FR2718319B1 - Support de circuit. - Google Patents
Support de circuit.Info
- Publication number
- FR2718319B1 FR2718319B1 FR9503723A FR9503723A FR2718319B1 FR 2718319 B1 FR2718319 B1 FR 2718319B1 FR 9503723 A FR9503723 A FR 9503723A FR 9503723 A FR9503723 A FR 9503723A FR 2718319 B1 FR2718319 B1 FR 2718319B1
- Authority
- FR
- France
- Prior art keywords
- circuit support
- circuit
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0116—Porous, e.g. foam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structure Of Printed Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Resistance Heating (AREA)
- Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
- Preparation Of Compounds By Using Micro-Organisms (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Glass Compositions (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT0068094A AT402135B (de) | 1994-03-30 | 1994-03-30 | Schaltungsträger |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2718319A1 FR2718319A1 (fr) | 1995-10-06 |
FR2718319B1 true FR2718319B1 (fr) | 1996-12-20 |
Family
ID=3496994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9503723A Expired - Fee Related FR2718319B1 (fr) | 1994-03-30 | 1995-03-29 | Support de circuit. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5819858A (fr) |
AT (1) | AT402135B (fr) |
CH (1) | CH689658A5 (fr) |
DE (1) | DE19510988A1 (fr) |
FR (1) | FR2718319B1 (fr) |
GB (1) | GB2288075B (fr) |
IT (1) | IT1280151B1 (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT404083B (de) * | 1995-04-18 | 1998-08-25 | Electrovac | Verfahren zum herstellen von gehäusen |
KR20020059163A (ko) * | 2001-01-03 | 2002-07-12 | 배정두 | 알루미늄을 이용한 무선 주파수 식별카드 제조방법 |
DE10125815C1 (de) * | 2001-05-26 | 2002-08-01 | Daimler Chrysler Ag | Metall-Keramik-Verbundwerkstoff und seine Verwendung |
US6906423B1 (en) | 2001-06-05 | 2005-06-14 | Kabushiki Kaisha Toshiba | Mask used for exposing a porous substrate |
EP1265468B1 (fr) * | 2001-06-05 | 2011-12-28 | Kabushiki Kaisha Toshiba | Procédé de fabrication d'un élément composite |
JP3869255B2 (ja) * | 2001-06-14 | 2007-01-17 | 富士通株式会社 | 金属成形体製造方法およびこれにより製造される金属成形体 |
DE10142614A1 (de) | 2001-08-31 | 2003-04-03 | Siemens Ag | Leistungselektronikeinheit |
US7141310B2 (en) * | 2002-04-17 | 2006-11-28 | Ceramics Process Systems Corporation | Metal matrix composite structure and method |
DE102005047025A1 (de) * | 2005-09-30 | 2007-04-05 | Siemens Ag | Leiterplatte |
DE102008043565A1 (de) | 2008-11-07 | 2010-05-12 | Robert Bosch Gmbh | Schaltungsträger und dessen Verwendung |
US9417013B2 (en) * | 2010-11-12 | 2016-08-16 | Toyota Motor Engineering & Manufacturing North America, Inc. | Heat transfer systems including heat conducting composite materials |
US10485091B2 (en) * | 2016-11-29 | 2019-11-19 | Nxp Usa, Inc. | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof |
US10104759B2 (en) * | 2016-11-29 | 2018-10-16 | Nxp Usa, Inc. | Microelectronic modules with sinter-bonded heat dissipation structures and methods for the fabrication thereof |
DE102017126880A1 (de) * | 2017-11-15 | 2019-05-16 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Elektrische Baueinheit mit einer Wicklung sowie Verfahren zur Herstellung einer solchen Baueinheit |
US11490511B2 (en) * | 2018-06-28 | 2022-11-01 | Kyocera Corporation | Circuit board and electronic device that includes it |
