EP1334647A4 (en) * | 2000-10-20 | 2006-05-03 | Silverbrook Res Pty Ltd | An integrated circuit carrier |
EP1410700A4 (en) * | 2000-10-20 | 2006-05-03 | Silverbrook Res Pty Ltd | Integrated circuit carrier with recesses |
US7187086B2 (en) | 2000-10-20 | 2007-03-06 | Silverbrook Research Pty Ltd | Integrated circuit arrangement |
US7221043B1 (en) | 2000-10-20 | 2007-05-22 | Silverbrook Research Pty Ltd | Integrated circuit carrier with recesses |
US7402896B2 (en) | 2000-10-20 | 2008-07-22 | Silverbrook Research Pty Ltd | Integrated circuit (IC) carrier assembly incorporating serpentine suspension |
US7470995B2 (en) | 2000-10-20 | 2008-12-30 | Silverbrook Research Pty Ltd | Integrated circuit (IC) carrier assembly with suspension means |
US7919872B2 (en) | 2000-10-20 | 2011-04-05 | Silverbrook Research Pty Ltd | Integrated circuit (IC) carrier assembly with first and second suspension means |
US7974102B2 (en) | 2000-10-20 | 2011-07-05 | Silverbrook Research Pty Ltd | Integrated circuit carrier assembly |
EP1496728A1 (en) * | 2003-07-10 | 2005-01-12 | Delphi Technologies, Inc. | Circuit assemby having compliant substrate stuctures for mounting circuit devices |
Also Published As
Publication number | Publication date |
---|---|
FR2745930B1 (en) | 1998-04-10 |
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