FR2741505B1 - Substrat electronique comprenant un pion d'indexation mecanique - Google Patents
Substrat electronique comprenant un pion d'indexation mecaniqueInfo
- Publication number
- FR2741505B1 FR2741505B1 FR9513724A FR9513724A FR2741505B1 FR 2741505 B1 FR2741505 B1 FR 2741505B1 FR 9513724 A FR9513724 A FR 9513724A FR 9513724 A FR9513724 A FR 9513724A FR 2741505 B1 FR2741505 B1 FR 2741505B1
- Authority
- FR
- France
- Prior art keywords
- pawn
- electronic substrate
- mechanical indexing
- indexing
- mechanical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9513724A FR2741505B1 (fr) | 1995-11-20 | 1995-11-20 | Substrat electronique comprenant un pion d'indexation mecanique |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9513724A FR2741505B1 (fr) | 1995-11-20 | 1995-11-20 | Substrat electronique comprenant un pion d'indexation mecanique |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2741505A1 FR2741505A1 (fr) | 1997-05-23 |
FR2741505B1 true FR2741505B1 (fr) | 1998-02-06 |
Family
ID=9484723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9513724A Expired - Lifetime FR2741505B1 (fr) | 1995-11-20 | 1995-11-20 | Substrat electronique comprenant un pion d'indexation mecanique |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2741505B1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108702839A (zh) * | 2015-12-18 | 2018-10-23 | 法国大陆汽车公司 | 通过铆接组装印刷电路板的控制方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE516551C2 (sv) | 1999-02-17 | 2002-01-29 | Ericsson Telefon Ab L M | Förfarande och anordning för precisionsmontering av en första apparatdel på en andra apparatdel |
SE517944C2 (sv) | 2000-04-06 | 2002-08-06 | Ericsson Telefon Ab L M | Förfarande och styrelement för fastsättning av ett mönsterkort på ett element |
JP3855879B2 (ja) * | 2002-08-07 | 2006-12-13 | 松下電器産業株式会社 | フレキシブルプリント基板の搬送用キャリアおよびフレキシブルプリント基板への電子部品実装方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY103662A (en) * | 1988-01-28 | 1993-08-28 | Emhart Ind | Method of setting up apparatus for handling electrical or electronic components |
EP0341944A3 (fr) * | 1988-05-10 | 1991-06-26 | Gec Plessey Telecommunications Limited | Méthodes et dispositifs de repérage |
JPH04338700A (ja) * | 1991-05-16 | 1992-11-25 | Toshiba Corp | 基板マーク認識装置 |
-
1995
- 1995-11-20 FR FR9513724A patent/FR2741505B1/fr not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108702839A (zh) * | 2015-12-18 | 2018-10-23 | 法国大陆汽车公司 | 通过铆接组装印刷电路板的控制方法 |
CN108702839B (zh) * | 2015-12-18 | 2021-03-23 | 法国大陆汽车公司 | 通过铆接组装印刷电路板的控制方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2741505A1 (fr) | 1997-05-23 |
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