US11915997B2 (en) * | 2020-06-24 | 2024-02-27 | Micron Technology, Inc. | Thermal management of GPU-HBM package by microchannel integrated substrate |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB267172A (en) * | 1925-09-11 | 1927-03-11 | Paragon Rubber Mfg Company Ltd | Improvements in wireless and other electrical apparatus |
GB515354A (en) * | 1937-05-31 | 1939-12-04 | Philips Nv | Improvements in conductors for electric apparatus |
GB63911A (fr) * | 1943-02-02 | |||
BE562405A (fr) * | 1956-11-15 | |||
US3710196A (en) * | 1970-04-27 | 1973-01-09 | T Fifield | Circuit board and method of making circuit connections |
US3770529A (en) * | 1970-08-25 | 1973-11-06 | Ibm | Method of fabricating multilayer circuits |
US3739614A (en) * | 1971-11-26 | 1973-06-19 | Western Electric Co | Explosive metal-working process |
GB2033667A (en) * | 1978-11-06 | 1980-05-21 | Powers C D | Improvements in circuit boards |
EP0051378A2 (fr) * | 1980-11-03 | 1982-05-12 | AMP INCORPORATED (a New Jersey corporation) | Plaquette à circuit moulé et procédé de fabrication |
US4532152A (en) * | 1982-03-05 | 1985-07-30 | Elarde Vito D | Fabrication of a printed circuit board with metal-filled channels |
JPS59150453A (ja) * | 1982-12-23 | 1984-08-28 | Toshiba Corp | 半導体モジユ−ル用基板の製造方法 |
US4621761A (en) * | 1984-12-04 | 1986-11-11 | The United States Of America As Represented By The United States Department Of Energy | Process for forming unusually strong joints between metals and ceramics by brazing at temperatures that do no exceed 750 degree C. |
JPS61230343A (ja) * | 1985-04-05 | 1986-10-14 | Matsushita Electric Ind Co Ltd | 半導体素子用セラミツクパツケ−ジ |
US4806704A (en) * | 1987-06-08 | 1989-02-21 | General Electric Company | Metal matrix composite and structure using metal matrix composites for electronic applications |
US5241456A (en) * | 1990-07-02 | 1993-08-31 | General Electric Company | Compact high density interconnect structure |
EP0471552B1 (fr) * | 1990-08-14 | 1997-07-02 | Texas Instruments Incorporated | Module de transport de chaleur pour des applications à très haute densité et à empaquetage silicium sur silicium |
JPH0548000A (ja) * | 1991-08-13 | 1993-02-26 | Fujitsu Ltd | 半導体装置 |
US5506755A (en) * | 1992-03-11 | 1996-04-09 | Kabushiki Kaisha Toshiba | Multi-layer substrate |
US5258887A (en) * | 1992-06-15 | 1993-11-02 | Eaton Corporation | Electrical device cooling system using a heat sink attached to a circuit board containing heat conductive layers and channels |
-
1994
- 1994-03-30 AT AT0068094A patent/AT402135B/de not_active IP Right Cessation
-
1995
- 1995-03-20 CH CH00789/95A patent/CH689658A5/de not_active IP Right Cessation
- 1995-03-24 DE DE19510988A patent/DE19510988A1/de not_active Withdrawn
- 1995-03-29 FR FR9503723A patent/FR2718319B1/fr not_active Expired - Fee Related
- 1995-03-30 IT IT95UD000054A patent/IT1280151B1/it active IP Right Grant
- 1995-03-30 US US08/415,078 patent/US5819858A/en not_active Expired - Fee Related
- 1995-03-30 GB GB9506522A patent/GB2288075B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US5819858A (en) | 1998-10-13 |
IT1280151B1 (it) | 1998-01-05 |
ATA68094A (de) | 1996-06-15 |
GB9506522D0 (en) | 1995-05-17 |
ITUD950054A1 (it) | 1996-09-30 |
AT402135B (de) | 1997-02-25 |
DE19510988A1 (de) | 1995-10-05 |
GB2288075B (en) | 1998-07-15 |
GB2288075A (en) | 1995-10-04 |
ITUD950054A0 (it) | 1995-03-30 |
FR2718319A1 (fr) | 1995-10-06 |
CH689658A5 (de) | 1999-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |