FR2726124A1 - Boitier pour dispositif a semiconducteur - Google Patents

Boitier pour dispositif a semiconducteur Download PDF

Info

Publication number
FR2726124A1
FR2726124A1 FR9412591A FR9412591A FR2726124A1 FR 2726124 A1 FR2726124 A1 FR 2726124A1 FR 9412591 A FR9412591 A FR 9412591A FR 9412591 A FR9412591 A FR 9412591A FR 2726124 A1 FR2726124 A1 FR 2726124A1
Authority
FR
France
Prior art keywords
base
pins
semiconductor package
terminals
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR9412591A
Other languages
English (en)
French (fr)
Other versions
FR2726124B1 (OSRAM
Inventor
Jean Caillaba
Jean Francois Allier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Freescale Semiconducteurs France SAS
Original Assignee
Motorola Semiconducteurs SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Semiconducteurs SA filed Critical Motorola Semiconducteurs SA
Priority to FR9412591A priority Critical patent/FR2726124A1/fr
Priority to PCT/EP1995/004121 priority patent/WO1996012926A1/en
Priority to EP95937808A priority patent/EP0756693A1/en
Publication of FR2726124A1 publication Critical patent/FR2726124A1/fr
Application granted granted Critical
Publication of FR2726124B1 publication Critical patent/FR2726124B1/fr
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F42—AMMUNITION; BLASTING
    • F42B—EXPLOSIVE CHARGES, e.g. FOR BLASTING, FIREWORKS, AMMUNITION
    • F42B3/00—Blasting cartridges, i.e. case and explosive
    • F42B3/10—Initiators therefor
    • F42B3/12—Bridge initiators
    • F42B3/13—Bridge initiators with semiconductive bridge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Air Bags (AREA)
FR9412591A 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur Granted FR2726124A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
FR9412591A FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur
PCT/EP1995/004121 WO1996012926A1 (en) 1994-10-21 1995-10-20 Semiconductor device packages
EP95937808A EP0756693A1 (en) 1994-10-21 1995-10-20 Semiconductor device packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9412591A FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur

Publications (2)

Publication Number Publication Date
FR2726124A1 true FR2726124A1 (fr) 1996-04-26
FR2726124B1 FR2726124B1 (OSRAM) 1997-02-21

Family

ID=9468080

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9412591A Granted FR2726124A1 (fr) 1994-10-21 1994-10-21 Boitier pour dispositif a semiconducteur

Country Status (3)

Country Link
EP (1) EP0756693A1 (OSRAM)
FR (1) FR2726124A1 (OSRAM)
WO (1) WO1996012926A1 (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100396964B1 (ko) * 1997-07-09 2003-09-02 지멘스 악티엔게젤샤프트 점화기

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
DE3537820A1 (de) * 1985-10-24 1987-04-30 Dynamit Nobel Ag Elektronischer zuender
JPH02254048A (ja) * 1989-03-28 1990-10-12 Honda Motor Co Ltd 乗員保護装置の着火回路

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB960186A (en) * 1961-10-19 1964-06-10 Bendix Corp Electrically triggered squib
US3292537A (en) * 1965-06-15 1966-12-20 Jr Frank A Goss Multi-signal explosive detonator
US5029529A (en) * 1989-09-25 1991-07-09 Olin Corporation Semiconductor bridge (SCB) packaging system
EP0687354B1 (en) * 1993-02-26 1999-12-08 Quantic Industries, Inc. Improved semiconductor bridge explosive device
FR2720493B1 (fr) * 1994-05-31 1996-07-19 Giat Ind Sa Initiateur pyrotechnique.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3117179A (en) * 1959-07-24 1964-01-07 Clevite Corp Transistor capsule and header therefor
DE3537820A1 (de) * 1985-10-24 1987-04-30 Dynamit Nobel Ag Elektronischer zuender
JPH02254048A (ja) * 1989-03-28 1990-10-12 Honda Motor Co Ltd 乗員保護装置の着火回路

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 14, no. 583 (M - 1064) 26 December 1990 (1990-12-26) *

Also Published As

Publication number Publication date
EP0756693A1 (en) 1997-02-05
WO1996012926A1 (en) 1996-05-02
FR2726124B1 (OSRAM) 1997-02-21

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