FR2700659B1 - Method for manufacturing multilayer circuits and circuits thus obtained. - Google Patents

Method for manufacturing multilayer circuits and circuits thus obtained.

Info

Publication number
FR2700659B1
FR2700659B1 FR9300400A FR9300400A FR2700659B1 FR 2700659 B1 FR2700659 B1 FR 2700659B1 FR 9300400 A FR9300400 A FR 9300400A FR 9300400 A FR9300400 A FR 9300400A FR 2700659 B1 FR2700659 B1 FR 2700659B1
Authority
FR
France
Prior art keywords
circuits
manufacturing multilayer
manufacturing
multilayer circuits
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9300400A
Other languages
French (fr)
Other versions
FR2700659A1 (en
Inventor
Didier Samson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MATRA SEP IMAGERIE INF
Original Assignee
MATRA SEP IMAGERIE INF
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MATRA SEP IMAGERIE INF filed Critical MATRA SEP IMAGERIE INF
Priority to FR9300400A priority Critical patent/FR2700659B1/en
Publication of FR2700659A1 publication Critical patent/FR2700659A1/en
Application granted granted Critical
Publication of FR2700659B1 publication Critical patent/FR2700659B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR9300400A 1993-01-18 1993-01-18 Method for manufacturing multilayer circuits and circuits thus obtained. Expired - Fee Related FR2700659B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR9300400A FR2700659B1 (en) 1993-01-18 1993-01-18 Method for manufacturing multilayer circuits and circuits thus obtained.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9300400A FR2700659B1 (en) 1993-01-18 1993-01-18 Method for manufacturing multilayer circuits and circuits thus obtained.

Publications (2)

Publication Number Publication Date
FR2700659A1 FR2700659A1 (en) 1994-07-22
FR2700659B1 true FR2700659B1 (en) 1995-03-24

Family

ID=9443105

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9300400A Expired - Fee Related FR2700659B1 (en) 1993-01-18 1993-01-18 Method for manufacturing multilayer circuits and circuits thus obtained.

Country Status (1)

Country Link
FR (1) FR2700659B1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
JPH0640472B2 (en) * 1985-10-17 1994-05-25 伊勢電子工業株式会社 Method for manufacturing substrate for fluorescent display tube
US4808274A (en) * 1986-09-10 1989-02-28 Engelhard Corporation Metallized substrates and process for producing
DE3932017A1 (en) * 1988-10-27 1990-05-03 Bayer Ag ELECTRICALLY LEADING STRUCTURES
GB8909729D0 (en) * 1989-04-27 1990-04-25 Ici Plc Compositions
FR2666686A1 (en) * 1990-09-10 1992-03-13 Ramy Jean Pierre Method of fabricating a multi-layer hybrid circuit using organometallic compounds

Also Published As

Publication number Publication date
FR2700659A1 (en) 1994-07-22

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Legal Events

Date Code Title Description
ST Notification of lapse